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Nano-Coating Process for Si [1 0 0] Wafer Using Atmospheric Pressure Plasma Jet (APPJ)

Nano-Coating Process for Si [1 0 0] Wafer Using Atmospheric Pressure Plasma Jet (APPJ)
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摘要 Three-electrode plasma jet system consisting of a perforated dielectric tube with two outer and one floating inner electrodes was developed and employed for nano-coating processes of Si [1 0 0] wafer. Lowered gas breakdown voltage, increasing plasma density and increased discharge current were achieved by using the floating inner electrode. The low temperature (Nonthermal) Atmospheric Pressure Plasma protective coating technique using precursor-containing gases (Ar, O2 and OMCTS mixture) which injected into Plasma Jet (APPJ), there are several techniques are introduced here to avoid substrate damage including increasing plasma density without increasing the kinetic energy of the ion bombardment. Furthermore some few precautions are given here to insure good media for silicon wafer prepared for coating. Three-electrode plasma jet system consisting of a perforated dielectric tube with two outer and one floating inner electrodes was developed and employed for nano-coating processes of Si [1 0 0] wafer. Lowered gas breakdown voltage, increasing plasma density and increased discharge current were achieved by using the floating inner electrode. The low temperature (Nonthermal) Atmospheric Pressure Plasma protective coating technique using precursor-containing gases (Ar, O2 and OMCTS mixture) which injected into Plasma Jet (APPJ), there are several techniques are introduced here to avoid substrate damage including increasing plasma density without increasing the kinetic energy of the ion bombardment. Furthermore some few precautions are given here to insure good media for silicon wafer prepared for coating.
机构地区 Physics Department
出处 《Journal of Modern Physics》 2012年第9期1031-1039,共9页 现代物理(英文)
关键词 Nano-Coating Nonthermal ATMOSPHERIC Pressure Plasma JET SI [1 0 0] OMCTS Nano-Coating Nonthermal Atmospheric Pressure Plasma Jet Si [1 0 0] OMCTS
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