期刊文献+

Improvement of High Dynamic Range Capacitive Displacement Sensor by a Globalm Planarization

Improvement of High Dynamic Range Capacitive Displacement Sensor by a Globalm Planarization
下载PDF
导出
摘要 This study presents an improvement of high dynamic range contact-type capacitive displacement sensor by applying planarization. The sensor is called the contact-type linear encoder-like capacitive displacement sensor (CLECDiS), is a nano-meter-resolution sensor with a wide dynamic range. However, height differences due to patterned electrodes may cause a variety of problems or performance degradation. In devices of two glass wafer surfaces with patterned structures assembled face-to-face and in sliding contact, the heights of the patterns crucially affect their performance and practicality, so it should be planarized for reducing the problem. A number of techniques for planarizing glass wafer surfaces with patterned chrome electrodes were evaluated and the following three were selected as adequate: lift-off, etch-back, and chemical mechanical polishing (CMP). The fabricated samples showed that CMP provided the best planarization. CMP was successfully employed to produce CLECDiS with improved signal reliability due to reduced collisions between electrodes. This study presents an improvement of high dynamic range contact-type capacitive displacement sensor by applying planarization. The sensor is called the contact-type linear encoder-like capacitive displacement sensor (CLECDiS), is a nano-meter-resolution sensor with a wide dynamic range. However, height differences due to patterned electrodes may cause a variety of problems or performance degradation. In devices of two glass wafer surfaces with patterned structures assembled face-to-face and in sliding contact, the heights of the patterns crucially affect their performance and practicality, so it should be planarized for reducing the problem. A number of techniques for planarizing glass wafer surfaces with patterned chrome electrodes were evaluated and the following three were selected as adequate: lift-off, etch-back, and chemical mechanical polishing (CMP). The fabricated samples showed that CMP provided the best planarization. CMP was successfully employed to produce CLECDiS with improved signal reliability due to reduced collisions between electrodes.
机构地区 不详
出处 《Journal of Sensor Technology》 2011年第4期99-107,共9页 传感技术(英文)
关键词 High Dynamic RANGE Capacitive DISPLACEMENT SENSOR PLANARIZATION CONTACT Method High Dynamic Range Capacitive Displacement Sensor Planarization Contact Method
  • 相关文献

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部