Packaging of Distributed feedback （DFB） laser array based on reconstruction=equivalent-chirp （REC） tech- nology is a bridge from chip to system, and influences the practical process of REC chip. In this letter, DF...Packaging of Distributed feedback （DFB） laser array based on reconstruction=equivalent-chirp （REC） tech- nology is a bridge from chip to system, and influences the practical process of REC chip. In this letter, DFB laser arrays of 4 channel @1 310 nm and 8 channel @1 550 nm are packaged. Experimental results show that both 4 channel @1 310 nm and 8 channel @1 550 nm have uniform wavelength spacing and average side mode suppression ratio （SMSR）〉35 dB. When I=35 mA, we get the total output power 1 mW of 4 channel @1 310 nm, and 227 μW of 8 channel @1 550 nm, respectively. The high frequency characteristic of the packaged chips is also demonstrated, and the requirements of 4× 10 G or even 8× 10 G system can be reached, we demonstrate the practical and low cost performance of REC technology and indicates its potential application in the future fiber-to-the-home （FTTH）.展开更多
We propose and experimentally demonstrate a photonic approach to estimate the time-difference-of-arrival （TDOA） and the angle-of-arrival （AOA） of a microwave signal. TDOA and AOA are estimated from the carrier pow...We propose and experimentally demonstrate a photonic approach to estimate the time-difference-of-arrival （TDOA） and the angle-of-arrival （AOA） of a microwave signal. TDOA and AOA are estimated from the carrier power difference of the two outputs of the Mach-Zehnder modulator （MZM） using only one dual- drive 1×2 MZM. Experimentally, the TDOA of a microwave signal at 3 GHz from 27.78 to 166.67 ps is measured with maximum measurement errors of ±2.24 ps; correspondingly, the AOA from 60° to 85.2° is measured with maximum measurement errors of ±0.4°.展开更多
文摘Packaging of Distributed feedback （DFB） laser array based on reconstruction=equivalent-chirp （REC） tech- nology is a bridge from chip to system, and influences the practical process of REC chip. In this letter, DFB laser arrays of 4 channel @1 310 nm and 8 channel @1 550 nm are packaged. Experimental results show that both 4 channel @1 310 nm and 8 channel @1 550 nm have uniform wavelength spacing and average side mode suppression ratio （SMSR）〉35 dB. When I=35 mA, we get the total output power 1 mW of 4 channel @1 310 nm, and 227 μW of 8 channel @1 550 nm, respectively. The high frequency characteristic of the packaged chips is also demonstrated, and the requirements of 4× 10 G or even 8× 10 G system can be reached, we demonstrate the practical and low cost performance of REC technology and indicates its potential application in the future fiber-to-the-home （FTTH）.
基金supported by the Program for New Century Excellent Talents in University(No.NCET-11-0659)the National 111 Project of China(No.B12018)the Priority Academic Program Development of Jiangsu Higher Education Institutions
文摘We propose and experimentally demonstrate a photonic approach to estimate the time-difference-of-arrival （TDOA） and the angle-of-arrival （AOA） of a microwave signal. TDOA and AOA are estimated from the carrier power difference of the two outputs of the Mach-Zehnder modulator （MZM） using only one dual- drive 1×2 MZM. Experimentally, the TDOA of a microwave signal at 3 GHz from 27.78 to 166.67 ps is measured with maximum measurement errors of ±2.24 ps; correspondingly, the AOA from 60° to 85.2° is measured with maximum measurement errors of ±0.4°.
