目的研究变形量对690合金电化学行为的影响。方法采用动电位极化、电化学阻抗和高温高压浸泡实验,结合扫描电子显微镜(SEM)、X射线光谱仪(EDX)和X射线光电子能谱(XPS),研究不同变形量的690合金传热管在核电模拟液中的腐蚀行为。结果在...目的研究变形量对690合金电化学行为的影响。方法采用动电位极化、电化学阻抗和高温高压浸泡实验,结合扫描电子显微镜(SEM)、X射线光谱仪(EDX)和X射线光电子能谱(XPS),研究不同变形量的690合金传热管在核电模拟液中的腐蚀行为。结果在常温常压下,50%变形量试样的自腐蚀电位比25%变形量试样正140 m V,维钝电流密度显著降低,阻抗模值高出约10倍。高温高压下浸泡后,XPS分析显示,50%变形量试样表面腐蚀产物膜中的Cr2O3含量远高于25%变形量试样,其富Cr内层致密,氧化层更厚。结论 50%变形量的690合金表面形成的钝化膜及腐蚀产物膜对基体的保护作用更强。展开更多
The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid...The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias application.An ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.展开更多
文摘目的研究变形量对690合金电化学行为的影响。方法采用动电位极化、电化学阻抗和高温高压浸泡实验,结合扫描电子显微镜(SEM)、X射线光谱仪(EDX)和X射线光电子能谱(XPS),研究不同变形量的690合金传热管在核电模拟液中的腐蚀行为。结果在常温常压下,50%变形量试样的自腐蚀电位比25%变形量试样正140 m V,维钝电流密度显著降低,阻抗模值高出约10倍。高温高压下浸泡后,XPS分析显示,50%变形量试样表面腐蚀产物膜中的Cr2O3含量远高于25%变形量试样,其富Cr内层致密,氧化层更厚。结论 50%变形量的690合金表面形成的钝化膜及腐蚀产物膜对基体的保护作用更强。
基金Project(51271032)supported by the National Natural Science Foundation of China
文摘The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias application.An ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.
