为提升Ga N基高压LED芯片的出光性能,优化了芯片发光单元之间隔离沟槽的宽度。当隔离沟槽宽度为20μm时,芯片的电学性能和光学性能最优。当注入电流为20 m A时,正向电压为50.72 V,输出光功率为373.64 m W,电光转换效率为36.83%。采用镜...为提升Ga N基高压LED芯片的出光性能,优化了芯片发光单元之间隔离沟槽的宽度。当隔离沟槽宽度为20μm时,芯片的电学性能和光学性能最优。当注入电流为20 m A时,正向电压为50.72 V,输出光功率为373.64 m W,电光转换效率为36.83%。采用镜面铝基板和陶瓷基板进行了4颗芯片串联形式的COB封装。镜面铝基板的热导率和反射率均高于陶瓷基板,可提升HV-LED器件在大注入电流和高温时的发光性能。当注入电流为20 m A且基板温度为20℃时,镜面铝基板封装的HV-LED器件的正向电压是198.9 V,发光效率达122.2 lm/W。展开更多
High-voltage light-emitting diodes （HV-LED） with backside reflector, including Ti305/SiO2 distributed Bragg reflector （DBR） or hybrid reflector combining DBR and Al or Ag metal layer, are investigated using Monte ...High-voltage light-emitting diodes （HV-LED） with backside reflector, including Ti305/SiO2 distributed Bragg reflector （DBR） or hybrid reflector combining DBR and Al or Ag metal layer, are investigated using Monte Carlo ray tracing method. The hybrid reflector leads to more enhancement of light-extraction efficiency （LEE）. Moreover, the LEE can also be improved by redesigning the thicknesses of DBR. HV-LED with four redesigned DBR pairs （4-MDBR）, and those with a hybrid reflector combining 4-MDBR and Al metal layer （4-MDBR-Al）, are fabricated. Compared to 4-MDBR, the enhancement of light-output power induced by 4-MDBR-A1 is 4.6%, which is consistent with the simulated value of 4.9%.展开更多
文摘为提升Ga N基高压LED芯片的出光性能,优化了芯片发光单元之间隔离沟槽的宽度。当隔离沟槽宽度为20μm时,芯片的电学性能和光学性能最优。当注入电流为20 m A时,正向电压为50.72 V,输出光功率为373.64 m W,电光转换效率为36.83%。采用镜面铝基板和陶瓷基板进行了4颗芯片串联形式的COB封装。镜面铝基板的热导率和反射率均高于陶瓷基板,可提升HV-LED器件在大注入电流和高温时的发光性能。当注入电流为20 m A且基板温度为20℃时,镜面铝基板封装的HV-LED器件的正向电压是198.9 V,发光效率达122.2 lm/W。
基金supported by the Strategic Emerging Industry Special funds of Guangdong Province,China(Nos.2010A081002009,2011A081301004,2012A080302003)the Key Technologies R&D Program of Guangzhou City,China(No.2011Y5-00006)the Fundamental Research Funds for the Central Universities,China(Nos.2013ZM093,2013ZP0017)
文摘High-voltage light-emitting diodes （HV-LED） with backside reflector, including Ti305/SiO2 distributed Bragg reflector （DBR） or hybrid reflector combining DBR and Al or Ag metal layer, are investigated using Monte Carlo ray tracing method. The hybrid reflector leads to more enhancement of light-extraction efficiency （LEE）. Moreover, the LEE can also be improved by redesigning the thicknesses of DBR. HV-LED with four redesigned DBR pairs （4-MDBR）, and those with a hybrid reflector combining 4-MDBR and Al metal layer （4-MDBR-Al）, are fabricated. Compared to 4-MDBR, the enhancement of light-output power induced by 4-MDBR-A1 is 4.6%, which is consistent with the simulated value of 4.9%.
