We discuss the BSIM-CMG compact model for SPICE simulations of any common multi-gate(CMG)device.This is an industry standard model which has been used extensively for FinFETs IC design and simulation,and has now been ...We discuss the BSIM-CMG compact model for SPICE simulations of any common multi-gate(CMG)device.This is an industry standard model which has been used extensively for FinFETs IC design and simulation,and has now been extended to accurately model gate-allaround FET(GAAFET).We present the core framework of BSIM-CMG and discuss the latest updates that capture various physical phenomena originating from the quantum confinement of electrons by the small cross section of the GAAFET channel.Special attention is paid to providing suitable model parameters that can be adjusted using software tools to match the model with manufactured transistors very accurately.Furthermore,the model’s speed allows the use of Monte Carlo circuit simulation to account for random device variations encountered in manufacturing.This model is the industry standard compact model for GAAFETs and will help bridge the wide divide between GAA IC manufacturing and design,starting at 3nm/2nm technologies.展开更多
文摘We discuss the BSIM-CMG compact model for SPICE simulations of any common multi-gate(CMG)device.This is an industry standard model which has been used extensively for FinFETs IC design and simulation,and has now been extended to accurately model gate-allaround FET(GAAFET).We present the core framework of BSIM-CMG and discuss the latest updates that capture various physical phenomena originating from the quantum confinement of electrons by the small cross section of the GAAFET channel.Special attention is paid to providing suitable model parameters that can be adjusted using software tools to match the model with manufactured transistors very accurately.Furthermore,the model’s speed allows the use of Monte Carlo circuit simulation to account for random device variations encountered in manufacturing.This model is the industry standard compact model for GAAFETs and will help bridge the wide divide between GAA IC manufacturing and design,starting at 3nm/2nm technologies.
