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Influence of heat treatment on microstructure,mechanical and corrosion behavior of WE43 alloy fabricated by laser-beam powder bed fusion 被引量:5
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作者 Chenrong Ling Qiang Li +6 位作者 Zhe Zhang Youwen Yang Wenhao Zhou Wenlong Chen Zhi Dong chunrong pan Cijun Shuai 《International Journal of Extreme Manufacturing》 SCIE EI CAS CSCD 2024年第1期258-275,共18页
Magnesium(Mg)alloys are considered to be a new generation of revolutionary medical metals.Laser-beam powder bed fusion(PBF-LB)is suitable for fabricating metal implants withpersonalized and complicated structures.Howe... Magnesium(Mg)alloys are considered to be a new generation of revolutionary medical metals.Laser-beam powder bed fusion(PBF-LB)is suitable for fabricating metal implants withpersonalized and complicated structures.However,the as-built part usually exhibits undesirable microstructure and unsatisfactory performance.In this work,WE43 parts were firstly fabricated by PBF-LB and then subjected to heat treatment.Although a high densification rate of 99.91%was achieved using suitable processes,the as-built parts exhibited anisotropic and layeredmicrostructure with heterogeneously precipitated Nd-rich intermetallic.After heat treatment,fine and nano-scaled Mg24Y5particles were precipitated.Meanwhile,theα-Mg grainsunderwent recrystallization and turned coarsened slightly,which effectively weakened thetexture intensity and reduced the anisotropy.As a consequence,the yield strength and ultimate tensile strength were significantly improved to(250.2±3.5)MPa and(312±3.7)MPa,respectively,while the elongation was still maintained at a high level of 15.2%.Furthermore,the homogenized microstructure reduced the tendency of localized corrosion and favoredthe development of uniform passivation film.Thus,the degradation rate of WE43 parts was decreased by an order of magnitude.Besides,in-vitro cell experiments proved their favorable biocompatibility. 展开更多
关键词 laser-beam powder bed fusion WE43 alloys heat treatment mechanical performance biodegradation behavior
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Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints 被引量:3
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作者 Jipeng Wang Hesuan Hu +2 位作者 chunrong pan Yuan Zhou Liang Li 《IEEE/CAA Journal of Automatica Sinica》 SCIE EI CSCD 2020年第3期776-789,共14页
Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual... Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools with single-wafer-type fabrication. Concurrent processing multiple wafer types in cluster tools, as a novel production pattern, has drawn increasing attention from industry to academia, whereas the corresponding research remains insufficient. This paper investigates the scheduling problems of dual-arm cluster tools with multiple wafer types and residency time constraints. To pursue an easy-to-implement cyclic operation under diverse flow patterns,we develop a novel robot activity strategy called multiplex swap sequence. In the light of the virtual module technology, the workloads that stem from bottleneck process steps and asymmetrical process configuration are balanced satisfactorily. Moreover, several sufficient and necessary conditions with closed-form expressions are obtained for checking the system's schedulability. Finally, efficient algorithms with polynomial complexity are developed to find the periodic scheduling, and its practicability and availability are demonstrated by the offered illustrative examples. 展开更多
关键词 Cluster tools MULTIPLE WAFER TYPES SCHEDULING SEMICONDUCTOR manufacturing WAFER fabrication
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