In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines r...In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.展开更多
Biodegradable Mg-Zn alloy was synthesized using mechanical alloying where a statistical model was developed using fractional factorial design to predict elastic modulus and mass loss of the bulk alloy.The effects of m...Biodegradable Mg-Zn alloy was synthesized using mechanical alloying where a statistical model was developed using fractional factorial design to predict elastic modulus and mass loss of the bulk alloy.The effects of mechanical alloying parameters(i.e.,milling time,milling speed,ball-to-powder mass ratio and Zn content)and their interactions were investigated involving 4 numerical factors with 2 replicates,thus 16 runs of two-level fractional factorial design.Results of analysis of variance(ANOVA),regression analysis and R2 test indicated good accuracy of the model.The statistical model determined that the elastic modulus of biodegradable Mg-Zn alloy was between 40.18 and 47.88 GPa,which was improved and resembled that of natural bone(30-57 GPa).Corrosion resistance(mass loss of pure Mg,33.74 mg)was enhanced with addition of 3%-10%Zn(between 9.32 and 15.38 mg).The most significant independent variable was Zn content,and only the interaction of milling time and ball-to-powder mass ratio was significant as P-value was less than 0.05.Interestingly,mechanical properties(represented by elastic modulus)and corrosion resistance(represented by mass loss)of biodegradable Mg-Zn alloy can be statistically predicted according to the developed models.展开更多
As electronic devices continue to become lighter and thinner,they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging.Pb-free solders incorporated with nano-sized particles...As electronic devices continue to become lighter and thinner,they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging.Pb-free solders incorporated with nano-sized particles have been identified as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders.The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu(SAC305)solder alloy.In this study,three different solder alloys were prepared by reflow soldering.Sn-3.0Ag-0.5Cu(SAC 305)solder alloys were doped with different percentage of NiO(nickel oxide)nanoparticles content;i.e.0.01 wt%,0.05 wt%,and 0.15 wt%in producing nanocomposite solder paste.Morphology refinement of SAC305-NiO nanocomposite solder contributed to the enhancement of mechanical properties in the field of microelectronic industries.ECM(electrochemical migration)of SAC-NiO nanocomposites solder pastes was measured using a WDT(water drop test).Effects of electrochemical migration of its surface morphology were investigated using OM(optical microscopy).展开更多
基金fully supported by a Tabung Amanah Pusat Pengurusan Penyelidikan dan Inovasi (PPPI) grant (UPNM/2023/GPPP/SG/1)Universiti Pertahanan Nasional Malaysia (UPNM) for funding this study。
文摘In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.
基金supported by the Universiti Sains Malaysia RU-PRGS (No. 8046026)Universiti Sains Malaysia FRGS by Ministry of High Education, Malaysia (No. 6071304)
文摘Biodegradable Mg-Zn alloy was synthesized using mechanical alloying where a statistical model was developed using fractional factorial design to predict elastic modulus and mass loss of the bulk alloy.The effects of mechanical alloying parameters(i.e.,milling time,milling speed,ball-to-powder mass ratio and Zn content)and their interactions were investigated involving 4 numerical factors with 2 replicates,thus 16 runs of two-level fractional factorial design.Results of analysis of variance(ANOVA),regression analysis and R2 test indicated good accuracy of the model.The statistical model determined that the elastic modulus of biodegradable Mg-Zn alloy was between 40.18 and 47.88 GPa,which was improved and resembled that of natural bone(30-57 GPa).Corrosion resistance(mass loss of pure Mg,33.74 mg)was enhanced with addition of 3%-10%Zn(between 9.32 and 15.38 mg).The most significant independent variable was Zn content,and only the interaction of milling time and ball-to-powder mass ratio was significant as P-value was less than 0.05.Interestingly,mechanical properties(represented by elastic modulus)and corrosion resistance(represented by mass loss)of biodegradable Mg-Zn alloy can be statistically predicted according to the developed models.
文摘As electronic devices continue to become lighter and thinner,they require much smaller solder joints and fine-pitch interconnections for microelectronic packaging.Pb-free solders incorporated with nano-sized particles have been identified as potential Pb-free nanocomposite solders that could provide higher microstructure stability and better mechanical properties than the conventional solders.The present study investigates the effects of NiO addition on the mechanical properties and microstructure of the Sn-3.0Ag-0.5Cu(SAC305)solder alloy.In this study,three different solder alloys were prepared by reflow soldering.Sn-3.0Ag-0.5Cu(SAC 305)solder alloys were doped with different percentage of NiO(nickel oxide)nanoparticles content;i.e.0.01 wt%,0.05 wt%,and 0.15 wt%in producing nanocomposite solder paste.Morphology refinement of SAC305-NiO nanocomposite solder contributed to the enhancement of mechanical properties in the field of microelectronic industries.ECM(electrochemical migration)of SAC-NiO nanocomposites solder pastes was measured using a WDT(water drop test).Effects of electrochemical migration of its surface morphology were investigated using OM(optical microscopy).
