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Adhesive strength of CVD diamond thin films quantitatively measured by means of the bulge and blister test
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作者 Daohui Xiang Ming Chen +1 位作者 Yuping Ma fanghong sun 《Journal of University of Science and Technology Beijing》 CSCD 2008年第4期474-479,共6页
Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition (CVD) diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitati... Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition (CVD) diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitative evaluation of the adhesive strength. The blister test is a potentially powerful tool for characterizing the mechanical properties of diamond films. In this test, pressure was applied on a thin membrane and the out-of-plane deflection of the membrane center was measured. The Young's modulus, residual stress, and adhesive strength were simultaneously determined using the load-deflection behavior of a membrane. The free-standing window sample of diamond thin films was fabricated by means of photolithography and anisotropic wet etching. The research indicates that the adhesive strength of diamond thin films is 4.28±0.37 J/m^2. This method uses a simple apparatus, and the fabrication of samples is very easy. 展开更多
关键词 diamond thin films adhesive strength chemical vapor deposition (CVD) elastic modulus
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