Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study,thr...Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study,through glass vias(TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed.Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.展开更多
基金Projected supported by the National Natural Science Foundation of China(Nos.61771268,61571248,U1709218)the Science and Technology Fund of Zhejiang Province(No.2015C31090)+1 种基金the Natural Science Foundation of Zhejiang(No.LY17F040002)the K.C.Wong Magna Fund in Ningbo University
文摘Due to its low electrical loss and low process cost, a glass interposer has been developed to provide a compelling alternative to the silicon-based interposer for packaging of future 2-D and 3-D ICs. In this study,through glass vias(TGVs) are used to implement 3-D inductors for minimal footprint and large quality factor. Using the inductors and parallel plate capacitors, a compact 3-D Wilkinson power divider is designed and analyzed.Compared with some reported power dividers, the proposed TGV-based circuit has an ultra-compact size and excellent electrical performance.
