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Study of brain morphology change in Alzheimer’s disease and amnestic mild cognitive impairment compared with normal controls 被引量:4
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作者 huanqing yang Hua Xu +10 位作者 Qingfeng Li Yan Jin Weixiong Jiang Jinghua Wang Yina Wu Wei Li Cece yang Xia Li Shifu Xiao Feng Shi Tao Wang 《General Psychiatry》 CSCD 2019年第2期75-83,共9页
Background With an aggravated social ageing level, the number of patients with Alzheimer's disease (AD) is gradually increasing, and mild cognitive impairment (MCI) is considered to be an early form of Alzheimer&#... Background With an aggravated social ageing level, the number of patients with Alzheimer's disease (AD) is gradually increasing, and mild cognitive impairment (MCI) is considered to be an early form of Alzheimer's disease. How to distinguish diseases in the early stage for the purposes of early diagnosis and treatment is an important topic. Aims The purpose of our study was to investigate the differences in brain cortical thickness and surface area among elderly patients with AD, elderly patients with amnestic MCI (aMCI) and normal controls (NC). Methods 20 AD patients, 21 aMCIs and 25 NC were recruited in the study. FreeSurfer software was used to calculate cortical thickness and surface area among groups. Results The patients with AD had less cortical thickness both in the left and right hemisphere in 17 of the 36 brain regions examined than the patients with aMCI or NC. The patients with AD also had smaller cerebral surface area both in the left and right hemisphere in 3 of the 36 brain regions examined than the patients with aMCI or NC. Compared with the NC, the patients with aMCI only had slight atrophy in the inferior parietal lobe of the left hemisphere, and no significant difference was found. Conclusion AD, as well as aMCI (to a lesser extent), is associated with reduced cortical thickness and surface area in a few brain regions associated with cognitive impairment. These results suggest that cortical thickness and surface area could be used for early detection of AD. 展开更多
关键词 brain morphology CHANGE amnestic MILD COGNITIVE IMPAIRMENT compared aMCI NC
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Interfacial characteristics and mechanical properties of additive manufacturing martensite stainless steel on the Cu-Cr alloy substrate by directed energy deposition 被引量:2
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作者 Wenqi Zhang Hailong Liao +5 位作者 Zhiheng Hu Shasha Zhang Baijin Chen huanqing yang Yun Wang Haihong Zhu 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2021年第31期121-132,共12页
Copper/steel is a typical bimetal functional material,combining the excellent electrical and thermal conductivity of copper alloy and the high strength and hardness of stainless steel.There has been recent interest in... Copper/steel is a typical bimetal functional material,combining the excellent electrical and thermal conductivity of copper alloy and the high strength and hardness of stainless steel.There has been recent interest in manufacturing copper/steel bimetal by directed energy deposition(DED)due to its layer-bylayer method.However,cracks tend to form on the copper/steel interface because of the great difference in thermal expansion coefficient and crystal structure between copper and steel.In this work,interfacial characteristics and mechanical properties of the copper/steel bimetal were studied from one layer to multilayers.The laser power has a great influence on the Cu element distribution of the molten pool,affecting the crack formation dramatically on the solidification stage.Cracks tend to form along columnar grain boundaries because of the Cu-rich liquid films and spherical particles in the cracks.Crack-free and good metallurgical bonding copper/steel interface is formed at a scanning velocity of 800 mm/min and the laser power of 3000 W.The ultimate tensile strength(UTS)and the break elongation(EL)of the vertically combined crack-free copper/steel bimetal are 238.2±4.4 MPa and 20.6±0.7%,respectively.The fracture occurs on the copper side instead of the copper/steel interface,indicating that the bonding strength is higher than that of the Cu-Cr alloy.The UTS of the horizontally combined crack-free copper/steel bimetal is 746.7±22.6 MPa,which is 200%higher than that of the Cu-Cr alloy substrate.The microhardness is 398.6±5.4 HV at the steel side and is 235.3±64.1 HV at the interface,which is400%higher than that of the Cu-Cr alloy substrate.This paper advances the understanding of the interfacial characteristics of heterogeneous materials and provides guidance and reference for the fabrication of multi-material components by DED. 展开更多
关键词 Directed energy deposition Additive manufacturing BIMETAL Interfacial characteristics CRACK
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