An efficient computational approach based on substructure methodology is proposed to analyze the viaduct-pile foundation-soil dynamic interaction under train loads.Thetrain-viaductsubsystemissolvedusingthe dynamic sti...An efficient computational approach based on substructure methodology is proposed to analyze the viaduct-pile foundation-soil dynamic interaction under train loads.Thetrain-viaductsubsystemissolvedusingthe dynamic stiffness integration method,and its accuracy is verified by the existing analytical solution for a moving vehicle on a simply supported beam.For the pile foundation-soil subsystem,the geometric and material properties of piles and soils are assumed to be invariable along the azimuth direction.By introducing the equivalent stiffness of grouped piles,the governing equations of pile foundation-soil interaction are simplified based on Fourier decomposition method,so the three-dimensional problem is decomposedintoseveraltwo-dimensionalaxisymmetricfinite element models.The pile foundation-soil interaction model is verified by field measurements due to shaker loading at pile foundation top.In addition,these two substructures are coupled with the displacement compatibility condition at interface of pier bottom and pile foundation top.Finally,the proposed train-viaduct-pile foundation-soil interaction model was validated by field tests.The results show that the proposed model can predict vibrations of pile foundation and soil accurately,thereby providing a basis for the prediction of pile-soil foundation settlement.The frequency spectra of the vibration in Beijing-Tianjin high-speed railway demonstrated that the main frequencies of the pier top and ground surface are below 100 and 30 Hz,respectively.展开更多
The rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices.Nevertheless,despite this vast potential,the reliability of these innovative ...The rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices.Nevertheless,despite this vast potential,the reliability of these innovative devices currently falls short,especially in light of demanding operation environment and the intrinsic challenges associated with their fabrication techniques.The heterogeneity in these processes and environments gives rise to unique failure modes throughout the devices'lifespan.To significantly enhance the reliability of these devices and assure long-term performance,it is paramount to comprehend the underpinning failure mechanisms thoroughly,thereby,enabling,optimal design solutions.A myriad of investigative efforts have been dedicated to unravel these failure mechanisms,utilizing a spectrum of tools from analytical models,numerical methods,to advanced characterization methods.This review delves into the root causes of device failure,scrutinizing both the fabrication process and the operation environment.Next,We subsequently address the failure mechanisms across four commonly observed modes:strength failure,fatigue failure,interfacial failure,and electrical failure,followed by an overview of targeted characterization methods associated with each mechanism.Concluding with an outlook,we spotlight ongoing challenges and promising directions for future research in our pursuit of highly resilient flexible electronic devices.展开更多
基金supported by the National Natural Science Foundation of China(Nos.52125803,51988101 and 52008369)。
文摘An efficient computational approach based on substructure methodology is proposed to analyze the viaduct-pile foundation-soil dynamic interaction under train loads.Thetrain-viaductsubsystemissolvedusingthe dynamic stiffness integration method,and its accuracy is verified by the existing analytical solution for a moving vehicle on a simply supported beam.For the pile foundation-soil subsystem,the geometric and material properties of piles and soils are assumed to be invariable along the azimuth direction.By introducing the equivalent stiffness of grouped piles,the governing equations of pile foundation-soil interaction are simplified based on Fourier decomposition method,so the three-dimensional problem is decomposedintoseveraltwo-dimensionalaxisymmetricfinite element models.The pile foundation-soil interaction model is verified by field measurements due to shaker loading at pile foundation top.In addition,these two substructures are coupled with the displacement compatibility condition at interface of pier bottom and pile foundation top.Finally,the proposed train-viaduct-pile foundation-soil interaction model was validated by field tests.The results show that the proposed model can predict vibrations of pile foundation and soil accurately,thereby providing a basis for the prediction of pile-soil foundation settlement.The frequency spectra of the vibration in Beijing-Tianjin high-speed railway demonstrated that the main frequencies of the pier top and ground surface are below 100 and 30 Hz,respectively.
基金support by the National Natural Science Foundation of China(NSFC)[Grant No.11972325,12272342,12202398]the Natural Science Foundation of Zhejiang Province(LGF20A020001).
文摘The rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices.Nevertheless,despite this vast potential,the reliability of these innovative devices currently falls short,especially in light of demanding operation environment and the intrinsic challenges associated with their fabrication techniques.The heterogeneity in these processes and environments gives rise to unique failure modes throughout the devices'lifespan.To significantly enhance the reliability of these devices and assure long-term performance,it is paramount to comprehend the underpinning failure mechanisms thoroughly,thereby,enabling,optimal design solutions.A myriad of investigative efforts have been dedicated to unravel these failure mechanisms,utilizing a spectrum of tools from analytical models,numerical methods,to advanced characterization methods.This review delves into the root causes of device failure,scrutinizing both the fabrication process and the operation environment.Next,We subsequently address the failure mechanisms across four commonly observed modes:strength failure,fatigue failure,interfacial failure,and electrical failure,followed by an overview of targeted characterization methods associated with each mechanism.Concluding with an outlook,we spotlight ongoing challenges and promising directions for future research in our pursuit of highly resilient flexible electronic devices.
