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Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test 被引量:4
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作者 Chen Chuantong Zhang Hao +2 位作者 jiu jinting Long Xu Suganuma Katsuaki 《China Welding》 CAS 2022年第1期15-21,共7页
The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal ... The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature. 展开更多
关键词 power module high-temperature reliability Ag sinter joining low stress structure thermal shock test
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