Automated operation and artificial intelligence technology have become essential for ensuring the safety, efficiency, and punctuality of railways, with applications such as ATO (Automatic Train Operation). In this stu...Automated operation and artificial intelligence technology have become essential for ensuring the safety, efficiency, and punctuality of railways, with applications such as ATO (Automatic Train Operation). In this study, the authors propose a method to efficiently simulate the kinematic characteristics of railroad vehicles depending on their speed zone. They utilized the function overloading function supported by a programming language and applied the fourth-order Lunge-Kutta method for dynamic simulation. By constructing an object model, the authors calculated vehicle characteristics and TPS and compared them with actual values, verifying that the developed model represents the real-life vehicle characteristics accurately. The study highlights potential improvements in automated driving and energy consumption optimization in the railway industry.展开更多
This paper,the kinetic equation,traction force,and braking force for railway trains are reviewed.In addition,the driving characteristics are interpreted as to how the power of the electric vehicle relates to the weigh...This paper,the kinetic equation,traction force,and braking force for railway trains are reviewed.In addition,the driving characteristics are interpreted as to how the power of the electric vehicle relates to the weight,speed,track curve,and track gradient of the electric vehicle.The driving characteristics of these trains are analyzed through PSCAD/EMTDC(power systems computer aided design/electromagnetic transients including DC)modeling.展开更多
Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires...Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires advanced packages to meet demands for performance,size,and high-speed transmission.To respond to these demands,integration approaches such as 3D IC chip stacking,package on package(PoP),2.5D interposer integration,system-in-package(SiP),and fan-out packaging technologies have emerged[6,8,11,12].Therefore,the package substrate for high-performance device will require low transmission loss and the small package warpage.Low loss materials have limitation of seed layer formation with electroless Cu plating.Also,heat treatment has major impact on substrate warpage in order for growth of plated Cu metal and curing for epoxy mold compound(EMC)process.In this paper,we believe it is possible to create a seed layer on the low-loss material by combining electroless Cu plating and flash lamp annealing(FLA)method instead of sputtering process.In terms of warpage control and metal growth,the flash lamp treatment,not the conventional convection or hot plate type heat treatment,could improve electro-migration between metal line and line through improving large number of(111)slip directions.In addition,flash lamp not only provides alternative to conventional heat treatment process but also significantly reduces substrate warpage.Through result of this study,by using FLA method for advanced package,it is possible to provide solutions in improving adhesion strength between dielectric materials and deposited metal film,and to reduce the warpage of the substrate.展开更多
In this paper,a new type of automatic transmitter(AT)is proposed to properly adjust the voltage of the train without installing additional equipment.The proposed tap-changing AT is expected to raise the voltage betwee...In this paper,a new type of automatic transmitter(AT)is proposed to properly adjust the voltage of the train without installing additional equipment.The proposed tap-changing AT is expected to raise the voltage between catenary and rail by regulating the turn-ratio between primary and secondary winding according to catenary voltage and verified its effects through the multi ports network analysis technique modeling of it.Through the simulation and analysis of the electric railway systems,it is shown that it can secure the load capacity and solve the large voltage drop problem by raising the voltage across railway vehicles back to the normal voltage level.展开更多
文摘Automated operation and artificial intelligence technology have become essential for ensuring the safety, efficiency, and punctuality of railways, with applications such as ATO (Automatic Train Operation). In this study, the authors propose a method to efficiently simulate the kinematic characteristics of railroad vehicles depending on their speed zone. They utilized the function overloading function supported by a programming language and applied the fourth-order Lunge-Kutta method for dynamic simulation. By constructing an object model, the authors calculated vehicle characteristics and TPS and compared them with actual values, verifying that the developed model represents the real-life vehicle characteristics accurately. The study highlights potential improvements in automated driving and energy consumption optimization in the railway industry.
基金supported by the Korea Institute of Energy Technology Evaluation and Planning(KETEP)and the Ministry of Trade,Industry&Energy(MOTIE)of the Republic of Korea(No.20225500000110).
文摘This paper,the kinetic equation,traction force,and braking force for railway trains are reviewed.In addition,the driving characteristics are interpreted as to how the power of the electric vehicle relates to the weight,speed,track curve,and track gradient of the electric vehicle.The driving characteristics of these trains are analyzed through PSCAD/EMTDC(power systems computer aided design/electromagnetic transients including DC)modeling.
文摘Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires advanced packages to meet demands for performance,size,and high-speed transmission.To respond to these demands,integration approaches such as 3D IC chip stacking,package on package(PoP),2.5D interposer integration,system-in-package(SiP),and fan-out packaging technologies have emerged[6,8,11,12].Therefore,the package substrate for high-performance device will require low transmission loss and the small package warpage.Low loss materials have limitation of seed layer formation with electroless Cu plating.Also,heat treatment has major impact on substrate warpage in order for growth of plated Cu metal and curing for epoxy mold compound(EMC)process.In this paper,we believe it is possible to create a seed layer on the low-loss material by combining electroless Cu plating and flash lamp annealing(FLA)method instead of sputtering process.In terms of warpage control and metal growth,the flash lamp treatment,not the conventional convection or hot plate type heat treatment,could improve electro-migration between metal line and line through improving large number of(111)slip directions.In addition,flash lamp not only provides alternative to conventional heat treatment process but also significantly reduces substrate warpage.Through result of this study,by using FLA method for advanced package,it is possible to provide solutions in improving adhesion strength between dielectric materials and deposited metal film,and to reduce the warpage of the substrate.
基金KETEP(Korea Institute of Energy Technology Evaluation and Planning)grant funded by the Korea government(MOTIE)(No.20191210301890)。
文摘In this paper,a new type of automatic transmitter(AT)is proposed to properly adjust the voltage of the train without installing additional equipment.The proposed tap-changing AT is expected to raise the voltage between catenary and rail by regulating the turn-ratio between primary and secondary winding according to catenary voltage and verified its effects through the multi ports network analysis technique modeling of it.Through the simulation and analysis of the electric railway systems,it is shown that it can secure the load capacity and solve the large voltage drop problem by raising the voltage across railway vehicles back to the normal voltage level.
