A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency ide...A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process.展开更多
基金supported by the Ministry of Commerce, Industry and Energy (MOCIE) of Korea (10031777)
文摘A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(RFID) inlay. The optimization condition for flip-chip bonding was determined from the behavior of bonding strength. Under the optimized condition, the shear strength for the antenna printed with paste-type Ag ink was larger than that for Cu antenna. Furthermore, an identification distance was varied from the antenna materials. Comparing with the Ag antenna pattern, the as-bonded die on Cu antenna showed a larger distance of identification. However, the long-term reliability of inlay using the Cu antenna was decreased significantly as a function of aging time at room temperature because of the bended shape of Cu antenna formed during the flip-chip bonding process.
