Sustainable energy sources are an immediate need to cope with the imminent issue of climate change the world is facing today.In particular,the long-lasting miniatured power sources that can supply energy continually t...Sustainable energy sources are an immediate need to cope with the imminent issue of climate change the world is facing today.In particular,the long-lasting miniatured power sources that can supply energy continually to power handheld gadgets,sensors,electronic devices,unmanned airborne vehicles in space and extreme mining are some of the examples where this is an acute need.It is known from basic physics that radioactive materials decay over few years and some nuclear materials have their half-life until thousands of years.The past five decades of research have been spent harnessing the decay energy of the radioactive materials to develop batteries that can last until the radioactive reaction continues.Thus,an emergent opportunity of industrial symbiosis to make use of nuclear waste by using radioactive waste as raw material to develop bat-teries with long shelf life presents a great opportunity for sustainable energy resource development.However,the current canon of research on this topic is scarce.This perspective draws fresh discussions on the topic while highlighting future directions in this wealthy arena of research.Graphical abstract A long-lasting miniaturised nuclear battery utilising 14C radioactive isotope as fuel.展开更多
This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)method.The hybrid micromachining methods usually require additional ...This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)method.The hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical vibration.The SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining mode.This paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial directions.Complementary 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined wafer.It was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting parameters.The observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all cases.FEA was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining performance.The information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels.展开更多
Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial ...Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.展开更多
This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch experiments.This work considere...This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch experiments.This work considered gallium arsenide,an importantⅢ-Ⅴdirect bandgap semiconductor material residing in the zincblende structure,as a reference sample material due to its growing usage in 5G communication devices.In the simulations,the scratch depth was tested as a variable in the fine range of 0.5-3 nm to understand the behavior of material removal and to gain insights into the nanoscale friction.Scratch force,normal force,and average cutting forces were extracted from the simulation to obtain two scalar quantities,namely,the scratch cutting energy(defined as the work performed to remove a unit volume of material)and the kinetic coefficient of friction(defined as the force ratio).A strong size effect was observed for scratch depths below 2 nm from the MD simulations and about 15 nm from the AFM experiments.A strong quantitative corroboration was obtained between the specific scratch energy determined by the MD simulations and the AFM experiments,and more qualitative corroboration was derived for the pile-up and the kinetic coefficient of friction.This conclusion suggests that the specific scratch energy is insensitive to the tool geometry and the scratch speed used in this investigation.However,the pile-up and kinetic coefficient of friction are dependent on the geometry of the tool tip.展开更多
基金support provided by the UKRI via Grants No.EP/S036180/1 and EP/T024607/1feasibility study awards to LSBU from the UKRI National Interdisciplinary Circular Economy Hub (EP/V029746/1)+2 种基金Transforming the Foundation Industries:a Network+ (EP/V026402/1)the Hubert Curien Partnership award 2022 from the British Council,Transforming the Partnership award from the Royal Academy of Engineering (TSP1332)the Newton Fellowship award from the Royal Society (NIF\R1\191571).
文摘Sustainable energy sources are an immediate need to cope with the imminent issue of climate change the world is facing today.In particular,the long-lasting miniatured power sources that can supply energy continually to power handheld gadgets,sensors,electronic devices,unmanned airborne vehicles in space and extreme mining are some of the examples where this is an acute need.It is known from basic physics that radioactive materials decay over few years and some nuclear materials have their half-life until thousands of years.The past five decades of research have been spent harnessing the decay energy of the radioactive materials to develop batteries that can last until the radioactive reaction continues.Thus,an emergent opportunity of industrial symbiosis to make use of nuclear waste by using radioactive waste as raw material to develop bat-teries with long shelf life presents a great opportunity for sustainable energy resource development.However,the current canon of research on this topic is scarce.This perspective draws fresh discussions on the topic while highlighting future directions in this wealthy arena of research.Graphical abstract A long-lasting miniaturised nuclear battery utilising 14C radioactive isotope as fuel.
基金financial support provided by CSIR,India through the project grant MLP0056the financial support provided by the UKRI via Grants Nos.EP/L016567/1,EP/S013652/1,EP/S036180/1,EP/T001100/1 and EP/T024607/1+2 种基金Royal Academy of Engineering via Grants Nos.IAPP18-19\295,TSP1332 and EXPP2021\1\277,EURAMET EMPIR A185(2018)H2020 EU Cost Actions(CA15102,CA18125,CA18224 and CA16235)Newton Fellowship award from the Royal Society(NIF\R1\191571)。
文摘This paper reports the performance enhancement benefits in diamond turning of the silicon wafer by incorporation of the surface defect machining(SDM)method.The hybrid micromachining methods usually require additional hardware to leverage the added advantage of hybrid technologies such as laser heating,cryogenic cooling,electric pulse or ultrasonic elliptical vibration.The SDM method tested in this paper does not require any such additional baggage and is easy to implement in a sequential micro-machining mode.This paper made use of Raman spectroscopy data,average surface roughness data and imaging data of the cutting chips of silicon for drawing a comparison between conventional single-point diamond turning(SPDT)and SDM while incorporating surface defects in the(i)circumferential and(ii)radial directions.Complementary 3D finite element analysis(FEA)was performed to analyse the cutting forces and the evolution of residual stress on the machined wafer.It was found that the surface defects generated in the circumferential direction with an interspacing of 1 mm revealed the lowest average surface roughness(Ra)of 3.2 nm as opposed to 8 nm Ra obtained through conventional SPDT using the same cutting parameters.The observation of the Raman spectroscopy performed on the cutting chips showed remnants of phase transformation during the micromachining process in all cases.FEA was used to extract quantifiable information about the residual stress as well as the sub-surface integrity and it was discovered that the grooves made in the circumferential direction gave the best machining performance.The information being reported here is expected to provide an avalanche of opportunities in the SPDT area for low-cost machining solution for a range of other nominal hard,brittle materials such as SiC,ZnSe and GaAs as well as hard steels.
基金support from the National Natural Science Foundation of China(Grant No.52175441)the Natural Science Foundation of Zhejiang Province,China(Grant No.LD22E050010)+4 种基金the travel scholarship from the China Scholarship Council(Grant No.202208330333)for secondment of Jiahuan Wang at London South Bank University(LSBU)for working closely with Prof.GoelSaurav Goel would like to acknowledge the funding support from UK Research and Innovation,UKRI(Grant Nos.EP/S036180/1 and EP/T024607/1)the feasibility study awards to LSBU from the UKRI National Interdisciplinary Circular Economy Hub(Grant No.EP/V029746/1)Transforming the Foundation Industries:A Network+(Grant No.EP/V026402/1)the International Exchange Cost Share Award by the Royal Society(Grant No.IEC\NSFC\223536).This work accessed the supercomputing service(Isambard-AI,Bristol,UK)via the Resource Allocation Panel and Kittrick(LSBU)-based computational resources.
文摘Printed circuit boards(PCBs)are representative composite materials,and their high-quality drilling machining remains a persistent challenge in the industry.The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life.The miniature size involving submicron scale geometric dimensions,a complex flute shape,and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills.In this study,a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards.The proposed method,namely,shear thickening polishing,limited the cutting edge burrs and chipping on the cutting edge,and this in turn transformed the cutting edge’s radius from being sharp to smooth.Moreover,the edge–edge radius could be regulated by adjusting the processing time.PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear,hole position accuracy,nail head value,and hole wall roughness.The proposed approach showed 20%enhancement in hole position accuracy,33%reduction in the nail head value,and 19%reduction in hole wall roughness compared with the original microdrill.However,a threshold is needed;without it,excessive shear thickening polishing will result in a blunt edge,which may accelerate the wear of the microdrill.Wear was identified as the primary factor that reduced hole quality.The study indicates that in printed circuit board machining,microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality.Overall,shear thickening polishing is a promising method for cutting edge preparation of microdrills.Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.
基金The authors would like to thank EPSRC(EP/K018345/1,EP/T024844/1)the Royal Society-NSFC Interna-tional Exchange Program(IECINSFC181474)for providing financial support to this research.SG is particularly thankful for the research support provided by the UKRI via Grant Nos.EP/L016567/1,EP/S013652/1,EP/T001100/1,EP/S036180/1,and EP/T024607/1+4 种基金The authors also acknowledge the support received from H2020(Cost Actions CA18125,CA18224,CA17136,and CA16235)the Royal Academy of Engineering via Grant Nos.IAPP18-19)295,TSP1332,and EXPP2021\11277and the Newton Fellowship award from the Royal Society(NIFR1191571)SG also accessed the Isambard Bris-tol,a UK supercomputing service,via the Resource Allocation Panel and ARCHER2 resources(Project e648)The authors also acknowledge the use of the EPSRC(EP/K000586/1)-funded ARCHIE WeSt High-Performance Computer at the University of Strathclyde.
文摘This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch experiments.This work considered gallium arsenide,an importantⅢ-Ⅴdirect bandgap semiconductor material residing in the zincblende structure,as a reference sample material due to its growing usage in 5G communication devices.In the simulations,the scratch depth was tested as a variable in the fine range of 0.5-3 nm to understand the behavior of material removal and to gain insights into the nanoscale friction.Scratch force,normal force,and average cutting forces were extracted from the simulation to obtain two scalar quantities,namely,the scratch cutting energy(defined as the work performed to remove a unit volume of material)and the kinetic coefficient of friction(defined as the force ratio).A strong size effect was observed for scratch depths below 2 nm from the MD simulations and about 15 nm from the AFM experiments.A strong quantitative corroboration was obtained between the specific scratch energy determined by the MD simulations and the AFM experiments,and more qualitative corroboration was derived for the pile-up and the kinetic coefficient of friction.This conclusion suggests that the specific scratch energy is insensitive to the tool geometry and the scratch speed used in this investigation.However,the pile-up and kinetic coefficient of friction are dependent on the geometry of the tool tip.
