Silver nanowires （AgNWs） have emerged as a promising nanomaterial for next generation stretchable electronics. However, until now, the fabrication of AgNW- based components has been hampered by complex and time-cons...Silver nanowires （AgNWs） have emerged as a promising nanomaterial for next generation stretchable electronics. However, until now, the fabrication of AgNW- based components has been hampered by complex and time-consuming steps. Here, we introduce a facile, fast, and one-step methodology for the fabrication of highly conductive and stretchable AgNW/polyurethane （PU） composite electrodes based on a high-intensity pulsed light （HIPL） technique. HIPL simultaneously improved wire-wire junction conductivity and wire-substrate adhesion at room temperature and in air within 50 μs, omitting the complex transfer-curing-implanting process. Owing to the localized deformation of PU at interfaces with AgNWs, embedding of the nanowires was rapidly carried out without substantial substrate damage. The resulting electrode retained a low sheet resistance （high electrical conductivity） of 〈10 Ω/sq even under 100% strain, or after 1,000 continuous stretching-relaxation cycles, with a peak strain of 60%. The fabricated electrode has found immediate application as a sensor for motion detection. Furthermore, based on our electrode, a light emitting diode （LED） driven by integrated stretchable AgNW conductors has been fabricated. In conclusion, our present fabrication approach is fast, simple, scalable, and cost- efficient, making it a good candidate for a future roll-to-roll process.展开更多
文摘Silver nanowires （AgNWs） have emerged as a promising nanomaterial for next generation stretchable electronics. However, until now, the fabrication of AgNW- based components has been hampered by complex and time-consuming steps. Here, we introduce a facile, fast, and one-step methodology for the fabrication of highly conductive and stretchable AgNW/polyurethane （PU） composite electrodes based on a high-intensity pulsed light （HIPL） technique. HIPL simultaneously improved wire-wire junction conductivity and wire-substrate adhesion at room temperature and in air within 50 μs, omitting the complex transfer-curing-implanting process. Owing to the localized deformation of PU at interfaces with AgNWs, embedding of the nanowires was rapidly carried out without substantial substrate damage. The resulting electrode retained a low sheet resistance （high electrical conductivity） of 〈10 Ω/sq even under 100% strain, or after 1,000 continuous stretching-relaxation cycles, with a peak strain of 60%. The fabricated electrode has found immediate application as a sensor for motion detection. Furthermore, based on our electrode, a light emitting diode （LED） driven by integrated stretchable AgNW conductors has been fabricated. In conclusion, our present fabrication approach is fast, simple, scalable, and cost- efficient, making it a good candidate for a future roll-to-roll process.
