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Evaluation and Analysis of the Effect of Lignin Amelioration on Loess Collapsibility 被引量:3
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作者 Xiumei Zhong yuxin liang +4 位作者 Qian Wang Jinlian Ma Shouyun liang Yan Wang Xiaowei Xu 《Journal of Renewable Materials》 SCIE EI 2022年第12期3405-3424,共20页
The road subgrade and road surface in collapsible loess area are prone to many engineering diseases such as uneven subgrade settlement,insufficient bearing capacity of soaked foundation,collapse and instability of sub... The road subgrade and road surface in collapsible loess area are prone to many engineering diseases such as uneven subgrade settlement,insufficient bearing capacity of soaked foundation,collapse and instability of sub-grade side slope due to the special properties of loess.As an environment-friendly,low-cost soil modifier with good adhesion and chelation properties,lignin has been considered to be used in highway subgrade construction.In order to explore the effect of lignin on loess,the compressive and collapsible properties of modified loess with different lignin contents were analyzed based on consolidation compression test.The improvement mechanism of lignin on loess collapsibility was studied by means of infiltration test and SEM test.The results show that lignin fibers can promote the agglomeration of loose particles and form a network structure in the soil particle pores,enhance the cementation strength between particles and soil skeleton,and reduce the permeability of loess.With the increase of lignin fiber content,the improvement degree of loess collaps ility shows a trend of first increasing and then decreasing.When the lignin fiber content is 2%,the effect is the best,and the improved loess ollapsi-bility is eliminated. 展开更多
关键词 Collapsible loess LIGNIN distribution characteristics of pore particles SEM permeability characteristics
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Cu-Cu low-temperature diffusion bonding by spark plasma sintering:Void closure mechanism and mechanical properties 被引量:1
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作者 Wendi Li yuxin liang +3 位作者 Yang Bai Tiesong Lin Bangsheng Li Jicai Feng 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2023年第8期210-223,共14页
In this study,combining the single point diamond turning(SPDT)and spark plasma sintering(SPS),we achieved high-strength diffusion bonding of copper at an ultra-low temperature of 202℃(0.35 T_(m),T_(m):absolute temper... In this study,combining the single point diamond turning(SPDT)and spark plasma sintering(SPS),we achieved high-strength diffusion bonding of copper at an ultra-low temperature of 202℃(0.35 T_(m),T_(m):absolute temperature of the melting point).Additionally,the closure mechanism of interfacial micro-and nano-voids during the Cu-Cu SPS diffusion bonding is systematically revealed for the first time.For micro-voids,the pulsed current is found to induce additional diffusion flux and plastic deformation,thereby facilitating the void closure.Molecular dynamics(MD)simulation revealed that at the atomic scale,high-energy Cu atoms induced by the pulsed current can significantly promote the diffusion of low-energy atoms in their vicinity and accelerate the void closure.This study also proposes a novel“evaporation-deposition”nano-void closure mechanism for the previously unstudied nano-void closure process.The results show that the synergistic effect of the pulsed current and nanoscale surface rough-ness can significantly improve joint strength.At a low temperature of 405℃(0.5 T_(m)),on combining the computerized numerical control(CNC)turning and SPS diffusion bonding,the joint strength can reach 212 MPa,while that for the joint obtained by traditional hot pressing diffusion bonding at the same tem-perature is only 47 MPa.We obtained an ultra-high joint strength of 271 MPa using the combined process of SPDT and SPS diffusion bonding at an ultra-low temperature of 202℃(0.35 T_(m)),which is approximately 600℃ lower than the traditional diffusion bonding process temperature of 800℃(0.79 T_(m)).To sum up,this study provides a novel method and theoretical support for realizing low-temperature high-strength diffusion bonding. 展开更多
关键词 Spark plasma sintering Diffusion bonding Void closure mechanism Mechanical property Molecular dynamics
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Polymer Integrated Waveguide Optical Biosensor by Using Spectral Splitting Effect
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作者 Xiaonan HAN Xiuyou HAN +6 位作者 Yuchen SHAO Zhenlin WU yuxin liang Jie TENG Shuhui BO Geert MORTHIER Mingshan ZHAO 《Photonic Sensors》 SCIE EI CAS CSCD 2017年第2期131-139,共9页
The polymer waveguide optical biosensor based on the Mach-Zehnder interferometer (MZI) by using spectral splitting effect is investigated. The MZI based biosensor has two unequal width sensing arms. With the differe... The polymer waveguide optical biosensor based on the Mach-Zehnder interferometer (MZI) by using spectral splitting effect is investigated. The MZI based biosensor has two unequal width sensing arms. With the different mode dispersion responses of the two-arm waveguides to the cladding refractive index change, the spectral splitting effect of the output interference spectrum is obtained, inducing a very high sensitivity. The influence of the different mode dispersions between the two-arm waveguides on the spectral splitting characteristic is analyzed. By choosing different lengths of the two unequal width sensing arms, the initial dip wavelength of the interference spectrum and the spectral splitting range can be controlled flexibly. The polymer waveguide optical biosensor is designed, and its sensing property is analyzed. The results show that the sensitivity of the polymer waveguide optical biosensor by using spectral splitting effect is as high as 10^4nm/RIU, with an improvement of 2-3 orders of magnitude compared with the slot waveguide based microring biosensor. 展开更多
关键词 Optical biosensor integrated waveguide spectral splitting sensitivity
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