In February 2023,the annual‘Olympic’of the chip industry,ISSCC,returned to in-person meetings in San Francisco.As shown in Fig.1,from the ISSCC 2023,we can see that the trend in IC design has shifted from pure digit...In February 2023,the annual‘Olympic’of the chip industry,ISSCC,returned to in-person meetings in San Francisco.As shown in Fig.1,from the ISSCC 2023,we can see that the trend in IC design has shifted from pure digital to mixed-signal design,particularly in areas such as AI accelerator chips and quantum computing.Chips have also evolved from integrated circuits to integrated chips through modulelevel,function-level,and chip-level fusion,with compute-inmemory being the best embodiment of module-level and function-level fusion.Moreover,quantum computing was one of the major focuses of this ISSCC edition,with a separate paper session dedicated to cryo-CMOS for quantum computing.展开更多
基金supported by STI2030-Major Projects 2022ZD0208805。
文摘In February 2023,the annual‘Olympic’of the chip industry,ISSCC,returned to in-person meetings in San Francisco.As shown in Fig.1,from the ISSCC 2023,we can see that the trend in IC design has shifted from pure digital to mixed-signal design,particularly in areas such as AI accelerator chips and quantum computing.Chips have also evolved from integrated circuits to integrated chips through modulelevel,function-level,and chip-level fusion,with compute-inmemory being the best embodiment of module-level and function-level fusion.Moreover,quantum computing was one of the major focuses of this ISSCC edition,with a separate paper session dedicated to cryo-CMOS for quantum computing.
