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Thermoelectric properties of Bi_(0.5)Sb_(1.5)Te_3/polyaniline composites prepared by mechanical blending and in-situ polymerization
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作者 胡淑红 裴浩东 赵新兵 《中国有色金属学会会刊:英文版》 CSCD 2001年第6期876-878,共3页
Bi 0.5 Sb 1.5 Te 3/polyaniline composites were prepared by mechanical blending and in situ polymerization, and their transport properties were measured. It was found that for the composites with 1%, 3%, 5% and 7% poly... Bi 0.5 Sb 1.5 Te 3/polyaniline composites were prepared by mechanical blending and in situ polymerization, and their transport properties were measured. It was found that for the composites with 1%, 3%, 5% and 7% polyaniline (mass fraction) respectively, which were prepared by mechanical blending, the power factors decrease by about 30%, 50%, 55% and 65% compared with the Bi 0.5 Sb 1.5 Te 3 samples, which is mainly due to the remarkable decreases of the electrical conductivity. The electrical conductivity and power factor of the composites samples with 7% polyaniline prepared by in situ polymerization are higher by about 65% and 60%, respectively, than that of the corresponding samples prepared by mechanical blending. 展开更多
关键词 thermoelectric property bi 0.5 sb 1.5 te 3/polyaniline composite mechanical blending in situ polymerization
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P型Bi_(0.5)Sb_(1.5)Te_3热压烧结热电材料的制备与性能研究 被引量:1
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作者 张红晨 程颖 荣剑英 《哈尔滨师范大学自然科学学报》 CAS 2007年第2期45-48,共4页
通过熔炼热压烧结法制备了P型B i0.5Sb1.5Te3粉末热压烧结热电材料样品,研究了热压时间、烧结温度对材料热电性能的影响.实验表明:随着热压时间的增加,热压样品的温差电动势率和电导率均呈上升趋势,说明增加热压时间可以改善材料的热电... 通过熔炼热压烧结法制备了P型B i0.5Sb1.5Te3粉末热压烧结热电材料样品,研究了热压时间、烧结温度对材料热电性能的影响.实验表明:随着热压时间的增加,热压样品的温差电动势率和电导率均呈上升趋势,说明增加热压时间可以改善材料的热电性能;随着烧结温度的增高,热压烧结样品的温差电动势率和电导率也均呈上升趋势,说明对热压样品再进行烧结还可以进一步提高材料的热电性能. 展开更多
关键词 热电性能 热压 时间 烧结 P型bi0.5sb1.5te3
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退火处理对室温制备Bi_(0.5)Sb_(1.5)Te_3薄膜热电性质的影响 被引量:1
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作者 娄本浊 《热加工工艺》 CSCD 北大核心 2012年第14期180-182,共3页
利用射频磁控溅镀法在SiO2/Si基板上制备了Bi0.5Sb1.5Te3薄膜样品,并且测量了薄膜样品在不同退火时间与退火温度下的热电性质。结果表明,薄膜样品经30 h退火后的热电性质与1 h退火后的热电性质相差不大,这说明长时间退火并不是Bi0.5Sb1.... 利用射频磁控溅镀法在SiO2/Si基板上制备了Bi0.5Sb1.5Te3薄膜样品,并且测量了薄膜样品在不同退火时间与退火温度下的热电性质。结果表明,薄膜样品经30 h退火后的热电性质与1 h退火后的热电性质相差不大,这说明长时间退火并不是Bi0.5Sb1.5Te3薄膜的最佳退火时间。而在不同退火温度下,样品的塞贝克系数在275~300℃退火下降比较快,当退火温度为300℃时降至最小,约为181μV/K;而其电阻率则随退火温度的升高呈现出先减小后增大的趋势,退火温度为225℃时具有最小的电阻率,约为6.1 mΩ.cm。最后本文得出经225℃退火10 min后可得到最佳的热电性质,即薄膜样品的塞贝克系数为208μV/K,电阻率为6.1mΩ.cm,功率因子则为6.9×10-4W/(m.K2)。 展开更多
关键词 bi0.5sb1.5te3薄膜 退火处理 热电性质
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同质界面浓度对P型Bi0.5Sb1.5Te3合金热电性能的影响
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作者 孙超 王小宇 +4 位作者 徐亮 许飞 孙志豪 朱彬 祖方遒 《稀有金属与硬质合金》 CAS CSCD 北大核心 2019年第3期47-50,共4页
界面对材料的电声输运性能具有明显的调控作用。基于此,探究了同质界面浓度对P型Bi0.5Sb1.5Te3合金热电性能的影响。结果表明:随着同质界面浓度的增大,材料的电导率降低,Seebeck系数增大;界面浓度增加强化了对声子的散射,故热导率降低;... 界面对材料的电声输运性能具有明显的调控作用。基于此,探究了同质界面浓度对P型Bi0.5Sb1.5Te3合金热电性能的影响。结果表明:随着同质界面浓度的增大,材料的电导率降低,Seebeck系数增大;界面浓度增加强化了对声子的散射,故热导率降低;经1min粉碎的烧结样品具有更优的高温电学性能,故其高温端热电性能更优。 展开更多
关键词 P型bi0.5sb1.5te3 同质界面浓度 热电性能 机械粉碎
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SPS法制备的赝二元合金(Ga_2Te_3)_x-(Bi_(0.5)Sb_(1.5)Te_3)_(1-x)(x=0~0.2)电学性能
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作者 薛海峰 崔教林 修伟杰 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2007年第9期1653-1656,共4页
采用放电等离子烧结(SPS)方法制备了赝二元合金(Ga2Te3)x-(Bi0.5Sb1.5Te3)1-x(x=0~0.2),并研究其电学性能。结果表明,在318K时(Ga2Te3)x-(Bi0.5Sb1.5Te3)1-x(x=0.1)合金的电导率为3.7×104Ω-1·m-1,是三元合金Bi0.5Sb1.5Te3的... 采用放电等离子烧结(SPS)方法制备了赝二元合金(Ga2Te3)x-(Bi0.5Sb1.5Te3)1-x(x=0~0.2),并研究其电学性能。结果表明,在318K时(Ga2Te3)x-(Bi0.5Sb1.5Te3)1-x(x=0.1)合金的电导率为3.7×104Ω-1·m-1,是三元合金Bi0.5Sb1.5Te3的2倍,而Seebeck系数没有明显下降。从所测得的α和σ值可知,赝二元(Ga2Te3)x-(Bi0.5Sb1.5Te3)1-x(x=0.1)合金的功率因子最大,为2.1×10-3(W·K-2·m-1),是三元Bi0.5Sb1.5Te3合金的1.5倍。 展开更多
关键词 赝二元合金(Ga2te3)x-(bi0.5sb1.5te3)1-x 放电等离子烧结(SPS) 电学性能
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Effects of Electroless Plating with Cu Content on Thermoelectric and Mechanical Properties of p-type Bi0.5Sb1.5Te3 Bulk Alloys 被引量:2
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作者 代雪婷 黄中月 +2 位作者 YU Yuan ZHOU Chongjian ZU Fangqiu 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2018年第4期797-801,共5页
Bi_(0.5)Sb_(1.5)Te_3/Cu core/shell powders were prepared by electroless plating and hydrogen reduction, and then sintered into bulk by spark plasma sintering. After electroless plating, with increasing the Cu cont... Bi_(0.5)Sb_(1.5)Te_3/Cu core/shell powders were prepared by electroless plating and hydrogen reduction, and then sintered into bulk by spark plasma sintering. After electroless plating, with increasing the Cu content, the electrical conductivity keeps enhancing significantly. The highest electrical conductivity reaches 3341 S/cm at room temperature in Bi0.5Sb1.5Te3 with 0.67 wt% Cu bulk sample. Moreover, the lowest lattice thermal conductivity reaches 0.32 W/m·K at 572.2 K in Bi0.5Sb1.5Te3 with 0.67 wt% Cu bulk sample, which is caused by the scattering of the rich-copper particles with different dimensions and massive grain boundaries. According to the results, the ZT values of all Bi0.5Sb1.5Te3/Cu bulk samples have improved in a high temperature range. In Bi0.5Sb1.5Te3 with 0.15 wt% Cu bulk sample, the highest ZT value at 573.4 K is 0.81. When the Cu content increases to 0.67 wt%, the highest ZT value reaches 0.85 at 622.2 K. Meanwhile, the microhardness increases with increasing the Cu content. 展开更多
关键词 bi0.5sb1.5te3 electroless plating thermoelectric property mechanical property sparkplasma sintering
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Bi0.5Sb1.5Te3/环氧树脂柔性复合热电厚膜的制备及其面内制冷性能(英文) 被引量:2
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作者 李鹏 聂晓蕾 +6 位作者 田烨 方文兵 魏平 朱婉婷 孙志刚 张清杰 赵文俞 《无机材料学报》 SCIE EI CAS CSCD 北大核心 2019年第6期679-684,共6页
利用丝网印刷法在聚酰亚胺基板上制备了Bi0.5Sb1.5Te3/环氧树脂柔性复合热电厚膜,通过优化Bi0.5Sb1.5Te3粉末含量提高了其电输运性能。复合厚膜在300K时的最优功率因子达到1.12mW·m^-1·K^-2,较前期报道的数值提高了33%。抗弯... 利用丝网印刷法在聚酰亚胺基板上制备了Bi0.5Sb1.5Te3/环氧树脂柔性复合热电厚膜,通过优化Bi0.5Sb1.5Te3粉末含量提高了其电输运性能。复合厚膜在300K时的最优功率因子达到1.12mW·m^-1·K^-2,较前期报道的数值提高了33%。抗弯测试表明复合厚膜的电阻在弯曲半径大于20mm时基本不变,在弯曲半径为20mm,弯曲次数小于3000次时,仅有轻微增大,说明其在柔性热电器件领域具有应用潜力。红外热成像技术显示,在工作电流为0.01A到0.05A时,复合厚膜热电臂两端可以形成4.2℃到7.8℃的温差,表明了其在面内制冷领域应用的可能性。 展开更多
关键词 柔性热电厚膜 丝网印刷法 bi0.5sb1.5te3/环氧树脂复合厚膜 电输运性能 面内制冷领域
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溶剂和修饰剂对化学法合成Bi-Sb-Te纳米晶尺寸和形貌的影响 被引量:2
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作者 程春霞 任维丽 +2 位作者 徐永斌 任忠鸣 钟云波 《材料导报(纳米与新材料专辑)》 EI 2010年第1期29-32,共4页
采用简单的水热/溶剂热法合成了纳米结构的Bi_(0.5)Sb_(1.5)Te_3晶粒,通过改变溶剂种类和表面修饰剂的添加量可以实现对Bi_(0.5)Sb_(1.5)Te_3纳米晶体的尺寸和形貌的控制。当表面修饰剂的浓度较小时,合成的Bi_(0.5)-Sb_(1.5)Te_3晶粒只... 采用简单的水热/溶剂热法合成了纳米结构的Bi_(0.5)Sb_(1.5)Te_3晶粒,通过改变溶剂种类和表面修饰剂的添加量可以实现对Bi_(0.5)Sb_(1.5)Te_3纳米晶体的尺寸和形貌的控制。当表面修饰剂的浓度较小时,合成的Bi_(0.5)-Sb_(1.5)Te_3晶粒只有数十纳米,有望为高性能的纳米结构块体热电材料提供原始粉末。产物的颗粒尺寸减小和片状形貌的获得,可能是生成物的合成速率减缓和表面修饰剂选择性吸附所致。 展开更多
关键词 bi0.5sb1.5te3 纳米晶 溶剂热法 表面修饰剂 热电材料
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Thermoelectric performance of p-type zone-melted Se-doped Bi_(0.5)Sb_(1.5)Te_3 alloys 被引量:16
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作者 Ren-Shuang Zhai Ye-Hao Wu +1 位作者 Tie-Jun Zhu Xin-Bing Zhao 《Rare Metals》 SCIE EI CAS CSCD 2018年第4期308-315,共8页
For zone-melted (ZM) bismuth telluride-based alloys, which are widely commercially available for solidstate cooling and low-temperature power generation around room temperature, introducing point defects is the chie... For zone-melted (ZM) bismuth telluride-based alloys, which are widely commercially available for solidstate cooling and low-temperature power generation around room temperature, introducing point defects is the chief approach to improve their thermoelectric performance. Herein, we report the multiple effects of Se doping on thermoelectric performance of p-type Bi0.5Sb1,5Te3-xSex + 3 wt% Te ZM ingots, which increases carrier concentration, reduces lattice thermal conductivity and deteriorates the carrier mobility. As a result, the peak figure of merit (ZT) is shifted to a higher temperature and a high ZT 1.2 at 350 K is obtained, due to the reduced thermal conductivity and suppressed intrinsic conduction. Further, decreasing Sb content is followed to optimize the room temperature performance and a ZT - 1.1 at 300 K is obtained. These results are significant for designing and optimizing the thermoelectric performance of commercial Bi0.5Sb1.5Te3+ 3 wt% Te ZM alloys. 展开更多
关键词 Thermoelectric materials bismuth telluride Zone melting Se doping bi0.5sb1.5te3
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Thermoelectric Performance of Micro/Nano-Structured Bismuth-Antimony-Telluride Bulk from Low Cost Mechanical Alloying
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作者 Z. Li G. L. Zhao +2 位作者 P. Zhang S. Guo J. Tang 《Materials Sciences and Applications》 2012年第12期833-837,共5页
In this work, micro/nano-structured Bi0.5Sb1.5Te3bulk thermoelectric materials were synthesized by mechanical alloying from elemental shots of Bi, Sb, and Te. Cold pressing and subsequent heat treatments with hydrogen... In this work, micro/nano-structured Bi0.5Sb1.5Te3bulk thermoelectric materials were synthesized by mechanical alloying from elemental shots of Bi, Sb, and Te. Cold pressing and subsequent heat treatments with hydrogen reduction were used to form bulk solid samples with good thermoelectric properties in the temperature range around 75℃to 100℃. In comparison to crystal growth methods and chemical solution synthesis, the reported technique can be readily implemented for mass production with relatively low cost. 展开更多
关键词 Thermoelectric bi0.5sb1.5te3 Mechanical ALLOYING Hydrogen Reduction
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Lower work function of thermoelectric material by ordered arrays
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作者 Gang Liu Zhenjie Xue +2 位作者 Guiying Xu Cong Yan Tie Wang 《Science China Chemistry》 SCIE EI CAS CSCD 2016年第10期1264-1269,共6页
In this paper, PbTe nanocubes are assembled on Bi_(0.5)Sb_(1.5)Te_3 substrates with both ordered and disordered structures through a straightforward method to form a P-N section. The work function of such semiconducto... In this paper, PbTe nanocubes are assembled on Bi_(0.5)Sb_(1.5)Te_3 substrates with both ordered and disordered structures through a straightforward method to form a P-N section. The work function of such semiconductor system is then measured by the ultraviolet photoelectron spectroscopy. This results show that the work function of orderly arrayed PbTe deposition is much lower than the disordered assemblies. Such change of the work function provides the possibility to tune it in a P-N section system. The change of the work function is attributed to the less surface roughness and easier electron escaping in the ordered structures. 展开更多
关键词 work function Pbte nanocubes bi0.5sb1.5te3 P-N sections
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