The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with andwithout electroless plated Ni-P was investigated by electrochemical methods, in artificial Tyrode'ssolution. The results showed that Cu-Zn-...The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with andwithout electroless plated Ni-P was investigated by electrochemical methods, in artificial Tyrode'ssolution. The results showed that Cu-Zn-Al SMA engendered dezincification corrosion in Tyrode'ssolution. The anodic active current densities as well as electrochemical dissolution sensitivity ofthe electroless plated Ni-P Cu-Zn-Al SMA increased with NaCl concentration rising, pH of solutiondecreasing and environmental temperature uprising. X-ray diffraction analysis indicated that aftersurface modification by electroless plated Ni-P, an amorphous plated film formed on the surface ofCu-Zn-Al SMA. This film can effectively isolate matrix metal from corrosion media and significantlyimprove the electrochemical property of Cu-Zn-Al SMA in artificial Tyrode's solution.展开更多
文摘The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with andwithout electroless plated Ni-P was investigated by electrochemical methods, in artificial Tyrode'ssolution. The results showed that Cu-Zn-Al SMA engendered dezincification corrosion in Tyrode'ssolution. The anodic active current densities as well as electrochemical dissolution sensitivity ofthe electroless plated Ni-P Cu-Zn-Al SMA increased with NaCl concentration rising, pH of solutiondecreasing and environmental temperature uprising. X-ray diffraction analysis indicated that aftersurface modification by electroless plated Ni-P, an amorphous plated film formed on the surface ofCu-Zn-Al SMA. This film can effectively isolate matrix metal from corrosion media and significantlyimprove the electrochemical property of Cu-Zn-Al SMA in artificial Tyrode's solution.