Silicon photonics is an emerging competitive solution for next-generation scalable data communications in different application areas as high-speed data communication is constrained by electrical interconnects. Optica...Silicon photonics is an emerging competitive solution for next-generation scalable data communications in different application areas as high-speed data communication is constrained by electrical interconnects. Optical interconnects based on silicon photonics can be used in intra/inter-chip interconnects, board-to-board interconnects, short-reach communications in datacenters, supercomputers and long-haul optical transmissions. In this paper, we present an overview of recent progress in silicon optoelectronic devices and optoelectronic integrated circuits （OEICs） based on a complementary metal-oxide-semiconductor-compatible process, and focus on our research contributions. The silicon optoelectronic devices and OEICs show good characteristics, which are expected to benefit several application domains, including communication, sensing, computing and nonlinear systems.展开更多
We propose and analyze a novel Si-based electro-optic modulator with an improved metal-oxide-semiconductor （MOS） capacitor configuration integrated into silicon-on-insulator （SOl）. Three gate-oxide layers embedded...We propose and analyze a novel Si-based electro-optic modulator with an improved metal-oxide-semiconductor （MOS） capacitor configuration integrated into silicon-on-insulator （SOl）. Three gate-oxide layers embedded in the silicon waveguide constitute a triple MOS capacitor structure, which boosts the modulation efficiency compared with a single MOS capacitor. The simulation results demonstrate that the Vπ Lπ product is 2. 4V · cm. The rise time and fall time of the proposed device are calculated to be 80 and 40ps from the transient response curve, respectively,indicating a bandwidth of 8GHz. The phase shift efficiency and bandwidth can be enhanced by rib width scaling.展开更多
A three-terminal silicon-based light emitting device is proposed and fabricated in standard 0.35 μm complementary metal-oxide-semiconductor technology. This device is capable of versatile working modes： it can emit ...A three-terminal silicon-based light emitting device is proposed and fabricated in standard 0.35 μm complementary metal-oxide-semiconductor technology. This device is capable of versatile working modes： it can emit visible to near infra-red （NIR） light （the spectrum ranges from 500 nm to 1000 nm） in reverse bias avalanche breakdown mode with working voltage between 8.35 V-12 V and emit NIR light （the spectrum ranges from 900 nm to 1300 nm） in the forward injection mode with working voltage below 2 V. An apparent modulation effect on the light intensity from the polysilicon gate is observed in the forward injection mode. Furthermore, when the gate oxide is broken down, NIR light is emitted from the polysilicon/oxide/silicon structure. Optoelectronic characteristics of the device working in different modes are measured and compared. The mechanisms behind these different emissions are explored.展开更多
A 12-Gbit/s low-power,wide-bandwidh CMOS(complementary metal oxide semiconductor)dual negative feedback feed-forward common gate(DNFFCG)differential trans-impedance amplifier(TIA)is presented for the veryshort-reach(V...A 12-Gbit/s low-power,wide-bandwidh CMOS(complementary metal oxide semiconductor)dual negative feedback feed-forward common gate(DNFFCG)differential trans-impedance amplifier(TIA)is presented for the veryshort-reach(VSR)optoelectronic integrated circuit(OEIC)receiver.The dominant pole of the input node is shifted up to a high frequency,and thus the bandwidth of the CMOS DNFFCG TIA is improved.Besides,two negative feedback loops are used to reduce the input impedance and further increase the bandwidth.The proposed TIA was fabricated using TSMC 0.18 jxm CMOS technology.The whole circuit has a compact chip area,the core area of which is only 0.003 6 mm2.The power consumption is 14.6 mW excluding 2-stage differential buffers.The test results indicate that the 3 dB bandwidth of 9 GHz is achieved with a 1 8 V supply voltage and its trans-impedance gain is 49.2 dBH.The measured average equivalent input noise current density is 28.1 pA H z12.Under the same process conditions,the DNFFCG has better gain bandwidth product compared with those in the published papers.展开更多
A monolithic photoreceiver which consists of a double photodiode (DPD) detector and a regulated cascade (RGC) transimpedance amplifier (TIA) is designed.The small signal circuit model of DPD is given and the bandwidth...A monolithic photoreceiver which consists of a double photodiode (DPD) detector and a regulated cascade (RGC) transimpedance amplifier (TIA) is designed.The small signal circuit model of DPD is given and the bandwidth design method of a monolithic photoreceiver is presented.An important factor which limits the bandwidth of DPD detector and the photoreceiver is presented and analyzed in detail.A monolithic photoreceiver with 1.71GHz bandwidth and 49dB transimpedance gain is designed and simulated by applying a low-cost 0.6μm CMOS process and the test result is given.展开更多
Efficient coupling from the silicon waveguide to the GeSi layer is the key to success in the GeSi electro-absorption （EA） modulator based on evanescent coupling. A lateral taper in the upper GeSi layer has room for ...Efficient coupling from the silicon waveguide to the GeSi layer is the key to success in the GeSi electro-absorption （EA） modulator based on evanescent coupling. A lateral taper in the upper GeSi layer has room for increasing the modulating efficiency and alleviating the sensitivity of the extinction ratio （ER） and insertion loss （IL） to the length of the active region. The light behavior and the effect of the taper are explored in detail using the beam propagation method （BPM）. After optimization, the light can nearly be totally confined in the GeSi layer without any oscillation. The modulator with the designed taper can achieve low IL and high ER.展开更多
Serving as the electrical to optical converter,the on-chip silicon light source is an indispensable component of silicon photonic technologies and has long been pursued.Here,we briefly review the history and recent pr...Serving as the electrical to optical converter,the on-chip silicon light source is an indispensable component of silicon photonic technologies and has long been pursued.Here,we briefly review the history and recent progress of a few promising contenders for on-chip light sources in terms of operating wavelength,pump condition,power consumption,and fabrication process.Additionally,the performance of each contender is also assessed with respect to thermal stability,which is a crucial parameter to consider in complex optoelectronic integrated circuits(OEICs)and optical interconnections.Currently,III-V-based silicon(Si)lasers formed via bonding techniques demonstrate the best performance and display the best opportunity for commercial usage in the near future.However,in the long term,direct hetero-epitaxial growth of III–V materials on Si seems more promising for low-cost,high-yield fabrication.The demonstration of high-performance quantum dot(QD)lasers monolithically grown on Si strongly forecasts its feasibility and enormous potential for on-chip lasers.The superior temperature-insensitive characteristics of the QD laser promote this design in large-scale high-density OEICs.The Germanium(Ge)-on-Si laser is also competitive for large-scale monolithic integration in the future.Compared with a III-V-based Si laser,the biggest potential advantage of a Ge-on-Si laser lies in its material and processing compatibility with Si technology.Additionally,the versatility of Ge facilitates photon emission,modulation,and detection simultaneously with a simple process complexity and low cost.展开更多
基金supported by the National Basic Research Program of China(No.2011CBA00608)the National Natural Science Foundation of China(Nos.61178051,61321063,61335010,61178048,61275169)the National High Technology Research and Development Program of China(Nos.2013AA013602,2013AA031903,2013AA032204)
文摘Silicon photonics is an emerging competitive solution for next-generation scalable data communications in different application areas as high-speed data communication is constrained by electrical interconnects. Optical interconnects based on silicon photonics can be used in intra/inter-chip interconnects, board-to-board interconnects, short-reach communications in datacenters, supercomputers and long-haul optical transmissions. In this paper, we present an overview of recent progress in silicon optoelectronic devices and optoelectronic integrated circuits （OEICs） based on a complementary metal-oxide-semiconductor-compatible process, and focus on our research contributions. The silicon optoelectronic devices and OEICs show good characteristics, which are expected to benefit several application domains, including communication, sensing, computing and nonlinear systems.
文摘We propose and analyze a novel Si-based electro-optic modulator with an improved metal-oxide-semiconductor （MOS） capacitor configuration integrated into silicon-on-insulator （SOl）. Three gate-oxide layers embedded in the silicon waveguide constitute a triple MOS capacitor structure, which boosts the modulation efficiency compared with a single MOS capacitor. The simulation results demonstrate that the Vπ Lπ product is 2. 4V · cm. The rise time and fall time of the proposed device are calculated to be 80 and 40ps from the transient response curve, respectively,indicating a bandwidth of 8GHz. The phase shift efficiency and bandwidth can be enhanced by rib width scaling.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.60536030,61036002,60776024,60877035 and 61036009)National High Technology Research and Development Program of China(Grant Nos.2007AA04Z329 and 2007AA04Z254)
文摘A three-terminal silicon-based light emitting device is proposed and fabricated in standard 0.35 μm complementary metal-oxide-semiconductor technology. This device is capable of versatile working modes： it can emit visible to near infra-red （NIR） light （the spectrum ranges from 500 nm to 1000 nm） in reverse bias avalanche breakdown mode with working voltage between 8.35 V-12 V and emit NIR light （the spectrum ranges from 900 nm to 1300 nm） in the forward injection mode with working voltage below 2 V. An apparent modulation effect on the light intensity from the polysilicon gate is observed in the forward injection mode. Furthermore, when the gate oxide is broken down, NIR light is emitted from the polysilicon/oxide/silicon structure. Optoelectronic characteristics of the device working in different modes are measured and compared. The mechanisms behind these different emissions are explored.
基金The National Natural Science Foundation of China(No.61306069)
文摘A 12-Gbit/s low-power,wide-bandwidh CMOS(complementary metal oxide semiconductor)dual negative feedback feed-forward common gate(DNFFCG)differential trans-impedance amplifier(TIA)is presented for the veryshort-reach(VSR)optoelectronic integrated circuit(OEIC)receiver.The dominant pole of the input node is shifted up to a high frequency,and thus the bandwidth of the CMOS DNFFCG TIA is improved.Besides,two negative feedback loops are used to reduce the input impedance and further increase the bandwidth.The proposed TIA was fabricated using TSMC 0.18 jxm CMOS technology.The whole circuit has a compact chip area,the core area of which is only 0.003 6 mm2.The power consumption is 14.6 mW excluding 2-stage differential buffers.The test results indicate that the 3 dB bandwidth of 9 GHz is achieved with a 1 8 V supply voltage and its trans-impedance gain is 49.2 dBH.The measured average equivalent input noise current density is 28.1 pA H z12.Under the same process conditions,the DNFFCG has better gain bandwidth product compared with those in the published papers.
文摘A monolithic photoreceiver which consists of a double photodiode (DPD) detector and a regulated cascade (RGC) transimpedance amplifier (TIA) is designed.The small signal circuit model of DPD is given and the bandwidth design method of a monolithic photoreceiver is presented.An important factor which limits the bandwidth of DPD detector and the photoreceiver is presented and analyzed in detail.A monolithic photoreceiver with 1.71GHz bandwidth and 49dB transimpedance gain is designed and simulated by applying a low-cost 0.6μm CMOS process and the test result is given.
文摘Efficient coupling from the silicon waveguide to the GeSi layer is the key to success in the GeSi electro-absorption （EA） modulator based on evanescent coupling. A lateral taper in the upper GeSi layer has room for increasing the modulating efficiency and alleviating the sensitivity of the extinction ratio （ER） and insertion loss （IL） to the length of the active region. The light behavior and the effect of the taper are explored in detail using the beam propagation method （BPM）. After optimization, the light can nearly be totally confined in the GeSi layer without any oscillation. The modulator with the designed taper can achieve low IL and high ER.
基金This work was partially supported by the Major International Cooperation and Exchange Program of the National Natural Science Foundation of China under Grant 61120106012the Peking University 985 Startup Fund.
文摘Serving as the electrical to optical converter,the on-chip silicon light source is an indispensable component of silicon photonic technologies and has long been pursued.Here,we briefly review the history and recent progress of a few promising contenders for on-chip light sources in terms of operating wavelength,pump condition,power consumption,and fabrication process.Additionally,the performance of each contender is also assessed with respect to thermal stability,which is a crucial parameter to consider in complex optoelectronic integrated circuits(OEICs)and optical interconnections.Currently,III-V-based silicon(Si)lasers formed via bonding techniques demonstrate the best performance and display the best opportunity for commercial usage in the near future.However,in the long term,direct hetero-epitaxial growth of III–V materials on Si seems more promising for low-cost,high-yield fabrication.The demonstration of high-performance quantum dot(QD)lasers monolithically grown on Si strongly forecasts its feasibility and enormous potential for on-chip lasers.The superior temperature-insensitive characteristics of the QD laser promote this design in large-scale high-density OEICs.The Germanium(Ge)-on-Si laser is also competitive for large-scale monolithic integration in the future.Compared with a III-V-based Si laser,the biggest potential advantage of a Ge-on-Si laser lies in its material and processing compatibility with Si technology.Additionally,the versatility of Ge facilitates photon emission,modulation,and detection simultaneously with a simple process complexity and low cost.
