In recent years,solution-processible semiconductors with perovskite or perovskite-inspired structures have been extensively investigated for optoelectronic applications.In particular,silver-bismuth-halides have been i...In recent years,solution-processible semiconductors with perovskite or perovskite-inspired structures have been extensively investigated for optoelectronic applications.In particular,silver-bismuth-halides have been identified as especially promising because of their bulk properties and lack of heavily toxic elements.This study investigates the potential of Ag2BiI5 for near-infrared(NIR)-blind visible light photodetection,which is critical to emerging applications(e.g.,wearable optoelectronics and the Internet of Things).Self-powered photodetectors were realized and provided a near-constant≈100 mA W−1 responsivity through the visible,a NIR rejection ratio of>250,a long-wavelength responsivity onset matching standard colorimetric functions,and a linear photoresponse of>5 orders of magnitude.The optoelectronic characterization of Ag2BiI5 photodetectors additionally revealed consistency with one-center models and the role of the carrier collection distance in self-powered mode.This study provides a positive outlook of Ag2BiI5 toward emerging applications on low-cost and low-power NIR-blind visible light photodetector.展开更多
Technical committee for Japanese industrial standard of heat treating oils has studied on the new method for testing cooling power of aqueous quenchants. This method employed the cooling curve test of a new sliver rod...Technical committee for Japanese industrial standard of heat treating oils has studied on the new method for testing cooling power of aqueous quenchants. This method employed the cooling curve test of a new sliver rod probe, which has a metal-sheathed thermocouple at its geometrical center. The experimental study has clarified that this probe has the higher sensitivity and excellent durability. In order to standardize this probe for cooling power test of aqueous quenchants, the repeatability and reproducibility of test results etc. have been studied. D.O.P. (Di-2-ethylthexyl Phthalate) was used as reference quenching fluid for initial calibration and for periodic calibration verification of the probe and system. In addition, 10% brine was used to check the response capability of the probe and system to the sudden change of temperature. These procedures are established according to the experimental investigation. This new test method is going to be built in the revised version of JIS K 2242 "Heat treating oils" as the cooling power test method for aqueous quenchants.展开更多
Working group on cooling power test of quenchants of Japanese Heat Treatment Society has studied on the new method for testing cooling power of aqueous quenchants. This method employed the cooling curve test of a new ...Working group on cooling power test of quenchants of Japanese Heat Treatment Society has studied on the new method for testing cooling power of aqueous quenchants. This method employed the cooling curve test of a new sliver rod probe, which has a metal-sheathed thermocouple at its geometrical center. The experimental study has clarified that the new silver probe has more excellent durability than the JIS silver probe employed for cooling power test of heat treating oils (JIS K 2242) and an aluminum alloy probe. Good repeatability and reproducibility of the cooling curves during polymer quenching have been confirmed. This new method is useful especially for cooling power test of aqueous quenchants used for solution heat treatment of aluminum alloys. This new silver rod probe is expected to be adopted for the revised version of JIS K 2242 as the cooling power test method for aqueous quenchants.展开更多
针对SiC功率器件封装的高性能和高可靠性要求,文章研究了芯片双面银烧结技术与粗铜线超声键合技术的高可靠性先进互连工艺。通过系列质量评估与测试方法对比分析了不同烧结工艺对芯片双面银烧结层和芯片剪切强度的影响,分析了衬板表面...针对SiC功率器件封装的高性能和高可靠性要求,文章研究了芯片双面银烧结技术与粗铜线超声键合技术的高可靠性先进互连工艺。通过系列质量评估与测试方法对比分析了不同烧结工艺对芯片双面银烧结层和芯片剪切强度的影响,分析了衬板表面材料对铜线键合强度的影响,最后对试制样品进行温度冲击测试,讨论了温度冲击对银烧结显微组织及其剪切强度的影响,以及对铜线键合强度的影响。试验结果表明:一次烧结工艺与分次烧结工艺的芯片剪切强度均达到了工业生产要求的标准值,但分次烧结工艺的银烧结效果在组织结构和芯片剪切强度上都要优于一次烧结工艺;温度冲击测试后烧结银显微组织的烧结颈增大,孔隙增大,并且2种烧结工艺的芯片剪切强度都明显增大。衬板材质对铜线超声键合强度有很大影响,在裸铜活性金属钎焊(Active Metal Braze,AMB)上的键合性能表现出更好的力学性能,温度冲击后裸铜AMB上的键合点力学性能会退化,但镀银AMB上的力学性能反而会增强;结合拉力测试后第二键合点的断裂模式,温度冲击使裸铜AMB上键合点的断裂模式从100%颈部断裂转向焊点脱落,而使镀银AMB上的焊点脱落逐渐减少。展开更多
基金financial support from the National Natural Science Foundation of China (61750110517 and 61805166)the Jiangsu Province Natural Science Foundation (BK20170345)+3 种基金supported by the Collaborative Innovation Center of Suzhou Nano Science & Technologythe Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD)the 111 Projectthe Joint International Research Laboratory of Carbon-Based Functional Materials and Devices
文摘In recent years,solution-processible semiconductors with perovskite or perovskite-inspired structures have been extensively investigated for optoelectronic applications.In particular,silver-bismuth-halides have been identified as especially promising because of their bulk properties and lack of heavily toxic elements.This study investigates the potential of Ag2BiI5 for near-infrared(NIR)-blind visible light photodetection,which is critical to emerging applications(e.g.,wearable optoelectronics and the Internet of Things).Self-powered photodetectors were realized and provided a near-constant≈100 mA W−1 responsivity through the visible,a NIR rejection ratio of>250,a long-wavelength responsivity onset matching standard colorimetric functions,and a linear photoresponse of>5 orders of magnitude.The optoelectronic characterization of Ag2BiI5 photodetectors additionally revealed consistency with one-center models and the role of the carrier collection distance in self-powered mode.This study provides a positive outlook of Ag2BiI5 toward emerging applications on low-cost and low-power NIR-blind visible light photodetector.
文摘Technical committee for Japanese industrial standard of heat treating oils has studied on the new method for testing cooling power of aqueous quenchants. This method employed the cooling curve test of a new sliver rod probe, which has a metal-sheathed thermocouple at its geometrical center. The experimental study has clarified that this probe has the higher sensitivity and excellent durability. In order to standardize this probe for cooling power test of aqueous quenchants, the repeatability and reproducibility of test results etc. have been studied. D.O.P. (Di-2-ethylthexyl Phthalate) was used as reference quenching fluid for initial calibration and for periodic calibration verification of the probe and system. In addition, 10% brine was used to check the response capability of the probe and system to the sudden change of temperature. These procedures are established according to the experimental investigation. This new test method is going to be built in the revised version of JIS K 2242 "Heat treating oils" as the cooling power test method for aqueous quenchants.
文摘Working group on cooling power test of quenchants of Japanese Heat Treatment Society has studied on the new method for testing cooling power of aqueous quenchants. This method employed the cooling curve test of a new sliver rod probe, which has a metal-sheathed thermocouple at its geometrical center. The experimental study has clarified that the new silver probe has more excellent durability than the JIS silver probe employed for cooling power test of heat treating oils (JIS K 2242) and an aluminum alloy probe. Good repeatability and reproducibility of the cooling curves during polymer quenching have been confirmed. This new method is useful especially for cooling power test of aqueous quenchants used for solution heat treatment of aluminum alloys. This new silver rod probe is expected to be adopted for the revised version of JIS K 2242 as the cooling power test method for aqueous quenchants.
文摘针对SiC功率器件封装的高性能和高可靠性要求,文章研究了芯片双面银烧结技术与粗铜线超声键合技术的高可靠性先进互连工艺。通过系列质量评估与测试方法对比分析了不同烧结工艺对芯片双面银烧结层和芯片剪切强度的影响,分析了衬板表面材料对铜线键合强度的影响,最后对试制样品进行温度冲击测试,讨论了温度冲击对银烧结显微组织及其剪切强度的影响,以及对铜线键合强度的影响。试验结果表明:一次烧结工艺与分次烧结工艺的芯片剪切强度均达到了工业生产要求的标准值,但分次烧结工艺的银烧结效果在组织结构和芯片剪切强度上都要优于一次烧结工艺;温度冲击测试后烧结银显微组织的烧结颈增大,孔隙增大,并且2种烧结工艺的芯片剪切强度都明显增大。衬板材质对铜线超声键合强度有很大影响,在裸铜活性金属钎焊(Active Metal Braze,AMB)上的键合性能表现出更好的力学性能,温度冲击后裸铜AMB上的键合点力学性能会退化,但镀银AMB上的力学性能反而会增强;结合拉力测试后第二键合点的断裂模式,温度冲击使裸铜AMB上键合点的断裂模式从100%颈部断裂转向焊点脱落,而使镀银AMB上的焊点脱落逐渐减少。
