A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of compo...A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.展开更多
Problems about surface mounting process for fine pitch devices and reasons on solder bridging of L type lead devices welded are depicted. Bridging mechanism and influence factors are analyzed with two-dimensional geom...Problems about surface mounting process for fine pitch devices and reasons on solder bridging of L type lead devices welded are depicted. Bridging mechanism and influence factors are analyzed with two-dimensional geometric model. Based on this, high-density surface mount technology ( SMT) for fine pitch L type lead devices heated by scanning laser is raised. Surface mount process for QFP208 on printed circuit board (PCB) is studied. The results of tests are that it is quite possible to solve the solder bridging of surface mounting for fine pitch devices with scanning laser-heating method.展开更多
This paper discusses the validity of (adaptive) Lagrange generalized plain finite element method (FEM) and plate element method for accurate analysis of acoustic waves in multi-layered piezoelectric structures with ti...This paper discusses the validity of (adaptive) Lagrange generalized plain finite element method (FEM) and plate element method for accurate analysis of acoustic waves in multi-layered piezoelectric structures with tiny interfaces between metal electrodes and surface mounted piezoelectric substrates. We have come to conclusion that the quantitative relationships between the acoustic and electric fields in a piezoelectric structure can be accurately determined through the proposed finite element methods. The higher-order Lagrange FEM proposed for dynamic piezoelectric computation is proved to be very accurate (prescribed relative error 0.02% - 0.04% ) and a great improvement in convergence accuracy over the higher order Mindlin plate element method for piezoelectric structural analysis due to the assumptions and corrections in the plate theories.The converged lagrange finite element methods are compared with the plate element methods and the computedresults are in good agreement with available exact and experimental data. The adaptive Lagrange finite elementmethods and a new FEA computer program developed for macro- and micro-scale analyses are reviewed, and recently extended with great potential to high-precision nano-scale analysis in this paper and the similarities between piezoelectric and seismic wave propagations in layered structures and plates are stressed.展开更多
A chip mounter is the core equipment in the production line of the surface-mount technology,which is responsible for finishing the mount operation.It is the most complex and time-consuming stage in the production proc...A chip mounter is the core equipment in the production line of the surface-mount technology,which is responsible for finishing the mount operation.It is the most complex and time-consuming stage in the production process.Therefore,it is of great significance to optimize the load balance and mounting efficiency of the chip mounter and improve the mounting efficiency of the production line.In this study,according to the specific type of chip mounter in the actual production line of a company,a maximum and minimum model is established to minimize the maximum cycle time of the chip mounter in the production line.The production efficiency of the production line can be improved by optimizing the workload scheduling of each chip mounter.On this basis,a hybrid adaptive optimization algorithm is proposed to solve the load scheduling problem of the mounter.The hybrid algorithm is a hybrid of an adaptive genetic algorithm and the improved ant colony algorithm.It combines the advantages of the two algorithms and improves their global search ability and convergence speed.The experimental results show that the proposed hybrid optimization algorithm has a good optimization effect and convergence in the load scheduling problem of chip mounters.展开更多
文摘A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.
文摘Problems about surface mounting process for fine pitch devices and reasons on solder bridging of L type lead devices welded are depicted. Bridging mechanism and influence factors are analyzed with two-dimensional geometric model. Based on this, high-density surface mount technology ( SMT) for fine pitch L type lead devices heated by scanning laser is raised. Surface mount process for QFP208 on printed circuit board (PCB) is studied. The results of tests are that it is quite possible to solve the solder bridging of surface mounting for fine pitch devices with scanning laser-heating method.
文摘This paper discusses the validity of (adaptive) Lagrange generalized plain finite element method (FEM) and plate element method for accurate analysis of acoustic waves in multi-layered piezoelectric structures with tiny interfaces between metal electrodes and surface mounted piezoelectric substrates. We have come to conclusion that the quantitative relationships between the acoustic and electric fields in a piezoelectric structure can be accurately determined through the proposed finite element methods. The higher-order Lagrange FEM proposed for dynamic piezoelectric computation is proved to be very accurate (prescribed relative error 0.02% - 0.04% ) and a great improvement in convergence accuracy over the higher order Mindlin plate element method for piezoelectric structural analysis due to the assumptions and corrections in the plate theories.The converged lagrange finite element methods are compared with the plate element methods and the computedresults are in good agreement with available exact and experimental data. The adaptive Lagrange finite elementmethods and a new FEA computer program developed for macro- and micro-scale analyses are reviewed, and recently extended with great potential to high-precision nano-scale analysis in this paper and the similarities between piezoelectric and seismic wave propagations in layered structures and plates are stressed.
基金supported by the National Natural Science Foundation of China(Nos.U1911205,62073300,and 62076225)the National Key Research and Development Program of China(No.2021YFB3301602).
文摘A chip mounter is the core equipment in the production line of the surface-mount technology,which is responsible for finishing the mount operation.It is the most complex and time-consuming stage in the production process.Therefore,it is of great significance to optimize the load balance and mounting efficiency of the chip mounter and improve the mounting efficiency of the production line.In this study,according to the specific type of chip mounter in the actual production line of a company,a maximum and minimum model is established to minimize the maximum cycle time of the chip mounter in the production line.The production efficiency of the production line can be improved by optimizing the workload scheduling of each chip mounter.On this basis,a hybrid adaptive optimization algorithm is proposed to solve the load scheduling problem of the mounter.The hybrid algorithm is a hybrid of an adaptive genetic algorithm and the improved ant colony algorithm.It combines the advantages of the two algorithms and improves their global search ability and convergence speed.The experimental results show that the proposed hybrid optimization algorithm has a good optimization effect and convergence in the load scheduling problem of chip mounters.
