This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a ...This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a set of fast transient simulation methods that solve electrical circuits in a leapfrog updating manner without relying on large matrix operations used in conventional Simulation Program with Integrated Circuit Emphasis(SPICE)-based methods which can significantly slow down the solution process.The conversion from the thermal to electrical model is performed first by using the analogy between heat and electrical conduction.Since electrical inductance has no thermal equivalence,a modified VinC LIM formulation is presented which removes the requirement of the insertion of fictitious inductors.Numerical examples are presented,which show that the modified VinC LIM formulation outperforms the basic LIM formulation,in terms of both stability and accuracy in the transient thermal simulation of ICs.展开更多
Conventional base-catalyzed epoxy/aliphatic thiol systems have a poor storage stability,and are impossible to be one-pot systems.A widely accepted solution is to use the latent catalysts,which are usually insoluble an...Conventional base-catalyzed epoxy/aliphatic thiol systems have a poor storage stability,and are impossible to be one-pot systems.A widely accepted solution is to use the latent catalysts,which are usually insoluble anionic initiators sensitive to impurities and moisture,and have many limitations in practical use.In this work,a soluble thiol-terminated imidothioether oligomer(TPI) was synthesized and used as a latent hardener and modifier to prepare one-pot epoxy/thiol systems without the latent catalysts.The latent behavior and curing mechanism of epoxy systems(EP/TPI series),consisted of bisphenol A diglycidyl ether(DGEBA),pentaerythritol tetrakis(mercaptoacetate)(PETMP) and TPI,were proposed.The thiol exchange reaction between TPI and PETMP preceded the curing reaction of DGEBA,and produced aromatic thiols,which were unreactive at ambient conditions and reacted with DGEBA to form the thermosets at temperatures above 130 ℃.At the loading of 24.4 wt%TPI,the epoxy system(EP/TPI-3) had a shelf life of 13 days and was completely cured within 20 min at 180 ℃.Meanwhile,the catalyst-free curing process of EP/TPI-3 system was insensitive to impurities and moisture.Furthermore,the thermal and mechanical properties of EP/TPI-3 thermoset were simultaneously improved,thereinto,the glass transition temperature,Young's modulus and ultimate tensile strength were increased by 16.7 ℃,12.9%,and 13.6%,respectively,compared with those of the commercial DGEBA/PETMP thermoset.This work shows that TPI has the potential to be a powerful alternative to commercial latent catalysts,and EP/TPI thermosets with high performance have broad application prospects.展开更多
目的：研究自发性高血压大鼠降压前后的机械痛阈和热痛阈改变.方法：15只自发性高血压大鼠在实验 d 4～11肌注利血平注射液（1 μg·kg^-1·d^-1）.血压、机械刺激缩足反应阈值和热刺激缩足反应潜伏期作为观察指标.结果：自发...目的：研究自发性高血压大鼠降压前后的机械痛阈和热痛阈改变.方法：15只自发性高血压大鼠在实验 d 4～11肌注利血平注射液（1 μg·kg^-1·d^-1）.血压、机械刺激缩足反应阈值和热刺激缩足反应潜伏期作为观察指标.结果：自发性高血压大鼠经利血平降压治疗后血压明显下降约 50 mmHg 左右,机械痛阈和热痛阈均降低（P＜0.05）.结论：自发性高血压可能对自发性高血压大鼠的伤害性感受系统存在可逆的结构和（或）功能影响.展开更多
基金This work was supported by the Fundamental Research Grant Scheme(FRGS)sponsored by the Ministry of Higher Education,Malaysia under Grant No.FRGS/1/2020/TK0/USM/02/7.
文摘This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a set of fast transient simulation methods that solve electrical circuits in a leapfrog updating manner without relying on large matrix operations used in conventional Simulation Program with Integrated Circuit Emphasis(SPICE)-based methods which can significantly slow down the solution process.The conversion from the thermal to electrical model is performed first by using the analogy between heat and electrical conduction.Since electrical inductance has no thermal equivalence,a modified VinC LIM formulation is presented which removes the requirement of the insertion of fictitious inductors.Numerical examples are presented,which show that the modified VinC LIM formulation outperforms the basic LIM formulation,in terms of both stability and accuracy in the transient thermal simulation of ICs.
基金supported by the project for Enterprise Innovation Plan-High level Enterprise Research Institute’s Program of Guangzhou (202205110010)。
文摘Conventional base-catalyzed epoxy/aliphatic thiol systems have a poor storage stability,and are impossible to be one-pot systems.A widely accepted solution is to use the latent catalysts,which are usually insoluble anionic initiators sensitive to impurities and moisture,and have many limitations in practical use.In this work,a soluble thiol-terminated imidothioether oligomer(TPI) was synthesized and used as a latent hardener and modifier to prepare one-pot epoxy/thiol systems without the latent catalysts.The latent behavior and curing mechanism of epoxy systems(EP/TPI series),consisted of bisphenol A diglycidyl ether(DGEBA),pentaerythritol tetrakis(mercaptoacetate)(PETMP) and TPI,were proposed.The thiol exchange reaction between TPI and PETMP preceded the curing reaction of DGEBA,and produced aromatic thiols,which were unreactive at ambient conditions and reacted with DGEBA to form the thermosets at temperatures above 130 ℃.At the loading of 24.4 wt%TPI,the epoxy system(EP/TPI-3) had a shelf life of 13 days and was completely cured within 20 min at 180 ℃.Meanwhile,the catalyst-free curing process of EP/TPI-3 system was insensitive to impurities and moisture.Furthermore,the thermal and mechanical properties of EP/TPI-3 thermoset were simultaneously improved,thereinto,the glass transition temperature,Young's modulus and ultimate tensile strength were increased by 16.7 ℃,12.9%,and 13.6%,respectively,compared with those of the commercial DGEBA/PETMP thermoset.This work shows that TPI has the potential to be a powerful alternative to commercial latent catalysts,and EP/TPI thermosets with high performance have broad application prospects.
