A thermoelectric generation Stirling engine (TEG-Stirling engine) is discussed by employing a low temperature Stirling engine and the dissipative equation of motion derived from the method of thermomechanical dynamics...A thermoelectric generation Stirling engine (TEG-Stirling engine) is discussed by employing a low temperature Stirling engine and the dissipative equation of motion derived from the method of thermomechanical dynamics (TMD). The results and mechanism of axial flux electromagnetic induction (AF-EMI) are applied to a low temperature Stirling engine, resulting in a TEG-Stirling engine. The method of TMD produced thermodynamically consistent and time-dependent physical quantities for the first time, such as internal energy ℰ(t), thermodynamic work Wth(t), the total entropy (heat dissipation) Qd(t)and measure or temperature of a nonequilibrium state T˜(t). The TMD analysis produced a lightweight mechanical system of TEG-Stirling engine which derives electric power from waste heat of temperature (40˚CT100˚C) by a thermoelectric conversion method. An optimal low rotational speed about 30θ′(t)/(2π)60(rpm) is found, applicable to devices for sustainable, clean energy technologies. The stability of a thermal state and angular rotations of TEG-Stirling engine are specifically shown by employing properties of nonequilibrium temperature T˜(t), which is also applied to study optimal fuel-injection and combustion timings of heat engines.展开更多
The perylene （C20H12） layer effect on the electrical and dielectric properties of Al/p-Si （MS） and Al/perylene/p-Si （MPS） diodes have been investigated and compared in the frequency range of 0.7 kHz-2 MHz. Exper...The perylene （C20H12） layer effect on the electrical and dielectric properties of Al/p-Si （MS） and Al/perylene/p-Si （MPS） diodes have been investigated and compared in the frequency range of 0.7 kHz-2 MHz. Experimental results show that C-V characteristics give an anomalous peak for two structures at low frequencies due to interface states （Nss） and series resistance （Rs）. The increases in C and G/o3 at low frequencies confirm that the charges at interface can easily follow an ac signal and yield excess capacitance and conductance. The frequency-dependent dielectric constant （er） and dielectric loss （e＇） are subtracted using C and G/co data at 1.5 V. The eI and e＂ values are found to be strongly dependent on frequency and voltage, and their large values at low frequencies can be attributed to the excess polarization coming from charges at traps. Plots of ln（o＇ac）-ln（w） for two structures have two linear regions, with slopes of 0.369 and 1.166 for MS, and of 0.077 and 1.061 for MPS, respectively. From the C 2-V characteristics, the doping acceptor atom concentration （NA） and barrier height （,~） for Schottky barrier diodes （SBDs） 1.303 ~ 1015 cm-3, and 1.10 and I. 13 eV, respectively. of MS and MPS types are also obtained to be 1.484 ~ 1015展开更多
In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonst...In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonstrate better performances of recessed-gate A1203 MIS-HEMTs which are fabricated by Fluorine-based Si3N4 etching and chlorine- based A1CaN etching with three etching times （15 s, 17 s and 19 s）. The gate leakage current of MIS-HEMT is about three orders of magnitude lower than that of A1GaN/CaN HEMT. Through the recessed-gate etching, the transconductanee increases effectively. When the recessed-gate depth is 1.02 nm, the best interface performance with Tit----（0.20--1.59） p^s and Dit ：（0.55-1.08）x 1012 cm-2.eV- 1 can be obtained. After chlorine-based etching, the interface trap density reduces considerably without generating any new type of trap. The accumulated chlorine ions and the N vacancies in the AIGaN surface caused by the plasma etching can degrade the breakdown and the high frequency performances of devices. By comparing the characteristics of recessed-gate MIS-HEMTs with different etching times, it is found that a low power chlorine-based plasma etching for a short time （15 s in this paper） can enhance the performances of MIS-HEMTs effectively.展开更多
文摘A thermoelectric generation Stirling engine (TEG-Stirling engine) is discussed by employing a low temperature Stirling engine and the dissipative equation of motion derived from the method of thermomechanical dynamics (TMD). The results and mechanism of axial flux electromagnetic induction (AF-EMI) are applied to a low temperature Stirling engine, resulting in a TEG-Stirling engine. The method of TMD produced thermodynamically consistent and time-dependent physical quantities for the first time, such as internal energy ℰ(t), thermodynamic work Wth(t), the total entropy (heat dissipation) Qd(t)and measure or temperature of a nonequilibrium state T˜(t). The TMD analysis produced a lightweight mechanical system of TEG-Stirling engine which derives electric power from waste heat of temperature (40˚CT100˚C) by a thermoelectric conversion method. An optimal low rotational speed about 30θ′(t)/(2π)60(rpm) is found, applicable to devices for sustainable, clean energy technologies. The stability of a thermal state and angular rotations of TEG-Stirling engine are specifically shown by employing properties of nonequilibrium temperature T˜(t), which is also applied to study optimal fuel-injection and combustion timings of heat engines.
文摘The perylene （C20H12） layer effect on the electrical and dielectric properties of Al/p-Si （MS） and Al/perylene/p-Si （MPS） diodes have been investigated and compared in the frequency range of 0.7 kHz-2 MHz. Experimental results show that C-V characteristics give an anomalous peak for two structures at low frequencies due to interface states （Nss） and series resistance （Rs）. The increases in C and G/o3 at low frequencies confirm that the charges at interface can easily follow an ac signal and yield excess capacitance and conductance. The frequency-dependent dielectric constant （er） and dielectric loss （e＇） are subtracted using C and G/co data at 1.5 V. The eI and e＂ values are found to be strongly dependent on frequency and voltage, and their large values at low frequencies can be attributed to the excess polarization coming from charges at traps. Plots of ln（o＇ac）-ln（w） for two structures have two linear regions, with slopes of 0.369 and 1.166 for MS, and of 0.077 and 1.061 for MPS, respectively. From the C 2-V characteristics, the doping acceptor atom concentration （NA） and barrier height （,~） for Schottky barrier diodes （SBDs） 1.303 ~ 1015 cm-3, and 1.10 and I. 13 eV, respectively. of MS and MPS types are also obtained to be 1.484 ~ 1015
基金supported by the National Key Science and Technology Special Project,China (Grant No. 2008ZX01002-002)the National Natural Science Foundation of China (Grant No. 60736033)
文摘In this paper, in order to solve the interface-trap issue and enhance the transconductance induced by high-k dielectric in metal-insulator-semiconductor （MIS） high electron mobility transistors （HEMTs）, we demonstrate better performances of recessed-gate A1203 MIS-HEMTs which are fabricated by Fluorine-based Si3N4 etching and chlorine- based A1CaN etching with three etching times （15 s, 17 s and 19 s）. The gate leakage current of MIS-HEMT is about three orders of magnitude lower than that of A1GaN/CaN HEMT. Through the recessed-gate etching, the transconductanee increases effectively. When the recessed-gate depth is 1.02 nm, the best interface performance with Tit----（0.20--1.59） p^s and Dit ：（0.55-1.08）x 1012 cm-2.eV- 1 can be obtained. After chlorine-based etching, the interface trap density reduces considerably without generating any new type of trap. The accumulated chlorine ions and the N vacancies in the AIGaN surface caused by the plasma etching can degrade the breakdown and the high frequency performances of devices. By comparing the characteristics of recessed-gate MIS-HEMTs with different etching times, it is found that a low power chlorine-based plasma etching for a short time （15 s in this paper） can enhance the performances of MIS-HEMTs effectively.
