A Geiger mode planar InGaAs/InP avalanche photodiode （APD） with a cascade peripheral junction structure to suppress edge breakdowns is designed by finite-element analysis. The photodiode breakdown voltage is reduced...A Geiger mode planar InGaAs/InP avalanche photodiode （APD） with a cascade peripheral junction structure to suppress edge breakdowns is designed by finite-element analysis. The photodiode breakdown voltage is reduced to 54.3V by controlling the central junction depth, while the electric field distribution along the device central axis is controlled by adjusting doping level and thickness of the lnP field control layer. Using a cascade junction structure at the periphery of the active area, premature edge breakdowns are effectively suppressed. The simulations show that the quadra-cascade structure is a good trade-off between suppression performance and fabrication complexity, with a reduced peak electric field of 5.2 × 10^5 kV/cm and a maximum hole ionization integral of 1. 201. Work presented in this paper provides an effective way to design high performance photon counting InGaAs/InP avalanche photodiodes.展开更多
We design and fabricate 4H-SiC UV avalanche photodiodes （APDs） ~qth positive beveled mesa, which exhibit low leakage current and high avalanche gain when working in the Geiger mode. The single photon counting perfor...We design and fabricate 4H-SiC UV avalanche photodiodes （APDs） ~qth positive beveled mesa, which exhibit low leakage current and high avalanche gain when working in the Geiger mode. The single photon counting performance of the SiC APDs is studied by using a passive-quenching circuit. A new method to determine the exact breakdown voltage of the APD is proposed based on the initial emergence of photon count pulses. The photon count rate and dark count rate of the APD are also evaluated as a function of quenching resistance.展开更多
Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is ...Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.展开更多
文摘A Geiger mode planar InGaAs/InP avalanche photodiode （APD） with a cascade peripheral junction structure to suppress edge breakdowns is designed by finite-element analysis. The photodiode breakdown voltage is reduced to 54.3V by controlling the central junction depth, while the electric field distribution along the device central axis is controlled by adjusting doping level and thickness of the lnP field control layer. Using a cascade junction structure at the periphery of the active area, premature edge breakdowns are effectively suppressed. The simulations show that the quadra-cascade structure is a good trade-off between suppression performance and fabrication complexity, with a reduced peak electric field of 5.2 × 10^5 kV/cm and a maximum hole ionization integral of 1. 201. Work presented in this paper provides an effective way to design high performance photon counting InGaAs/InP avalanche photodiodes.
基金Supported by the National Basic Research Program of China under Grant Nos 2011CB301900 and 2011CB922100the Priority Academic Program Development of Jiangsu Higher Education Institutions
文摘We design and fabricate 4H-SiC UV avalanche photodiodes （APDs） ~qth positive beveled mesa, which exhibit low leakage current and high avalanche gain when working in the Geiger mode. The single photon counting performance of the SiC APDs is studied by using a passive-quenching circuit. A new method to determine the exact breakdown voltage of the APD is proposed based on the initial emergence of photon count pulses. The photon count rate and dark count rate of the APD are also evaluated as a function of quenching resistance.
基金The Natural Science Foundation of Jiangsu Province(No.BK2012559)Qing Lan Project of Jiangsu Province
文摘Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.
