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Interfacial microstructure and mechanical behavior of Mg/Cu bimetal composites fabricated by compound casting process 被引量:7
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作者 De-xing XU Chang-lin YANG +2 位作者 Kang-ning ZHAO Hong-xiang LI Ji-shan ZHANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2019年第6期1233-1241,共9页
Mg/Cu bimetal composites were prepared by compound casting method, and the microstructure evolution, phase constitution and bonding strength at the interface were investigated.It is found that a good metallurgical bon... Mg/Cu bimetal composites were prepared by compound casting method, and the microstructure evolution, phase constitution and bonding strength at the interface were investigated.It is found that a good metallurgical bonding can be achieved at the interface of Mg and Cu,which consists of two sub-layers,i.e.,layer I with 30μm on the copper side composed of Mg2Cu matrix phase, on which a small amount of dendritic MgCu2 phase was randomly distributed;layerⅡ with 140μm on the magnesium side made up of the lamellar nano-eutectic network Mg2Cu+(Mg) and a small amount of detached Mg2Cu phase. The average interfacial shear strength of the bimetal composite is measured to be 13 MPa.This study provides a new fabrication process for the application of Mg/Cu bimetal composites as the hydrogen storage materials. 展开更多
关键词 Mg/Cu bimetal composites compound casting interfacial bonding mechanism interfacial microstructure interfacial mechanical behavior
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