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Recent advances and key opportunities on in-plane micro-supercapacitors:From functional microdevices to smart integrated microsystems 被引量:1
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作者 Jieqiong Qin Hongtao Zhang +4 位作者 Zhi Yang Xiao Wang Pratteek Das Feng Zhou Zhong-Shuai Wu 《Journal of Energy Chemistry》 SCIE EI CAS CSCD 2023年第6期410-431,I0010,共23页
The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalit... The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalities(e.g.,high voltage,flexibility,stretchability,self-healing,electrochromism and photo/thermal response)to PMSCs is essential for building multifunctional PMSCs and their smart selfpowered integrated microsystems.In this review,we summarized the latest advances in PMSCs from various functional microdevices to their smart integrated microsystems.Primarily,the functionalities of PMSCs are characterized by three major factors to emphasize their electrochemical behavior and unique scope of application.These include but are not limited to high-voltage outputs(realized through asymmetric configuration,novel electrolyte and modular integration),mechanical resilience that includes various feats of flexibility or stretchability,and response to stimuli(self-healing,electrochromic,photo-responsive,or thermal-responsive properties).Furthermore,three representative integrated microsystems including energy harvester-PMSC,PMSC-energy consumption,and all-in-one selfpowered microsystems are elaborately overviewed to understand the emerging intelligent interaction models.Finally,the key perspectives,challenges and opportunities of PMSCs for powering smart microelectronics are proposed in brief. 展开更多
关键词 Micro-supercapacitors IN-PLANE Functionalization Integrated microsystem Energy storage
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High-Performance and Flexible Co-Planar Integrated Microsystem of Carbon-Based All-Solid-State Micro-Supercapacitor and Real-Time Temperature Sensor 被引量:1
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作者 Dongming Liu Jiaxin Ma +6 位作者 Shuanghao Zheng Wenlong Shao Tianpeng Zhang Siyang Liu Xigao Jian Zhongshuai Wu Fangyuan Hu 《Energy & Environmental Materials》 SCIE EI CAS CSCD 2023年第6期291-296,共6页
With the rapid development of flexible and portable microelectronics,the extreme demand for miniaturized,mechanically flexible,and integrated microsystems are strongly stimulated.Here,biomass-derived carbons(BDCs)are ... With the rapid development of flexible and portable microelectronics,the extreme demand for miniaturized,mechanically flexible,and integrated microsystems are strongly stimulated.Here,biomass-derived carbons(BDCs)are prepared by KOH activation using Qamgur precursor,exhibiting three-dimensional(3D)hierarchical porous structure.Benefiting from unobstructed 3D hierarchical porous structure,BDCs provide an excellent specific capacitance of 433 F g^(-1)and prominent cyclability without capacitance degradation after 50000 cycles at 50 A g^(-1).Furthermore,BDC-based planar micro-supercapacitors(MSCs)without metal collector,prepared by mask-assisted coating,exhibit outstanding areal-specific capacitance of 84 mF cm^(-2)and areal energy density of 10.6μWh cm^(-2),exceeding most of the previous carbon-based MSCs.Impressively,the MSCs disclose extraordinary flexibility with capacitance retention of almost 100%under extreme bending state.More importantly,a flexible planar integrated system composed of the MSC and temperature sensor is assembled to efficiently monitor the temperature variation,providing a feasible route for flexible MSC-based functional micro-devices. 展开更多
关键词 3D hierarchical porous carbon biomass-derived carbon integrated microsystem micro-supercapacitors temperature sensor
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A combined virtual impactor and field-effect transistor microsystem for particulate matter separation and detection 被引量:2
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作者 Yanna Li Muqing Fu +2 位作者 Wei Pang Ye Chang Xuexin Duan 《Nanotechnology and Precision Engineering》 CAS CSCD 2021年第1期17-25,共9页
Ambient suspended particulate matter(PM)(primarily with particle diameter 2.5m or less,i.e.,PM2.5)can adversely affect ecosystems and human health.Currently,optical particle sensors based on light scattering dominate ... Ambient suspended particulate matter(PM)(primarily with particle diameter 2.5m or less,i.e.,PM2.5)can adversely affect ecosystems and human health.Currently,optical particle sensors based on light scattering dominate the portable PM sensing market.However,the light scattering method has poor adaptability to different-sized PM and adverse environmental conditions.Here,we design and develop a portable PM sensing microsystem that consists of a micromachined virtual impactor(VI)for particle separation,a thermophoretic deposition chip for particle collection,and an extended-gate field-effect transistor(FET)for particle analysis.This system can realize on-site separation,collection,and analysis of aerosol particles without being influenced by environmental factors.In this study,the design of the VI is thoroughly analyzed by numerical simulation,and mixtures of different-sized silicon dioxide(SiO2)particles are used in an experimental verification of the performance of the VI and FET.Considering the low cost and compact design of the whole system,the proposed PM analysis microsystem has potential for PM detection under a wide range of conditions,such as heavily polluted industrial environments and for point-of-need outdoor and indoor air quality monitoring. 展开更多
关键词 Particulate matter microsystem Virtual impactor 50%cutoff diameter Field-effect transistor
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Emerging miniaturized energy storage devices for microsystem applications:from design to integration 被引量:6
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作者 Huaizhi Liu Guanhua Zhang +2 位作者 Xin Zheng Fengjun Chen Huigao Duan 《International Journal of Extreme Manufacturing》 EI 2020年第4期1-28,共28页
The rapid progress of micro/nanoelectronic systems and miniaturized portable devices has tremendously increased the urgent demands for miniaturized and integrated power supplies.Miniaturized energy storage devices(MES... The rapid progress of micro/nanoelectronic systems and miniaturized portable devices has tremendously increased the urgent demands for miniaturized and integrated power supplies.Miniaturized energy storage devices(MESDs),with their excellent properties and additional intelligent functions,are considered to be the preferable energy supplies for uninterrupted powering of microsystems.In this review,we aim to provide a comprehensive overview of the background,fundamentals,device configurations,manufacturing processes,and typical applications of MESDs,including their recent advances.Particular attention is paid to advanced device configurations,such as two-dimensional(2D)stacked,2D planar interdigital,2D arbitrary-shaped,three-dimensional planar,and wire-shaped structures,and their corresponding manufacturing strategies,such as printing,scribing,and masking techniques.Additionally,recent developments in MESDs,including microbatteries and microsupercapacitors,as well as microhybrid metal ion capacitors,are systematically summarized.A series of on-chip microsystems,created by integrating functional MESDs,are also highlighted.Finally,the remaining challenges and future research scope on MESDs are discussed. 展开更多
关键词 microsystems miniaturized energy storage devices MICROBATTERIES microsupercapacitors microhybrid metal ion capacitors
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Design of Secure Microsystems Using Current-to-Data Dependency Analysis 被引量:1
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作者 Haleh Vahedi Radu Muresan Stefano Gregori 《Circuits and Systems》 2013年第2期137-146,共10页
This paper presents a method for designing a class of countermeasures for DPA attacks based on attenuation of current variations. In this class of countermeasures, designers aim at decreasing the dynamic current varia... This paper presents a method for designing a class of countermeasures for DPA attacks based on attenuation of current variations. In this class of countermeasures, designers aim at decreasing the dynamic current variations to reduce the information that can be extracted from the current consumption of secure microsystems. The proposed method is based on a novel formula that calculates the number of current traces required for a successful DPA attack using the characteristics of the microsystem current signal and the external noise of the measurement setup. The different stages of the proposed method are illustrated through designing an example current flattening circuit. Meanwhile validity and applicability of the proposed formula is verified by comparing theoretical results with those obtained experimentally for the example circuit. The proposed formula not only estimates the required level of attenuation for a target level of robustness defined by design requirements, it also predicts the effectiveness of a countermeasure using simulation results therefore dramatically reducing the time to design of secure microsystems. 展开更多
关键词 SECURE microsystems Differential Power ANALYSIS ATTACK COUNTERMEASURE CURRENT FLATTENING Circuit
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Study on Wireless Power Transmission for Gastrointestinal Microsystems Based on Inductive Coupling 被引量:8
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作者 MA Guan-ying YAN Guo-zheng HE Xiu 《Chinese Journal of Biomedical Engineering(English Edition)》 2007年第2期71-78,共8页
Wireless power transmission based on inductive coupling for remotely implanted micro devices has been considered in this paper. The receiving coil, integrated in microsystems and the external transmitting coil compose... Wireless power transmission based on inductive coupling for remotely implanted micro devices has been considered in this paper. The receiving coil, integrated in microsystems and the external transmitting coil compose a loosely coupled transformer. The coupling coefficient was calculated and measured on spacing misalignments. The geometric size of transmitting coil was analyzed for the target of remotely delivering power. The received power was maximized by choosing appropriate value of frequency, tuning capacitance and the load resistance. A conventional full bridge rectifier circuit was employed to convert ac to dc voltage. The received dc power was up to 160 mW with a transmitting vohage of 5 Vrms when the receiving coil was placed at the center of the transmitting coil. This may meet the requirement of some microsystems for high power over a long time. 展开更多
关键词 power transmission gastrointestinal tract microsystems coupling coefficient
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JK Microsystems嵌入式功率控制器
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《电子产品世界》 2003年第07B期100-101,共2页
JK Microsystems公司推出一种嵌入式功率控制器,把调整,监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上,从而简化了电源设计。该板给设计者提供一种包括电压调整,电源开/关时... JK Microsystems公司推出一种嵌入式功率控制器,把调整,监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上,从而简化了电源设计。该板给设计者提供一种包括电压调整,电源开/关时间表和电压监视的现成解决方案。从太阳能板或电池传来的电源电压能控制输出1A的电流。 展开更多
关键词 嵌入式 microsystems公司 解决方案 电源管理 器件 平台 电压监视 电源设计 电源电压 电池
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Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications
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作者 XIA Chenhui WANG Gang +1 位作者 WANG Bo MING Xuefei 《ZTE Communications》 2020年第3期33-41,共9页
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra... A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications. 展开更多
关键词 AIP fan‐out package RF microsystem 3D integration 5G communications
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1994成功一年,1995充满机会——访Sun Microsystems公司国际市场业务总监Darlene Yaplee
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作者 刘洪 《电子产品世界》 1995年第1期66-66,共1页
新年将近,记者采访了专程从美国赶来参加与太极计算机公司的合作项目签字仪式的Sun Microsystems公司国际市场业务总监Darlene Yaplee小姐,请她谈了谈公司1994年所取得的成就以及对1995年的有关工作站市场的展望.Darlene小姐介绍说,199... 新年将近,记者采访了专程从美国赶来参加与太极计算机公司的合作项目签字仪式的Sun Microsystems公司国际市场业务总监Darlene Yaplee小姐,请她谈了谈公司1994年所取得的成就以及对1995年的有关工作站市场的展望.Darlene小姐介绍说,1994年对Sun来说是十分成功的一年,尤其是在工作站、服务器业务方面取得很大成绩.IDC统计表明,Sun在UNIX工作站和服务器方面排名第一,在数据库平台方面亦排在第一位,全球最大的数据库Oracle即运行于Sun的工作站上,总容量达360GB;在Internet服务器方面,86%是使用Sun的服务器,50%以上软件是在Sun的平台上开发出来的.过去的一年,Sun在自己所拥有的市场上与合作伙伴进一步加强了合作,与数据库。 展开更多
关键词 microsystems公司 市场业务 数据库平台 INTERNET服务器 SPARC UNIX工作站 太极计算机公司 文件服务器 Oracle 合作伙伴
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Allegro MicroSystems推出采用专利控制技术的最新LED驱动系列产品
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《世界电子元器件》 2019年第4期52-52,共1页
新产品系列采用小型4x4封装,能够实现超大的真正PWM调光比运动控制和高能效系统电源和传感解决方案的全球领导厂商Allegro MicroSystems(以下简称Allegro)宣布推出最新一代先进LED背光驱动器A8060x系列,该系列器件采用了创新的专利技术P... 新产品系列采用小型4x4封装,能够实现超大的真正PWM调光比运动控制和高能效系统电源和传感解决方案的全球领导厂商Allegro MicroSystems(以下简称Allegro)宣布推出最新一代先进LED背光驱动器A8060x系列,该系列器件采用了创新的专利技术Pre-Emptive Boost(PEB)控制,能够消除通常可听到的噪音。 展开更多
关键词 LED ALLEGRO microsystems 调光比 控制技术
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Procom与Sun Microsystems签署多年技术协议
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《电子与电脑》 2004年第5期144-144,共1页
关键词 Procom公司 SUN microsystems公司 技术协议 OEM
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Allegro MicroSystems推出最先进的变速箱速度传感器IC
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作者 俞庆华 《汽车零部件》 2019年第2期50-50,共1页
2019年1月16日,Allegro MicroSystems宣布推出公司最先进的获ASIL B认证的变速箱速度传感器系列产品A19520、A19530和A19570,这些新磁传感器IC是Allegro近20年产业应用经验和技术进步的结晶,其中包括了先进的巨磁阻(GMR)和霍尔效应技术... 2019年1月16日,Allegro MicroSystems宣布推出公司最先进的获ASIL B认证的变速箱速度传感器系列产品A19520、A19530和A19570,这些新磁传感器IC是Allegro近20年产业应用经验和技术进步的结晶,其中包括了先进的巨磁阻(GMR)和霍尔效应技术,使新产品成为满足当今变速箱应用苛刻要求的理想选择。 展开更多
关键词 变速箱 ALLEGRO microsystems 速度传感器 IC
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Natural MicroSystems
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《中国电信建设》 1998年第8期80-80,共1页
Natural MicroSystems公司是居领导地位的电信设备供应商,以发展优秀的电脑化电话应用平台或称开放式电讯解决方案着称。本公司具备登峰造极的技术,能帮助业务夥伴迅速开发具高增值的电脑化电话系统,回应市场需要,当中包括互联网(In... Natural MicroSystems公司是居领导地位的电信设备供应商,以发展优秀的电脑化电话应用平台或称开放式电讯解决方案着称。本公司具备登峰造极的技术,能帮助业务夥伴迅速开发具高增值的电脑化电话系统,回应市场需要,当中包括互联网(Internet)话音与传真系统、 展开更多
关键词 NATURAL microsystems公司 电信设备 电脑化电话 市场
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Allegro MicroSystems,LLC发布两款高带宽电流传感器以补充现有的产品系列
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《世界电子元器件》 2017年第12期50-50,共1页
Allegro MicroSystems,LLC宣布在现有的高带宽系列电流传感器基础上增加新一代产品ACS732和ACS733,新产品能够为测量DC/DC转换器和其他开关电源应用中的高频电流提供紧凑、快速和精确的解决方案,这些器件是Allegro首次提供的具有1MHz带... Allegro MicroSystems,LLC宣布在现有的高带宽系列电流传感器基础上增加新一代产品ACS732和ACS733,新产品能够为测量DC/DC转换器和其他开关电源应用中的高频电流提供紧凑、快速和精确的解决方案,这些器件是Allegro首次提供的具有1MHz带宽和3600VRMS额定隔离度的产品。ACS732和ACS733为基于霍尔效应的电流传感器,集成有用户可配置的过流故障检测等功能。 展开更多
关键词 电流传感器 Allegro microsystems LLC 高带宽
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2.4 V ultrahigh-voltage aqueous MXene-based asymmetric micro-supercapacitors with high volumetric energy density toward a self-sufficient integrated microsystem 被引量:3
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作者 Yuanyuan Zhu Shuanghao Zheng +4 位作者 Jieqiong Qin Jiaxin Ma Pratteek Das Feng Zhou Zhong-Shuai Wu 《Fundamental Research》 CAS CSCD 2024年第2期307-314,共8页
Two-dimensional MXenes are key high-capacitance electrode materials for micro-supercapacitors(MSCs)catering to integrated microsystems.However,the narrow electrochemical voltage windows of conventional aqueous electro... Two-dimensional MXenes are key high-capacitance electrode materials for micro-supercapacitors(MSCs)catering to integrated microsystems.However,the narrow electrochemical voltage windows of conventional aqueous electrolytes(≤1.23 V)and symmetric MXene MSCs(typically≤0.6 V)substantially limit their output voltage and energy density.Highly concentrated aqueous electrolytes exhibit lower water molecule activity,which inhibits water splitting and consequently widens the operating voltage window.Herein,we report ultrahigh-voltage aqueous planar asymmetric MSCs(AMSCs)based on a highly concentrated LiCl-gel quasi-solid-state electrolyte with MXene(Ti3C2Tx)as the negative electrode and MnO_(2) nanosheets as the positive electrode(MXene//MnO_(2)-AMSCs).The MXene//MnO_(2)-AMSCs exhibit a high voltage of up to 2.4 V,attaining an ultrahigh volumetric energy density of 53 mWh cm−3.Furthermore,the in-plane geometry and the quasi-solid-state electrolyte enabled excellent mechanical flexibility and performance uniformity in the serially/parallel connected packs of our AMSCs.Notably,the MXene//MnO_(2)-AMSC-based integrated microsystem,in conjunction with solar cells and consumer electronics,could efficiently realize simultaneous energy harvesting,storage,and conversion.The findings of this study provide insights for constructing high-voltage aqueous MXene-based AMSCs as safe and self-sufficient micropower sources in smart integrated microsystems. 展开更多
关键词 Asymmetric micro-supercapacitors MXene MnO_(2) Aqueous electrolyte High voltage Integrated microsystem
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Engineering applications and technical challenges of active array microsystems
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作者 Jiaguo LU Haoran ZHU 《Frontiers of Information Technology & Electronic Engineering》 SCIE EI CSCD 2024年第3期342-368,共27页
In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly d... In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly described.Owing to the high efficiency,low profile,and light weight of the active array microsystems,the application prospects and advantages in the engineering of multi-functional airborne radar,spaceborne radar,and communication systems are analyzed.Moreover,according to the characteristics of the post-Moore era of integrated circuits,scientific and technological problems in the active array microsystems are presented,including multi-scale,multi-signal,and multi-physics field coupling.The challenges are also discussed,such as new architectures and algorithms,miniaturization of passive components,novel materials and processes,ultra-wideband technology,and new interdisciplinary technological applications.This paper is expected to inspire in-depth research on active array microsystems. 展开更多
关键词 MICROELECTRONICS Heterogeneous integration Packaging materials Antenna array microsystems Multi-functional radar Communication
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Zinc micro-energy storage devices powering microsystems
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作者 Junbing Zhu Wenxi Hu +1 位作者 Jiangfeng Ni Liang Li 《National Science Open》 2024年第5期165-191,共27页
The increasing popularity of the Internet of Things and the growing microelectronics market have led to a heightened demand for microscale energy storage devices,such as microbatteries and microsupercapacitors.Althoug... The increasing popularity of the Internet of Things and the growing microelectronics market have led to a heightened demand for microscale energy storage devices,such as microbatteries and microsupercapacitors.Although lithium microbatteries have dominated the market,safety concerns arising from incidents like self-ignition and explosions have prompted a shift towards new microscale energy storage devices prioritizing high safety.Zinc-based micro-energy storage devices(ZMSDs),known for their high safety,low cost,and favorable electrochemical performance,are emerging as promising alternatives to lithium microbatteries.However,challenges persist in the fabrication of microelectrodes,electrolyte infusion,device packaging,and integration with microelectronics.Despite these challenges,significant progress has been made over the last decade.This review focuses on the challenges and recent advancements in zinc-based micro-energy storage,offering unique insights into their applications and paving the way for the commercial deployment of high-performance ZMSDs. 展开更多
关键词 energy storage device MICROBATTERY microsupercapacitor microsystem
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Advancing MXene-based integrated microsystems with microsupercapacitors and/or sensors:Rational design,key progress,and challenging perspectives 被引量:2
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作者 Jin Jia Yuanyuan Zhu +4 位作者 Pratteek Das Jiaxin Ma Sen Wang Guang Zhu Zhong-Shuai Wu 《Journal of Materiomics》 SCIE CSCD 2023年第6期1242-1262,共21页
The escalating demand for micro/nano-sized devices,such as micro/nano-robots,intelligent portable/wearable microsystems,and implantable medical microdevices,necessitates the expeditious development of integrated micro... The escalating demand for micro/nano-sized devices,such as micro/nano-robots,intelligent portable/wearable microsystems,and implantable medical microdevices,necessitates the expeditious development of integrated microsystems incorporating energy conversion,storage,and consumption.Critical bottlenecks in microscale energy storage/sensors and their integrated systems are being addressed by exploring new technologies and new materials,e.g.,MXene,holding great potential for developing lightweight and deformable integrated microdevices.This review summarizes the latest progress and milestones in the realization of MXene-based micro-supercapacitors(MSCs)and sensor arrays,and thus discusses the design fundamentals and key advancements of MXene-based energy conversion-storageconsumption integrated microsystems.Finally,we outline the key challenges in fabricating MXenebased MSCs/sensors and their self-powered integrated microsystems,which is crucial for their practical applications.Particularly,we illuminate viable solutions to such unsolved issues and highlight the exciting opportunities. 展开更多
关键词 MXene Micro-supercapacitors SENSORS SELF-POWERED Integrated microsystem
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射频异构集成微系统多层级协同仿真建模与PDK技术综述 被引量:1
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作者 刘军 高爽 +2 位作者 汪曾达 王大伟 陈展飞 《微电子学与计算机》 2024年第1期11-25,共15页
作为后摩尔技术的可选路径之一,基于异构集成工艺实现的集成微系统具有高集成度、低成本、高性能等优点,引起学术界和工业界的广泛关注。异构集成微系统设计是以系统为中心的多层级协同设计,对传统以晶体管为中心的设计方法和设计流程... 作为后摩尔技术的可选路径之一,基于异构集成工艺实现的集成微系统具有高集成度、低成本、高性能等优点,引起学术界和工业界的广泛关注。异构集成微系统设计是以系统为中心的多层级协同设计,对传统以晶体管为中心的设计方法和设计流程带来新的挑战,同时对设计环境的开发带来新的要求。本文对射频集成微系统设计中所需的基础器件/结构建模方法、多工艺混合工艺设计套件(Process Design Kit,PDK)技术、以及电路-模块-系统多层级协同仿真等技术最新进展进行综述。 展开更多
关键词 异构集成射频微系统 多层级协同仿真 建模方法 多工艺混合 工艺设计套件(PDK)
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一种基于硅基MEMS三维异构集成技术的T/R组件
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作者 陈兴 张超 +1 位作者 李晓林 赵永志 《太赫兹科学与电子信息学报》 2024年第3期331-336,共6页
基于硅基微电子机械系统(MEMS)三维异构集成工艺,设计并制作了用于相控阵天线系统的三维堆叠式Ku波段双通道T/R组件。该组件由两层硅基结构通过球栅阵列(BGA)植球堆叠而成,上下两层硅基封装均采用5层硅片通过硅通孔(TSV)、晶圆级键合工... 基于硅基微电子机械系统(MEMS)三维异构集成工艺,设计并制作了用于相控阵天线系统的三维堆叠式Ku波段双通道T/R组件。该组件由两层硅基结构通过球栅阵列(BGA)植球堆叠而成,上下两层硅基封装均采用5层硅片通过硅通孔(TSV)、晶圆级键合工艺实现。组件集成了六位数控移相、六位数控衰减、串转并、电源调制、逻辑控制等功能,最终组件尺寸仅为15 mm×8 mm×3.8 mm。测试结果表明,在Ku波段内,该组件发射通道饱和输出功率大于24 dBm,单通道发射增益大于20 dB,接收通道增益大于20 dB,噪声系数小于3.0 dB。该组件性能好,质量轻,体积小,加工精确度高,组装效率高。 展开更多
关键词 微系统 硅基MEMS 收发组件 三维集成
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