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Key Technologies and Development Trends in Advanced Intelligent Sawing Equipments 被引量:3
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作者 Yangyu Wang Yongle Zhang +1 位作者 Dapeng Tan Yongchao Zhang 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2021年第3期175-194,共20页
As a starting point in equipment manufacturing,sawing plays an important role in industrial production.Intelligent manufacturing equipment is an important carrier of intelligent manufacturing technologies.Due to the b... As a starting point in equipment manufacturing,sawing plays an important role in industrial production.Intelligent manufacturing equipment is an important carrier of intelligent manufacturing technologies.Due to the backwardness of intelligent technology,the comprehensive performance of sawing equipments in China is obviously different from that in foreign countries.State of the art of advanced sawing equipments is investigated along with the technical bottleneck of sawing machine tool manufacturing,and a new industrial scheme of replacing turning-milling by sawing is described.The key technologies of processing-measuring integrated control,multi-body dynamic optimization,the collaborative sawing network framework,the distributed cloud sawing platform,and the self-adapting service method are analyzed;with consideration of the problems of poor processing control stableness,low single machine intelligence level,no on-line processing data service and active flutter suppression of sawing with wide-width and heavy-load working conditions.Suggested directions for further research,industry implementation,and industry-research collaboration are provided. 展开更多
关键词 sawing equipments Processing-measuring integrated control Collaborative sawing framework Intelligent network middleware sawing cloud service platform
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Sawing Performance Comparison of Brazed and Sintered Diamond Wires 被引量:4
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作者 HUANG Guoqin XU Xipeng 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2013年第2期393-399,共7页
Great attention has been paid on fabricating diamond wire by using the brazing diamond because of its strong chemical bonding strength and controllability of grits distribution. Although several serving performances o... Great attention has been paid on fabricating diamond wire by using the brazing diamond because of its strong chemical bonding strength and controllability of grits distribution. Although several serving performances of brazed diamond wire have been reported, seldom do these studies refer to its process characteristics. Sawing performances of a brazed diamond wire are investigated and compared with those of a sintered diamond wire on a wire saw machine. The surface topographies of beads selected from the two wires are micro observed before sawing. The sawing tests are carried out in constant feed rate feeding(CFF) and constant normal force feeding(CNFF). In CFF test, sawing force, power, and the cut depths of positions on contact curve are measured. Then, coupled with the observations of beads topographies, sawing force and its ratio, relations of power against material removal rate, and contact curve linearity are compared and discussed. In CNFF test, the sawing rates of the two wires are investigated. The results indicate that the brazed wire performs with lower sawing force(less 16% of tangential force and 28% of normal force), more energy efficiency(nearly one-fifth of sawing power is saved), at a higher sawing rate (the rate is doubled) and with better contact curve linearity as compared with the sintered wire. This proposed research experimentally evaluates the sawing performances of brazed diamond wire from the aspect of process parameters, which can provide a basis for popularizing the brazed diamond wire. 展开更多
关键词 diamond wire BRAZE SINTER sawing force power contact curve
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Quantitative Analysis of the Loads Acting on the Abrasive Grits in the Diamond Sawing of Granites 被引量:2
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作者 XU Xi-peng, LI Yuan, ZENG Wei-ming, LI Liang-bin (Province Key Lab of Stone Machining, Huaqiao University, Quanzhou 362 011, China) 《厦门大学学报(自然科学版)》 CAS CSCD 北大核心 2002年第S1期121-122,共2页
An experimental study was carried out to quantitati ve ly evaluate the loads acting on the diamond grits during circular sawing of two kinds of typical granite with diamond segmented saw blade. Measurements were mad e... An experimental study was carried out to quantitati ve ly evaluate the loads acting on the diamond grits during circular sawing of two kinds of typical granite with diamond segmented saw blade. Measurements were mad e of the horizontal and vertical force components and the consumed power in order to obtain the tangential and the normal force components. The temperatures at the diamond-granite contact zone were measured using a foil thermocouple. T he measurement, together with the net sawing power, was subsequently used to est imate the energy partition to the granite by a temperature matching technique. B ased on the energy partition values, the temperatures at individual cutting poin ts were estimated using an analytical model. SEM was used to follow the topograp hies of worn diamond segments. The average force acting on each diamond grit was found to be only 4% of the diamond compressive strength measured by a static me thod. The strength disparity of diamond grits and the random protrusion of grits beyond bond matrix should be significant factors in accounting for the wear of diamond grits. The wear of diamond grits was also found to be closely related to the high temperatures generated at individual cutting points and the pop-outs of diamonds from the bond matrix might be mainly attributed to the heat conducte d to the segments. 展开更多
关键词 force temperature diamond sawing GRANITE dis parity
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Preparation and Optimization of High-Purity Silicon Carbide Magnetic Abrasives for the Magnetic Induction-Wire Sawing Process 被引量:2
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作者 Wei Zhang Tengwei Qiu Chunyan Yao 《Fluid Dynamics & Materials Processing》 EI 2020年第4期709-721,共13页
In this study,magnetic abrasives were obtained by crushing and sieving sintered iron-silicon carbide(Fe-SiC)composites.Fe and SiC powders with different mesh numbers were pre-compacted using different pressures and th... In this study,magnetic abrasives were obtained by crushing and sieving sintered iron-silicon carbide(Fe-SiC)composites.Fe and SiC powders with different mesh numbers were pre-compacted using different pressures and then sintered at various temperatures and with different holding times.The dispersion uniformity of the SiC powder was improved through surface modification using polyethylene glycol(PEG)300.The resulting magnetic abrasives were characterized in terms of phase composition,density,relative permeability,and microstructure;this was followed by a comprehensive analysis to reveal the optimal processing parameters.The ideal combination of process parameters for preparing SiC magnetic-abrasive grains for the magnetic induction-wire sawing process was obtained,which are preparation load of 60 kN,a SiC mesh number of 1,500,a sintering temperature of 1100℃,and a holding time of 4 h. 展开更多
关键词 Wire sawing magnetic abrasives SINTERING phase compositions
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Polycrystalline diamond mini-cubes for sawing applications 被引量:1
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作者 Sung James C. Chang Kuen-liang +2 位作者 Tso Pei-lum Hsu Kai-hung Sung Michael 《金刚石与磨料磨具工程》 CAS 北大核心 2008年第S1期83-87,共5页
Diamond grits are indispensable for sawing granite or concrete.Each year about 1 000 tons of diamond grits are consumed for such purposes.In all cases,mono crystalline diamond is used.However, polycrystalline grits(po... Diamond grits are indispensable for sawing granite or concrete.Each year about 1 000 tons of diamond grits are consumed for such purposes.In all cases,mono crystalline diamond is used.However, polycrystalline grits(polygrits) are generally better performed than mono grits as abrasives.For example,poly grits of cubic boron nitride(e.g.Borazon(?) CBN-550 of Diamond Innovations) can cut faster and they last longer than mono grits(e.g.Borazon(?) CBN-500). Polygrits of alumina(e.g.Cubitron(?) of 3M) also out perform by far glassy grits(e.g.white alumina).For diamond superabrasives,micron polygrits formed by shock waves may polish as fast as mono grits of the same size,but without causing as much scratches due to the presence of smaller sintered grains.The improved performance of poly grits is attributed to their ability to micro chipping that renews the sharp cutting corners from time to time.By contrast,mono grits tend to round off at low cutting force or macro fracture at high cutting force,so they may lose the cutting ability rapidly. For sawing granite with mesh sizes 40/50 or coarser,poly grits of diamond have not been available until recently.In this research,we have made polygrits in mini cube with sizes of 18/20,20/25,and 30/40.Turbo grinders and wire saws were made by brazing both mono grits and polygrits on steel substrates.Cutting performance on granite demonstrated that grinding speed was faster with turbo grinder,and the surface finish was smoother with wire saw for poly grits than mono ones. Polygrits and mono grits of diamond were mixed for comparison(upper left).Polygrits of mini cubes were brazed on the pearl of a wire saw(upper right).Mono diamond grits were brazed on a turbo grinder(bottom diagrams ). 展开更多
关键词 GRANITE sawing diamond grits polygrits TURBO GRINDER wire saw
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Study on swarf when sawing granite with diamond wire 被引量:1
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作者 WU Hairong GUO Hua +1 位作者 ZHAO Ruyi HUANG Hui 《金刚石与磨料磨具工程》 CAS 北大核心 2018年第2期71-77,共7页
The diamond wire-sawing process was developed to cut granite in both quarries and block processing plants.In this paper,swarf was collected from different areas along the sawing arc when sawing three granites.The part... The diamond wire-sawing process was developed to cut granite in both quarries and block processing plants.In this paper,swarf was collected from different areas along the sawing arc when sawing three granites.The particle size distribution and the morphology of the swarf were investigated systematically,along with the swarf formation mechanism in sawing.Granite swarf formation was dominated by transgranular fractures based on the morphology of sawn granite chips and the analysis of sawn chip size.A long cutting arc increased the movement among the swarf,tool,and workpiece,thereby inducing a secondary fracture in the sawn chip. 展开更多
关键词 DIAMOND WIRE sawing GRANITE swarf
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NUMERICAL SIMULATION OF HOT SAWING PROCESS
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作者 X. Hong and K.G. Wu Shanghai University, Shanghai 200072, China 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2000年第2期692-696,共5页
The present paper gives a numerical simulation of hot sawing process by using elastic- plastic finite element method. The simulation is carried out for the moment from the beginning of deformation to the local yield i... The present paper gives a numerical simulation of hot sawing process by using elastic- plastic finite element method. The simulation is carried out for the moment from the beginning of deformation to the local yield in work piece. In order to treat the work hardening on deformation resistance, a correction of stress based on deformation rate is taken into consideration. The calculation results shows, there are two stress peaks both on the lower and upper sides ahead of the tooth tip during the elastic press stage, in which the displacement of tooth is below 0.735*10-6 cm. Following the push of saw tooth and rise of saw load, metal at the corner of filing reaches the yield point and a local plastic area appears,where metal shapes new filing part towards the free surface under the extrusion forces. Meanwhile the stress peaks ahead of tooth tip initial also yield regions. The displacement of saw tooth is between 0.735*10-6cm and 1.274*10-6cm in this stage. With the further push of the saw tooth, metal bounded to tooth tip is torn under the combination of tensile and sheer stress. The slide of metal and its local plastic flow form the extension of filing. Then the saw load rises no longer and static sawing procedure continues. 展开更多
关键词 numerical simulation hot sawing elastic-plastic finite element method
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Characterization of Band Sawing Dusts Generated in Cutting of Multi-crystalline Silicon Ingots 被引量:1
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作者 尹传强 周浪 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2010年第6期948-951,共4页
Physical-chemical characteristics of the band sawing dusts regarding to recovery of pure silicon from them were investigated.The experimental results show 50vol%-60vol% amorphous phases exist in the dusts,which is mos... Physical-chemical characteristics of the band sawing dusts regarding to recovery of pure silicon from them were investigated.The experimental results show 50vol%-60vol% amorphous phases exist in the dusts,which is mostly amorphous silica.The as-received saw dusts are found to form hard agglomerates of larger than 50 microns in diameter.The iron-based inclusions collected by magnets are found to match well with the band saw material in XRD patterns.Weight loss in heating was observed by thermal gravity tests,up to 900 ℃,presumably due to reaction of the amorphous silica with carbon contaminant in the dusts.The saw dusts were variously treated to examine their physical-chemical responses,and the results were also presented. 展开更多
关键词 silicon saw dust kerf loss PICKLING solar energy
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THE WEAR MODES AND MECHANISMS OFDIAMONDS IN SAWING HARD STONE 被引量:1
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作者 Wang Dianjiang(Department of Geology, Central South University of Technology,Changsha 410083, China) 《Journal of Central South University》 SCIE EI CAS 1996年第1期98-100,共3页
Four wear modes and four wear mechanisms of diamonds in sawblades are identified in a study of varied segments damaged in field operation of sawing hard stone. The four wear mechanisms are impactshearing, fatiguing, p... Four wear modes and four wear mechanisms of diamonds in sawblades are identified in a study of varied segments damaged in field operation of sawing hard stone. The four wear mechanisms are impactshearing, fatiguing, pullingout and thermal effects. Surface erosion is the result of thermal effects, while impactshearing and fatiguing lead to macro and microfracture, and pullingout results in wholesale dislodgement of diamonds provided the inequality Fn>M/(μλδ) is satisfied. 展开更多
关键词 diamond WEAR SAW BLADE WEAR mechanism〖J
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Effect of Cutting Speed on Surface Quality by Bandsawing
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作者 于建国 LiangkaiTING 《Journal of Forestry Research》 SCIE CAS CSCD 1997年第4期246-249,共4页
The surface profile behavior of workpieces sawn has been investigated. Six species were sawn under the condi-tion of four different kinds of cutting speed by the band saw. The real surface profile of a sawn workpiecc ... The surface profile behavior of workpieces sawn has been investigated. Six species were sawn under the condi-tion of four different kinds of cutting speed by the band saw. The real surface profile of a sawn workpiecc is composed of twosections, which arc the additivity of the waviness of filtered wave and roughness curve. The roughness of center line avernge aswell as amplitude decrease with the increasing of cutting speed for different kinds of species used in the experiment. 展开更多
关键词 Band saw. CUTTING speed. Profile curve. WAVINESS or filtered wave. ROUGHNESS CURVE ROUGHNESS of center line AVERAGE
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Experimental study of free abrasive wire sawing by using multi-strands wire
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作者 Yao Chunyan Wang Jinsheng +2 位作者 Peng Wei Jin Xin Chen Shijie 《Engineering Sciences》 EI 2013年第6期80-84,共5页
Grains in the slurry can be brought into cutting zone by steel wire with a certain speed to achieve the purpose of removing the workpiece material in the free abrasive wire sawing machining. Because its own of multi- ... Grains in the slurry can be brought into cutting zone by steel wire with a certain speed to achieve the purpose of removing the workpiece material in the free abrasive wire sawing machining. Because its own of multi- strands characteristics, we use it to replace the steel wire to do slicing experiment. In this paper, multi-strands wire is made by seven metal wires and has many grooves on its surface. Compared with steel wire, it can carry more grains into cutting zone which is conducive to improving the slicing efficiency. We do some comparative slic- ing experimcnts by applying multi-strands wire (~b0.25 mm) and steel wire (~b0.25 mm) to cut optical glass (K9). The results show that slicing efficiency and the surface roughness of the workpiece sliced by using multi-strands wire are better than that by using steel wire. but the kerf width of the former is wider than that of the latter in the same experimental conditions. 展开更多
关键词 wire saw free abrasive machining slicing efficiency
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基于SAW滤波器的电磁寄生提取
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作者 胡月 白凤 +8 位作者 周艺蒙 范维 魏子杰 李沛然 帅垚 吴传贵 罗文博 潘忻强 张万里 《压电与声光》 CAS 北大核心 2024年第4期453-457,共5页
针对封装管壳和版图电磁寄生参数导致射频声表面波(SAW)滤波器通带变窄及驻波增大等问题,提出一种能快速提取封装管壳和版图中电磁寄生效应的方法,精准模拟了封装和版图对滤波器性能的影响。首先利用有限元法(FEM)电磁仿真软件提取封装... 针对封装管壳和版图电磁寄生参数导致射频声表面波(SAW)滤波器通带变窄及驻波增大等问题,提出一种能快速提取封装管壳和版图中电磁寄生效应的方法,精准模拟了封装和版图对滤波器性能的影响。首先利用有限元法(FEM)电磁仿真软件提取封装管壳的电磁寄生参数,再使用电路仿真软件将所设计出的滤波器结合所提取的封装寄生参数和滤波器版图直接进行联合仿真,此方法不需将版图在FEM软件中再次进行电磁仿真,可提高时间利用率。此方法在中心频率为1 268 MHz、通带插入损耗小于1 dB、带内驻波小于1.6、带内波动为0.5 dB、带宽为24 MHz(相对带宽为1.8%)的SAW滤波器上进行了验证,结果表明仿真结果与实测值吻合度较高。该设计中所用的SAW谐振器均经过去嵌操作,能更精准地模拟实测滤波器的结果。 展开更多
关键词 电磁寄生 SAW滤波器 封装 去嵌 版图
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SAW滤波器功率容量研究
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作者 白凤 帅垚 +2 位作者 吴传贵 罗文博 张万里 《电子元件与材料》 CAS 北大核心 2024年第7期860-865,共6页
为了提高声表面波(SAW)滤波器的使用寿命和设计效率,有必要研究谐振单元对滤波器功率耐受力的影响。首先通过FEM有限元软件搭建由Al电极、42°Y-X LiTaO_(3)压电材料薄膜和SiO_(2)/Poly-Si/Si衬底构成的谐振器模型,并分析IDT、声孔... 为了提高声表面波(SAW)滤波器的使用寿命和设计效率,有必要研究谐振单元对滤波器功率耐受力的影响。首先通过FEM有限元软件搭建由Al电极、42°Y-X LiTaO_(3)压电材料薄膜和SiO_(2)/Poly-Si/Si衬底构成的谐振器模型,并分析IDT、声孔径、半周期对其阻抗的影响。同时,提出了一种谐振器功率测试方法,该方法可以计算出谐振器的各个频点下加载功率随输入功率的变化。为了验证功率测试方法的可靠性,对采用3030C封装的B41(2515~2675 MHz)滤波器进行功率测试,结果显示在输入功率为23 dBm时,滤波器被烧毁,与仿真数据一致。最后结合电容公式和仿真数据证实了谐振器的面积变化会改变滤波器的电容比,进而影响滤波器的散热,因此可以通过改变SAW滤波器各支路串并联结构以及各谐振器叉指对数、孔径、半周期,来提高滤波器功率耐受性。 展开更多
关键词 SAW 功率 电容比 谐振器 有限元
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基于COM-MBVD混合模型的多模态声学响应研究与仿真
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作者 周艺蒙 陈抒键 +8 位作者 蒋冠臻 范维 魏子杰 李沛然 帅垚 吴传贵 罗文博 潘忻强 张万里 《压电与声光》 CAS 北大核心 2024年第4期519-523,共5页
耦合模(COM)模型广泛应用于声表面波(SAW)滤波器设计中,传统的单模COM模型不能拟合到远端的高阶水平剪切波、西沙瓦波等杂散模态。从单模COM模型出发,结合类似于MBVD等效电路的谐振支路,实现COM-MBVD模型拟合多模态声学响应。并基于此... 耦合模(COM)模型广泛应用于声表面波(SAW)滤波器设计中,传统的单模COM模型不能拟合到远端的高阶水平剪切波、西沙瓦波等杂散模态。从单模COM模型出发,结合类似于MBVD等效电路的谐振支路,实现COM-MBVD模型拟合多模态声学响应。并基于此模型搭建8阶梯形结构电路进行优化仿真。最终设计出中心频率为1 590 MHz,通带插入损耗小于1.6 dB,带内波动为1 dB,带宽为80 MHz(相对带宽为5%)的声表面波(SAW)滤波器。实际测试数据与仿真数据相符,验证了该设计方法的可行性。 展开更多
关键词 COM模型 MBVD模型 梯形结构 SAW滤波器
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面内传播方向对SAW滤波器性能的影响研究
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作者 朱建宇 魏子杰 +7 位作者 范维 李沛然 钱一聪 帅垚 吴传贵 罗文博 潘忻强 张万里 《压电与声光》 CAS 北大核心 2024年第4期435-438,共4页
为了满足窄带声表面波滤波器对品质因数Q值和带外抑制日益增长的需求,提出了一种窄带滤波器设计方法。在基于新型POI结构谐振器的基础上,通过旋转谐振器达到改变波传播角度的目的,并利用二维全模型得到准确的实验数据,与原结构谐振器分... 为了满足窄带声表面波滤波器对品质因数Q值和带外抑制日益增长的需求,提出了一种窄带滤波器设计方法。在基于新型POI结构谐振器的基础上,通过旋转谐振器达到改变波传播角度的目的,并利用二维全模型得到准确的实验数据,与原结构谐振器分别代入滤波器设计中进行比较。实验结果表明,该方法在一定程度上能够有效地增加带外抑制,对过渡带抑制能力有2~4 dB的提升,且具有设计简便,占用空间小等优点。 展开更多
关键词 声表面波(SAW) 窄带 谐振器 带外抑制 压电材料
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陶瓷封装SAW滤波器除金工艺研究
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作者 唐盘良 李亚飞 +3 位作者 黄莹 张钧翀 冷俊林 马晋毅 《压电与声光》 CAS 北大核心 2024年第5期695-699,共5页
针对陶瓷封装声表面波(SAW)滤波器焊盘除金问题,提出了载板搪锡工艺的解决方案。通过制作外扩焊盘的搪锡载板进行滤波器批量贴装,在加热台上进行回流以溶解焊盘镀金层,取下上锡器件后用真空吸锡枪吸去焊盘表面焊锡,即可达到除金目的。... 针对陶瓷封装声表面波(SAW)滤波器焊盘除金问题,提出了载板搪锡工艺的解决方案。通过制作外扩焊盘的搪锡载板进行滤波器批量贴装,在加热台上进行回流以溶解焊盘镀金层,取下上锡器件后用真空吸锡枪吸去焊盘表面焊锡,即可达到除金目的。详细介绍了搪锡载板的焊盘设计,利用红外测温仪对操作过程进行监控,对除金后的器件进行焊盘表面、焊点界面分析以及环境试验验证。试验表明,焊盘表面镀金层被完全去除,除金后的器件具有较高的可靠性。 展开更多
关键词 陶瓷封装 声表面波(SAW)滤波器 搪锡 除金 可靠性
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具有片上电感的改进型梯形声表面波滤波器
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作者 杨茂坤 帅垚 +3 位作者 魏子杰 吴传贵 罗文博 张万里 《压电与声光》 CAS 北大核心 2024年第4期439-442,共4页
针对小体积声表面波(SAW)滤波器性能受封装影响较大的问题,提出了一种新型SAW梯形滤波器电路拓扑结构。通过分析滤波器高频受封装影响造成的远端抑制上翘的现象,从电路结构出发,改变版图设计,实现了片上电感。采用传统梯形滤波器结构和... 针对小体积声表面波(SAW)滤波器性能受封装影响较大的问题,提出了一种新型SAW梯形滤波器电路拓扑结构。通过分析滤波器高频受封装影响造成的远端抑制上翘的现象,从电路结构出发,改变版图设计,实现了片上电感。采用传统梯形滤波器结构和利用纵向耦合双模谐振器型滤波器(DMS)特殊接地结构相结合的电路拓扑结构,有助于提高带外抑制和设计灵活性。在标准的42°Y-X钽酸锂(LiTaO_(3))基板上制作滤波器,通过仿真分析得到中心频率2580 MHz、带宽50 MHz、插入损耗小于2.5 dB的高阶梯形射频SAW滤波器的最优拓扑结构。测试结果表明,通过改变电路拓扑结构关键参数和引入新的传输零点,可改善在高频段内的带外抑制特性。 展开更多
关键词 封装 声表面波(SAW)滤波器 片上电感 DMS结构 传输零点 带外抑制
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声表面波滤波器温度敏感性仿真研究
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作者 王吉芳 郑露 +7 位作者 陈平静 潘虹芝 杜雪松 董加和 陆川 陈正林 吴浩东 马晋毅 《压电与声光》 CAS 北大核心 2024年第3期310-314,共5页
针对不同温度场情况下任意复杂膜系结构和电路拓扑结构的声表面波(SAW)滤波器的温度敏感性精确计算问题,首先将温度场以热应力、热应变的方式耦合声/电本征方程并考虑封装模型的电磁因素,再结合分层级联算法和全波仿真技术,计算任意复... 针对不同温度场情况下任意复杂膜系结构和电路拓扑结构的声表面波(SAW)滤波器的温度敏感性精确计算问题,首先将温度场以热应力、热应变的方式耦合声/电本征方程并考虑封装模型的电磁因素,再结合分层级联算法和全波仿真技术,计算任意复杂膜系结构和电路拓扑结构的SAW滤波器的温度敏感性,实现不同温度作用下SAW滤波器频率响应曲线、频率温度系数(TCF)值、损耗、带宽及带外抑制等性能的综合分析。通过41°Y-X LiNbO_(3)/SiO_(2)/Si_poly/Si(111)复合衬底SAW滤波器的优化设计与研制,其设计优化结果与实验结果吻合较好,验证了该方法的有效性和可行性。 展开更多
关键词 温度敏感性 声表面波(SAW)滤波器 分层级联 全波仿真
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电磁寄生参数对SAW滤波器性能的影响
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作者 魏园林 帅垚 +3 位作者 魏子杰 吴传贵 罗文博 张万里 《压电与声光》 CAS 北大核心 2024年第4期463-467,共5页
设计了B41频段的声表面波(SAW)滤波器,利用三维电磁场仿真工具HFSS建立表面贴装器件(SMD)封装和芯片级(CSP)封装模型,对比两种封装的声-电磁联合仿真结果得出,在滤波器电路拓扑结构中,当2条不同并联支路连接在一起时,由于SMD封装键合引... 设计了B41频段的声表面波(SAW)滤波器,利用三维电磁场仿真工具HFSS建立表面贴装器件(SMD)封装和芯片级(CSP)封装模型,对比两种封装的声-电磁联合仿真结果得出,在滤波器电路拓扑结构中,当2条不同并联支路连接在一起时,由于SMD封装键合引线的电磁寄生参数影响,滤波器在高频处的带外抑制会出现“上翘”。建立不同键合线数量、直径及长度的SMD封装模型,并仿真计算S参数。对比仿真结果可知,随着键合线直径的增大和长度的减小,其等效电感逐渐变小,即键合线的电磁寄生参数逐渐减小,对SAW滤波器性能的影响逐渐减弱,高频处的带外抑制性能得到优化。结果表明,CSP封装植球倒扣的电磁寄生参数更小,声-电磁联合仿真的结果更优,与实测结果吻合较好。 展开更多
关键词 SAW滤波器 表面贴装器件(SMD)封装 芯片级(CSP)封装 电磁寄生参数 带外抑制 键合线
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