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Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology
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作者 曹毓涵 罗乐 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第8期164-168,共5页
A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding param... A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu6Sn5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 × 10-9 atm cc/s are possible, meeting the demands of MIL-STD-883E. 展开更多
关键词 wafer level package Cu-Sn isothermal solidification technology hermeticity
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Microstructure control and hot cracking behavior of the new Ni-Co based superalloy prepared by electron beam smelting layered solidification technology
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作者 Hongyang Cui Yi Tan +4 位作者 Lidan Ning Rusheng Bai Xiaogang You Chuanyong Cui Pengting Li 《Journal of Materials Science & Technology》 SCIE EI CAS 2024年第8期55-71,共17页
The prevention of hot cracking formation is of utmost importance in the production of the new Ni-Co based superalloys through the utilization of the electron beam smelting layered solidification technique(EBSL),as it ... The prevention of hot cracking formation is of utmost importance in the production of the new Ni-Co based superalloys through the utilization of the electron beam smelting layered solidification technique(EBSL),as it ensures exceptional homogeneity and dependable consistency of the specimens.In contrast to previous studies that focused on minimizing the liquid film and solidification range,our methodology adopts a distinct approach.In this research,a novel methodology was employed to mitigate internal stresses through the implementation of equiaxed grain layers via an alternately reduced cooling method.This ultimately resulted in the elimination of hot cracking.To be more specific,the transition from a columnar to an equiaxed structure was observed during the layer-by-layer construction process in the fabrication of the new Ni-Co based superalloy in EBSL.The EBSL-Ni-Co superalloy,when subjected to the alternating reduction cooling method,exhibited an internal stress of 49 MPa.This value represents a significant reduction of 83.8%compared to the internal stress observed when employing the linear reduction cooling method.Additionally,the solvus temperature of theγ-γ’eutectic phases in EBSL-Ni-Co superalloys produced by the alternating reduction cooling method is significantly higher.Intriguingly,the Nth layer of the EBSL-Ni-Co based superalloys produced by EBSL simultaneously heats treated with the preceding layers.And the low melting point phase gradually dissolved back into the matrix.The implementation of an alternating reduced cooling method successfully mitigated the formation of the liquid film in theγ-γ’eutectic phase and the buildup of internal stresses in the EBSL-Ni-Co superalloy during its manufacturing process.These discoveries open up a novel preparation procedure pathway for the manufacture of crack-free superalloys with superior mechanical characteristics using EBSL. 展开更多
关键词 Electron beam smelting layered solidification technology CET Thermal cycling Hot cracking
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The First China Foundry Scientific and Technological Achievements Fair was successfully held in Changsha
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《China Foundry》 SCIE 2015年第6期456-458,共3页
In order to promote transformation of scientific and technological achievements and development of scientific and technological service in foundry industry,change innovative achievements into real industrial activitie... In order to promote transformation of scientific and technological achievements and development of scientific and technological service in foundry industry,change innovative achievements into real industrial activities and market profit,and create new growth sources,under the leadership of the Ministry of Science and Technology, the Productivity Promotion Center of Foundry Industry of China maximized resource advantages, fully integrated innovative resources, took market demands as guidance, built interconnected service platforms, supplied "one-stop" services for scientific and technological innovation in the foundry industry and the development of small and medium-sized enterprises. 展开更多
关键词 technological innovative leadership foundry profit Changsha Major directional director solidification
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