随着器件沟道尺寸的减小,为了获得更好的性能参数,器件工艺窗口变得越来越窄。与此同时,单MOSFET(metal oxide semiconductor field effect transistor)封装缺少静电保护电路。对于敏感器件的封装,异常的电气参数时有出现。通过使用FMEA...随着器件沟道尺寸的减小,为了获得更好的性能参数,器件工艺窗口变得越来越窄。与此同时,单MOSFET(metal oxide semiconductor field effect transistor)封装缺少静电保护电路。对于敏感器件的封装,异常的电气参数时有出现。通过使用FMEA(failure mode and effects analysts)和DOE(design of experiments)等质量工具,确认该问题与封装键合顺序和黏合剂有关。通过调整键合顺序和更换所使用的黏合剂,有效地解决了敏感器件封装低良的问题。该案例为同行业提供了借鉴。展开更多
The electronic packaging shell of high silicon carbide （54%SiC, volume fraction） aluminum-based composites was produced by liquid-solid separation technique. The characteristics of distribution and morphology of SiC...The electronic packaging shell of high silicon carbide （54%SiC, volume fraction） aluminum-based composites was produced by liquid-solid separation technique. The characteristics of distribution and morphology of SiC as well as the shell’s fracture surface were examined by optical microscopy and scanning electron microscopy, and the thermo-physical and mechanical properties of the shell were also tested. The results show that Al matrix has a net-like structure while SiC is uniformly distributed in the Al matrix. The SiCp/Al composites have a low density of 2.93 g/cm^3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/（·K）, coefficient of thermal expansion （CTE） is 10.3×10^-6 K-1 （25-400 ℃）, compressive strength is 496 MPa, bending strength is 404.5 MPa, and the main fracture mode is brittle fracture of SiC particles accompanied by ductile fracture of Al matrix.Its thermal conductivity is higher than that of Si/Al alloy, and its CTE matches with that of the chip material.展开更多
The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the b...The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.展开更多
A high power collimated diode laser stack is carried out based on fast-axis collimation and stack packaging techniques. The module includes ten typical continuous wave （cw） bars and the total output power can be up ...A high power collimated diode laser stack is carried out based on fast-axis collimation and stack packaging techniques. The module includes ten typical continuous wave （cw） bars and the total output power can be up to 368W at 48.6A. Using a cylindrical lens as the collimation elements,we can make the fast-axis divergence and the slow-axis divergence are 0. 926 4° and 8. 206° respectively. The light emitting area is limited in a square area of 18.3 mm × 11 mm. The module has the advantage of high power density and offers a wide potential applications in pumping and material processing.展开更多
Data envelopment analysis (DEA) has become a standard non parametric approach to productivity analysis, especially to relative efficiency analysis of decision making units (DMUs). Extended to the prediction field, it ...Data envelopment analysis (DEA) has become a standard non parametric approach to productivity analysis, especially to relative efficiency analysis of decision making units (DMUs). Extended to the prediction field, it can solve the prediction problem with multiple inputs and outputs which can not be solved easily by the regression analysis method.But the traditional DEA models can not solve the problem with undesirable outputs,so in this paper the inherent relationship between goal programming and the DEA method based on the relationship between multiple goal programming and goal programming is explored,and a mixed DEA model which can make all factors of inputs and undesirable outputs decrease in different proportions is built.And at the same time,all the factors of desirable outputs increase in different proportions.展开更多
In the digital synthesis of wideband periodic signals using an Arbitrary Waveform Gen-erator(AWG),the frequency resolution and spectral complexity of the synthesized signals are com-monly limited by the memory capacit...In the digital synthesis of wideband periodic signals using an Arbitrary Waveform Gen-erator(AWG),the frequency resolution and spectral complexity of the synthesized signals are com-monly limited by the memory capacity and clock frequency of the AWG.This paper proposes a novel sequential addressing scheme and then presents several sequences to improve the frequency resolution of the synthesized periodic signals without changing their spectral envelopes and basic time-domain characteristics under the condition of a fixed memory capacity and a fixed clock fre-quency.The main idea of the scheme is using the address generator in an AWG to program and produce addresses to read fixed waveform data in variable order,and thus to generate waveforms of various periods and profiles.The scheme is applied in simulating signal scenarios for military com-munication countermeasure experiments,and achieves high performance.展开更多
Currently,multicast survivability in optical network obtains more attention.This paper focuses on the field of multicast grooming shared protection in green optical network and designs a novel auxiliary graph and a sh...Currently,multicast survivability in optical network obtains more attention.This paper focuses on the field of multicast grooming shared protection in green optical network and designs a novel auxiliary graph and a shared matrix to address the survivable multicast resource consumption.This paper also proposes a new heuristic called Green Multicast Grooming algorithm based on spanning path Cross-Shared protection(GMGCSP),in which network reliability,energy efficiency and resource utilization are jointly considered.Simulation results testify that,compared to other algorithms,the proposed GMG-CSP not only has lower blocking probability and higher bandwidth utilization ratio,but also saves more energy.展开更多
As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated hy a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is ...As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated hy a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al2O12 ： Ce^3＋ （in short： YAG ： Ce^3＋ ）. The matching of the spectrum of the blue LED chips and the YAG ： Ce^3＋ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high power single chip-white LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.展开更多
Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to ...Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the jtnction to aluminten metal plate, considering input power of IFD module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED fighting modules.展开更多
Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of ...Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications to keep the maximum temperatures under specifications. This situation drives a constant demand for better efficiencies in smaller packages. Traditional approaches to improve efficiency in DC/DC synchronous buck converters include reducing conduction losses in the MOSFETs （metal oxide semiconductor field effect transistors） through lower RDS （ON） （resistance drain to source in the ON state） devices and lowering switching losses through low-frequency operation. However, the incremental improvements in RDS （ON） are at a point of diminishing returns and low RDS （ON） devices have large parasitic capacitances that do not facilitate the high-frequency operation required to improve power density. The drive for higher efficiency and increased power in smaller packages is being addressed by advancements in both silicon and packaging technologies. The NexFET power block combines these two technologies to achieve higher levels of performance, and in half the space versus discrete MOSFETs. This article explains these new technologies and highlights their performance advantage.展开更多
文摘随着器件沟道尺寸的减小,为了获得更好的性能参数,器件工艺窗口变得越来越窄。与此同时,单MOSFET(metal oxide semiconductor field effect transistor)封装缺少静电保护电路。对于敏感器件的封装,异常的电气参数时有出现。通过使用FMEA(failure mode and effects analysts)和DOE(design of experiments)等质量工具,确认该问题与封装键合顺序和黏合剂有关。通过调整键合顺序和更换所使用的黏合剂,有效地解决了敏感器件封装低良的问题。该案例为同行业提供了借鉴。
文摘The electronic packaging shell of high silicon carbide （54%SiC, volume fraction） aluminum-based composites was produced by liquid-solid separation technique. The characteristics of distribution and morphology of SiC as well as the shell’s fracture surface were examined by optical microscopy and scanning electron microscopy, and the thermo-physical and mechanical properties of the shell were also tested. The results show that Al matrix has a net-like structure while SiC is uniformly distributed in the Al matrix. The SiCp/Al composites have a low density of 2.93 g/cm^3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/（·K）, coefficient of thermal expansion （CTE） is 10.3×10^-6 K-1 （25-400 ℃）, compressive strength is 496 MPa, bending strength is 404.5 MPa, and the main fracture mode is brittle fracture of SiC particles accompanied by ductile fracture of Al matrix.Its thermal conductivity is higher than that of Si/Al alloy, and its CTE matches with that of the chip material.
文摘The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/（m·K）,the coefficients of thermal expansion（CTE） are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall.
文摘A high power collimated diode laser stack is carried out based on fast-axis collimation and stack packaging techniques. The module includes ten typical continuous wave （cw） bars and the total output power can be up to 368W at 48.6A. Using a cylindrical lens as the collimation elements,we can make the fast-axis divergence and the slow-axis divergence are 0. 926 4° and 8. 206° respectively. The light emitting area is limited in a square area of 18.3 mm × 11 mm. The module has the advantage of high power density and offers a wide potential applications in pumping and material processing.
文摘Data envelopment analysis (DEA) has become a standard non parametric approach to productivity analysis, especially to relative efficiency analysis of decision making units (DMUs). Extended to the prediction field, it can solve the prediction problem with multiple inputs and outputs which can not be solved easily by the regression analysis method.But the traditional DEA models can not solve the problem with undesirable outputs,so in this paper the inherent relationship between goal programming and the DEA method based on the relationship between multiple goal programming and goal programming is explored,and a mixed DEA model which can make all factors of inputs and undesirable outputs decrease in different proportions is built.And at the same time,all the factors of desirable outputs increase in different proportions.
基金the National Grand Fundamental Research 973 Program of China (No.2004CB318109)the National High-Technology Research and Development Plan of China (No.2006AA01Z452)
文摘In the digital synthesis of wideband periodic signals using an Arbitrary Waveform Gen-erator(AWG),the frequency resolution and spectral complexity of the synthesized signals are com-monly limited by the memory capacity and clock frequency of the AWG.This paper proposes a novel sequential addressing scheme and then presents several sequences to improve the frequency resolution of the synthesized periodic signals without changing their spectral envelopes and basic time-domain characteristics under the condition of a fixed memory capacity and a fixed clock fre-quency.The main idea of the scheme is using the address generator in an AWG to program and produce addresses to read fixed waveform data in variable order,and thus to generate waveforms of various periods and profiles.The scheme is applied in simulating signal scenarios for military com-munication countermeasure experiments,and achieves high performance.
基金supported in part by the National Natural Science Foundation of China （61172051,61302070,61302071,61302072） the Specialized Research Fund for the Doctoral Program of Higher Education（20110042110023） the Fundamental Research Funds for the Central Universities（N110204001, N120804002,N110604008）
文摘Currently,multicast survivability in optical network obtains more attention.This paper focuses on the field of multicast grooming shared protection in green optical network and designs a novel auxiliary graph and a shared matrix to address the survivable multicast resource consumption.This paper also proposes a new heuristic called Green Multicast Grooming algorithm based on spanning path Cross-Shared protection(GMGCSP),in which network reliability,energy efficiency and resource utilization are jointly considered.Simulation results testify that,compared to other algorithms,the proposed GMG-CSP not only has lower blocking probability and higher bandwidth utilization ratio,but also saves more energy.
基金"863"Project from Ministry of Science & Technology of China(2006AA03A116)
文摘As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated hy a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al2O12 ： Ce^3＋ （in short： YAG ： Ce^3＋ ）. The matching of the spectrum of the blue LED chips and the YAG ： Ce^3＋ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high power single chip-white LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.
文摘Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the jtnction to aluminten metal plate, considering input power of IFD module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED fighting modules.
文摘Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications to keep the maximum temperatures under specifications. This situation drives a constant demand for better efficiencies in smaller packages. Traditional approaches to improve efficiency in DC/DC synchronous buck converters include reducing conduction losses in the MOSFETs （metal oxide semiconductor field effect transistors） through lower RDS （ON） （resistance drain to source in the ON state） devices and lowering switching losses through low-frequency operation. However, the incremental improvements in RDS （ON） are at a point of diminishing returns and low RDS （ON） devices have large parasitic capacitances that do not facilitate the high-frequency operation required to improve power density. The drive for higher efficiency and increased power in smaller packages is being addressed by advancements in both silicon and packaging technologies. The NexFET power block combines these two technologies to achieve higher levels of performance, and in half the space versus discrete MOSFETs. This article explains these new technologies and highlights their performance advantage.
