1 微封装技术的发展随着航空航天系统对于小型化、低功耗、高性能、高可靠性的要求不断提高,传统PCB板上系统（System On Board,SOB）的设计方案的缺点越来越明显.由于芯片、模块的体积和功耗的限制,PCB板尺寸和功耗不能无限制减小.单...1 微封装技术的发展随着航空航天系统对于小型化、低功耗、高性能、高可靠性的要求不断提高,传统PCB板上系统（System On Board,SOB）的设计方案的缺点越来越明显.由于芯片、模块的体积和功耗的限制,PCB板尺寸和功耗不能无限制减小.单个芯片的封装尺寸通常在mm到cm量级,但PCB板上的走线长度通常在1cm至50cm量级,过大的封装和走线造成损耗大、寄生参数多,限制了系统性能的提升.同时由于系统功能复杂,使用大量分立器件造成系统故障点多,整机可靠性降低.展开更多
Density matched microencapsulation technique has been developed for production of high quality hollow polymer microshells employed in inertial confinement fusion(ICF) experiments.Concentricity and sphericity of the mi...Density matched microencapsulation technique has been developed for production of high quality hollow polymer microshells employed in inertial confinement fusion(ICF) experiments.Concentricity and sphericity of the microshell prepared by the technique are typically more than 98% and 99% respectively.Vacuole in the wall of the microshells has been greatly reduced by precise filtering of shell making soultion.To meet the need of larger microshells in the future ICF experiments,the micoshells with diameter above 500μm have been produced by reduction of emulsion agitate rate.展开更多
TN 25 96031813光纤并列互连技术及其进展=Technology of opticalfiber paralle interconnection and its development[刊,中]/何兴仁(电子工业部第44研究所.四川,永川(632163))//光纤光缆传输技术.-1995,(2/3).-23-29介绍了光互连的概...TN 25 96031813光纤并列互连技术及其进展=Technology of opticalfiber paralle interconnection and its development[刊,中]/何兴仁(电子工业部第44研究所.四川,永川(632163))//光纤光缆传输技术.-1995,(2/3).-23-29介绍了光互连的概念,光纤并列互连技术,国外开发进展情况,及微封装技术。图7表2参12(方舟)展开更多
Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of ...Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications to keep the maximum temperatures under specifications. This situation drives a constant demand for better efficiencies in smaller packages. Traditional approaches to improve efficiency in DC/DC synchronous buck converters include reducing conduction losses in the MOSFETs （metal oxide semiconductor field effect transistors） through lower RDS （ON） （resistance drain to source in the ON state） devices and lowering switching losses through low-frequency operation. However, the incremental improvements in RDS （ON） are at a point of diminishing returns and low RDS （ON） devices have large parasitic capacitances that do not facilitate the high-frequency operation required to improve power density. The drive for higher efficiency and increased power in smaller packages is being addressed by advancements in both silicon and packaging technologies. The NexFET power block combines these two technologies to achieve higher levels of performance, and in half the space versus discrete MOSFETs. This article explains these new technologies and highlights their performance advantage.展开更多
Y2000-62422-108 0103751用于单栅极和双栅极 MOS 场效应晶体管的选择外延生长多层绝缘体上硅岛技术=Multi-layer SOI islandtechnology by selective epitaxial growth for single-gateand double-gate MOSFETs[会,英]/Pae,S.& Den...Y2000-62422-108 0103751用于单栅极和双栅极 MOS 场效应晶体管的选择外延生长多层绝缘体上硅岛技术=Multi-layer SOI islandtechnology by selective epitaxial growth for single-gateand double-gate MOSFETs[会,英]/Pae,S.& Denton,展开更多
文摘1 微封装技术的发展随着航空航天系统对于小型化、低功耗、高性能、高可靠性的要求不断提高,传统PCB板上系统（System On Board,SOB）的设计方案的缺点越来越明显.由于芯片、模块的体积和功耗的限制,PCB板尺寸和功耗不能无限制减小.单个芯片的封装尺寸通常在mm到cm量级,但PCB板上的走线长度通常在1cm至50cm量级,过大的封装和走线造成损耗大、寄生参数多,限制了系统性能的提升.同时由于系统功能复杂,使用大量分立器件造成系统故障点多,整机可靠性降低.
文摘Density matched microencapsulation technique has been developed for production of high quality hollow polymer microshells employed in inertial confinement fusion(ICF) experiments.Concentricity and sphericity of the microshell prepared by the technique are typically more than 98% and 99% respectively.Vacuole in the wall of the microshells has been greatly reduced by precise filtering of shell making soultion.To meet the need of larger microshells in the future ICF experiments,the micoshells with diameter above 500μm have been produced by reduction of emulsion agitate rate.
文摘TN 25 96031813光纤并列互连技术及其进展=Technology of opticalfiber paralle interconnection and its development[刊,中]/何兴仁(电子工业部第44研究所.四川,永川(632163))//光纤光缆传输技术.-1995,(2/3).-23-29介绍了光互连的概念,光纤并列互连技术,国外开发进展情况,及微封装技术。图7表2参12(方舟)
文摘Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications to keep the maximum temperatures under specifications. This situation drives a constant demand for better efficiencies in smaller packages. Traditional approaches to improve efficiency in DC/DC synchronous buck converters include reducing conduction losses in the MOSFETs （metal oxide semiconductor field effect transistors） through lower RDS （ON） （resistance drain to source in the ON state） devices and lowering switching losses through low-frequency operation. However, the incremental improvements in RDS （ON） are at a point of diminishing returns and low RDS （ON） devices have large parasitic capacitances that do not facilitate the high-frequency operation required to improve power density. The drive for higher efficiency and increased power in smaller packages is being addressed by advancements in both silicon and packaging technologies. The NexFET power block combines these two technologies to achieve higher levels of performance, and in half the space versus discrete MOSFETs. This article explains these new technologies and highlights their performance advantage.
文摘Y2000-62422-108 0103751用于单栅极和双栅极 MOS 场效应晶体管的选择外延生长多层绝缘体上硅岛技术=Multi-layer SOI islandtechnology by selective epitaxial growth for single-gateand double-gate MOSFETs[会,英]/Pae,S.& Denton,
