The relationship between the thermal/electrical conductivity enhancement in graphite nanoplatelets （GNPs） composites and the properties of filling graphite nanoplatelets is studied. The effective thermal and electri...The relationship between the thermal/electrical conductivity enhancement in graphite nanoplatelets （GNPs） composites and the properties of filling graphite nanoplatelets is studied. The effective thermal and electrical conductivity enhancements of GNP-oil nanofluids and GNP-polyimide composites are measured. By taking into account the particle shape, the volume fraction, the thermal conductivity of filling particles and the base fluids, the thermal and electrical conductivity enhancements of GNP nanofluids are theoretically predicted by the generalized effective medium theory. Both the nonlinear dependence of effective thermal conductivity on the GNP volume fraction in nanofhiids and the very low percolation threshold for GNP-polyimide composites are well predicted. The theoretical predications are found to be in reasonably good agreement with the experimental data. The generalized effective medium theory can be used for predicting the thermal and electrical properties of GNP composites and it is still available for most of the thermal/electrical modifications in two-phase composites.展开更多
The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of t...The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.展开更多
Electrical steel sheets with 6.5%(mas fraction) Si with good shapes and superior magnetic inductions were successfully produced by a specially designed processing route including ingot casting, hot rolling and warm ro...Electrical steel sheets with 6.5%(mas fraction) Si with good shapes and superior magnetic inductions were successfully produced by a specially designed processing route including ingot casting, hot rolling and warm rolling both with interpass thermal treatment, and final annealing. The sheets were of 0.2 mm and 0.3 mm thick over 140 mm width. A detailed study of the microstructural and textural evolutions from the hot rolling to annealing was carried out by optical microscopy, X-ray diffraction and electron backscattered diffraction. The hot rolled sheet characterized by near-equiaxed grains was dominated by the mixture of <001>//ND fiber(λ-fiber), <110>//RD fiber(α-fiber) and <111>//ND fiber(γ-fiber) textures owing to the partial recrystallization and strain induced boundary migration(SIBM) during the hot rolling interpass thermal treatment. The static recovery and SIBM during the warm rolling interpass thermal treatment result in large and elongated warm rolling grains. The warm rolling texture is dominated by obvious λ, Goss and strong γ-fiber textures. The application of the interpass thermal treatment during hot and warm rolling significantly enhances the impact of SIBM during annealing, which is responsible for the formation of the moderate λ-fiber, some near-λ fiber texture components and the obviously weakened γ-fiber texture in the annealed sheet, leading to a higher magnetic induction compared to the commercially produced 6.5% Si steel by chemical vapor deposition(CVD).展开更多
The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly ther...The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly thermal conductive h-BN and graphite gives rise to large increase （about 2 times） of thermal conductivity of individual polymer. In PPS/graphite system, the higher conductivity value was obtained when smaller graphites were added. Meanwhile, the tensile and flexural strength are reduced upon increasing filler loading.展开更多
CFD has penetrated into the field of electronic cooling for some time. Both parallel and staggered plate fin heatsinks are widely used in modern computers. This paper presents the ways to make most use of CFD in optim...CFD has penetrated into the field of electronic cooling for some time. Both parallel and staggered plate fin heatsinks are widely used in modern computers. This paper presents the ways to make most use of CFD in optimization design of those heatsinks: the flow and heat transfer of staggered and parallel plate fm heatsinks of various geometry were simulated by using Fluent 5.0 commercial CFD code. Based on 60 different simulation solutions, two correlations, concerning Nusselt number and friction factor as the functions of geometrical and operational parameters of the heatsinks were developed. The presentation parameter examination was also performed by comparing the numerical solutions with the analytical solutions of parallel plate arrays, showing that the correct parameters are used in the correlations.展开更多
基金The National Natural Science Foundation of China(No.50906073,31070517)China Postdoctoral Science Foundation(No.20110491332)+1 种基金Jiangsu Planned Projects for Postdoctoral Research Funds(No.1101009B)the Science and Technology Development Plan of North Jiangsu(No.BC2012444)
文摘The relationship between the thermal/electrical conductivity enhancement in graphite nanoplatelets （GNPs） composites and the properties of filling graphite nanoplatelets is studied. The effective thermal and electrical conductivity enhancements of GNP-oil nanofluids and GNP-polyimide composites are measured. By taking into account the particle shape, the volume fraction, the thermal conductivity of filling particles and the base fluids, the thermal and electrical conductivity enhancements of GNP nanofluids are theoretically predicted by the generalized effective medium theory. Both the nonlinear dependence of effective thermal conductivity on the GNP volume fraction in nanofhiids and the very low percolation threshold for GNP-polyimide composites are well predicted. The theoretical predications are found to be in reasonably good agreement with the experimental data. The generalized effective medium theory can be used for predicting the thermal and electrical properties of GNP composites and it is still available for most of the thermal/electrical modifications in two-phase composites.
文摘The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.
基金Projects(51004035,51374002,50734001)supported by the National Natural Science Foundation of ChinaProject(2012BAE03B00)supported by the National Key Technology R&D Program,China+1 种基金Project(2012AA03A506)supported by the High-tech R&D Program,ChinaProject(N120407009)supported by the Fundamental Research Funds for the Central Universities,China
文摘Electrical steel sheets with 6.5%(mas fraction) Si with good shapes and superior magnetic inductions were successfully produced by a specially designed processing route including ingot casting, hot rolling and warm rolling both with interpass thermal treatment, and final annealing. The sheets were of 0.2 mm and 0.3 mm thick over 140 mm width. A detailed study of the microstructural and textural evolutions from the hot rolling to annealing was carried out by optical microscopy, X-ray diffraction and electron backscattered diffraction. The hot rolled sheet characterized by near-equiaxed grains was dominated by the mixture of <001>//ND fiber(λ-fiber), <110>//RD fiber(α-fiber) and <111>//ND fiber(γ-fiber) textures owing to the partial recrystallization and strain induced boundary migration(SIBM) during the hot rolling interpass thermal treatment. The static recovery and SIBM during the warm rolling interpass thermal treatment result in large and elongated warm rolling grains. The warm rolling texture is dominated by obvious λ, Goss and strong γ-fiber textures. The application of the interpass thermal treatment during hot and warm rolling significantly enhances the impact of SIBM during annealing, which is responsible for the formation of the moderate λ-fiber, some near-λ fiber texture components and the obviously weakened γ-fiber texture in the annealed sheet, leading to a higher magnetic induction compared to the commercially produced 6.5% Si steel by chemical vapor deposition(CVD).
文摘The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly thermal conductive h-BN and graphite gives rise to large increase （about 2 times） of thermal conductivity of individual polymer. In PPS/graphite system, the higher conductivity value was obtained when smaller graphites were added. Meanwhile, the tensile and flexural strength are reduced upon increasing filler loading.
文摘CFD has penetrated into the field of electronic cooling for some time. Both parallel and staggered plate fin heatsinks are widely used in modern computers. This paper presents the ways to make most use of CFD in optimization design of those heatsinks: the flow and heat transfer of staggered and parallel plate fm heatsinks of various geometry were simulated by using Fluent 5.0 commercial CFD code. Based on 60 different simulation solutions, two correlations, concerning Nusselt number and friction factor as the functions of geometrical and operational parameters of the heatsinks were developed. The presentation parameter examination was also performed by comparing the numerical solutions with the analytical solutions of parallel plate arrays, showing that the correct parameters are used in the correlations.
