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Preparation and properties of waste tea leaves particleboard 被引量:7
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作者 Shi Jin-shu Li Jian-zhang +1 位作者 Fan Yong-ming Ma Hong-xia 《Forestry Studies in China》 CAS 2006年第1期41-45,共5页
Urea-formaldehyde (UF) adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low f... Urea-formaldehyde (UF) adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low formaldehyde emission boards. In our study, waste tea leaves and UF adhesive were employed in the preparation of waste tea leaves particleboard (WTLB). An orthogonal experimental method was applied to investigate the effects of process parameters on formaldehyde emission and mechanical properties of WTLB. The results indicated that: 1) waste tea leaves had the ability to abate formaldehyde emission from boards; and 2) density of the WTLB was a significant factor affecting its modulus of rupture (MOR), modulus of elasticity (MOE) and internal bonding (IB). 展开更多
关键词 waste tea leaves particleboard (wtlb) formaldehyde emission mechanical property orthogonal design
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