Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the ...Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the Al2O3 gate insulator each with a thickness of 30 nm are grown by the plasma-enhanced atomic layer deposition(PEALD).The energy band diagrams of two types of dielectric MIS-HEMTs are compared.The breakdown voltage(VBR)of HfO2 dielectric layer and Al2O3 dielectric layer are 9.4 V and 15.9 V,respectively.With the same barrier thickness,the transconductance of MIS-HEMT with HfO2 is larger.The threshold voltage(Vth)of the HfO2 and Al2O3 MIS-HEMT are 2.0 V and 2.4 V,respectively,when the barrier layer thickness is 0 nm.The C-V characteristics are in good agreement with the Vth's transfer characteristics.As the barrier layer becomes thinner,the drain current density decreases sharply.Due to the dielectric/AlGaN interface is very close to the channel,the scattering of interface states will lead the electron mobility to decrease.The current collapse and the Ron of Al2O3 MIS-HEMT are smaller at the maximum gate voltage.As Al2O3 has excellent thermal stability and chemical stability,the interface state density of Al2O3/AlGaN is less than that of HfO2/AlGaN.展开更多
Atomic layer deposition （ALD） technique is used in the preparation of organic/inorganic layers, which requires uniform surfaces with their thickness down to several nanometers. For film with such thickness, the grow...Atomic layer deposition （ALD） technique is used in the preparation of organic/inorganic layers, which requires uniform surfaces with their thickness down to several nanometers. For film with such thickness, the growth mode defined as the arrangement of clusters on the surface during the growth is of significance. In this work, Al2O3 thin film was deposited on various interfacial species of pre-treated polyethylene terephthalate （PET, 12 μm） by plasma assisted atomic layer deposition （PA-ALD）, where trimethyl aluminium was used as the Al precursor and O2 as the oxygen source. The interracial species, -NH3, -OH, and -COOH as well as SiCHO （derived from monomer of HMDSO plasma）, were grafted previously by plasma and chemical treatments. The growth mode of PA-ALD Al2O3 was then investigated in detail by combining results from in-situ diagnosis of spectroscopic ellipsometry （SE） and ex-situ characterization of as-deposited layers from the morphologies scanned by atomic force microscopy （AFM）. In addition, the oxygen transmission rates （OTR） of the original and treated plastic films were measured. The possible reasons for the dependence of the OTR values on the surface species were explored.展开更多
SiO2Al2O3 double dielectric stack layer was deposited on the surface of the GaN-based light-emitting diode (LED). The double dielectric stack layer enhances both the electrical characteristics and the optical output p...SiO2Al2O3 double dielectric stack layer was deposited on the surface of the GaN-based light-emitting diode (LED). The double dielectric stack layer enhances both the electrical characteristics and the optical output power of the LED because the first Al2O3 layer plays a role of effectively passivating the p-GaN surface and the second lower index SiO2 layer increases the critical angle of the light emitted from the LED surface. In addition, the effect of the Fresnel reflection is also responsible for the enhancement in output power of the double dielectric passivated LED. The leakage current of the LED passivated with Al2O3 layer was -3.46 × 10-11 A at -5 V, at least two and three orders lower in magnitude compared to that passivated with SiO2 layer (-7.14 × 10-9 A) and that of non-passivated LED (-1.9 × 10-8 A), respectively, which indicates that the Al2O3 layer is very effective in passivating the exposed GaN surface after dry etch and hence reduces nonradiative recombination as well as reabsorption of the emitted light near the etched surface.展开更多
This paper studies systematically the drain current collapse in AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors （MOS-HEMTs） by applying pulsed stress to the device. Low-temperature layer of Al...This paper studies systematically the drain current collapse in AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors （MOS-HEMTs） by applying pulsed stress to the device. Low-temperature layer of Al2O3 ultrathin film used as both gate dielectric and surface passivation layer was deposited by atomic layer deposition （ALD）. For HEMT, gate turn-on pulses induced large current collapse. However, for MOS-HEMT, no significant current collapse was found in the gate turn-on pulsing mode with different pulse widths, indicating the good passivation effect of ALD Al2O3. A small increase in Id in the drain pulsing mode is due to the relieving of self-heating effect. The comparison of synchronously dynamic pulsed Id - Vds characteristics of HEMT and MOS-HEMT further demonstrated the good passivation effect of ALD Al2O3.展开更多
A high-performance enhancement-mode （E-mode） gallium nitride （GaN）-based metal-insulator- semiconductor high electron mobility transistor （MIS-HEMT） that employs a 5-nm-thick aluminum gallium nitride （Al0.3Ga0...A high-performance enhancement-mode （E-mode） gallium nitride （GaN）-based metal-insulator- semiconductor high electron mobility transistor （MIS-HEMT） that employs a 5-nm-thick aluminum gallium nitride （Al0.3Ga0.7N） as a barrier layer and relies on silicon nitride （SIN） passivation to control the 2DEG density is presented. Unlike the SiN passivation, aluminum oxide （AL2O3） by atomic layer deposition （ALD） on A1GaN surface would not increase the 2DEG density in the heterointerface. ALD AL2O3 was used as gate insulator after the depletion by etching of the SiN in the gate region. The E-mode MIS-HEMT with gate length （LG） of 1 μm showed a maximum drain current density （IDs） of 657 mA/mm, a maximum extrinsic transconductance （gin） of 187 mS/ram and a threshold voltage （Vth） of 1 V. Comparing with the corresponding E-mode HEMT, the device performances had been greatly improved due to the insertion of AL2O3 gate insulator. This provided an excellent way to realize E-mode A1GaN/GaN MIS-HEMTs with both high Vth and IDS.展开更多
A1GaN/GaN fin-shaped metal-oxide-semiconductor high-electron-mobility transistors （fin-MOSHEMTs） with dif- ferent fin widths （30Ohm and lOOnm） on sapphire substrates are fabricated and characterized. High-quality ...A1GaN/GaN fin-shaped metal-oxide-semiconductor high-electron-mobility transistors （fin-MOSHEMTs） with dif- ferent fin widths （30Ohm and lOOnm） on sapphire substrates are fabricated and characterized. High-quality self-Migned Al2O3 gate dielectric underneath an 80-nm T-shaped gate is employed by Muminum self-oxidation, which induces 4 orders of magnitude reduction in the gate leakage current. Compared with conventional planar MOSHEMTs, short channel effects of the fabricated fin-MOSHEMTs are significantly suppressed due to the tri- gate structure, and excellent de characteristics are obtained, such as extremely fiat output curves, smaller drain induced barrier lower, smaller subthreshold swing, more positive threshold voltage, higher transconductance and higher breakdown voltage.展开更多
研究了 Ga_2O_3/Al_2O_3 膜反应自组装制备 GaN 薄膜。首先利用磁控溅射法在硅衬底上制备 Ga_2O_3/Al2O3膜,再将Ga_2O_3/Al_2O_3 膜在高纯氨气气氛中氨化反应得到了 GaN 薄膜。用 X 射线衍射(XRD),X 光光电子能谱(XPS)、扫描电镜(SEM)...研究了 Ga_2O_3/Al_2O_3 膜反应自组装制备 GaN 薄膜。首先利用磁控溅射法在硅衬底上制备 Ga_2O_3/Al2O3膜,再将Ga_2O_3/Al_2O_3 膜在高纯氨气气氛中氨化反应得到了 GaN 薄膜。用 X 射线衍射(XRD),X 光光电子能谱(XPS)、扫描电镜(SEM)、透射电镜(TEM)和 荧光光谱(PL)对样品进行结构、组分、形貌和发光特性的分析。测试结果表明:用此方法得到了六方纤锌矿结构的 GaN 晶体膜。展开更多
We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) Al2O3 as the gate dielectric. Through further decreasing the thickness of the gate oxide to ...We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) Al2O3 as the gate dielectric. Through further decreasing the thickness of the gate oxide to 3.5 nm and optimizing the device fabrication process,a device with maximum transconductance of 150 mS/mm was produced. The drain current of this 0.8 μm gate-length MOS-HEMT could reach 800 mA/mm at +3.0 V gate bias. Compared to a conventional AlGaN/GaN HEMT of similar design,better interface property,lower leakage current,and smaller capacitance-voltage (C-V) hysteresis were obtained,and the superiority of this MOS-HEMT device structure with ALD Al2O3 gate dielectric was exhibited.展开更多
In this paper, Al2O3 ultrathin film used as the surface passivation layer for A1GaN/GaN high electron mobility transistor （HEMT） is deposited by thermal atomic layer deposition （ALD）, thereby avoiding plasma-induc...In this paper, Al2O3 ultrathin film used as the surface passivation layer for A1GaN/GaN high electron mobility transistor （HEMT） is deposited by thermal atomic layer deposition （ALD）, thereby avoiding plasma-induced damage and erosion to the surface. A comparison is made between the surface passivation in this paper and the conventional plasma enhanced chemical vapor deposition （PECVD） SiN passivation. A remarkable reduction of the gate leakage current and a significant increase in small signal radio frequency （RF） performance are achieved after applying Al2O3＋BCB passivation. For the Al2O3＋BCB passivated device with a 0.7μm gate, the value of fmax reaches up to 100 GHz, but it decreases to 40 GHz for SiN HEMT. The fmax/ft ratio （〉 4） is also improved after Al2O3＋BCB passivation. The capacitancevoltage （C-V） measurement demonstrates that Al2O3＋BCB HEMT shows quite less density of trap states （on the order of magnitude of 1010 cm-2） than that obtained at commonly studied SiN HEMT.展开更多
This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with A...This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved.展开更多
A Ga2O·11Al2O3 nanonet was synthesized by using Ga2O3 powder as the precursor to generate Ga2O vapor in H2 atmosphere which further reacted with Al2O3 at 730 °C to form Ga2O·11Al2O3 at the interfaces of...A Ga2O·11Al2O3 nanonet was synthesized by using Ga2O3 powder as the precursor to generate Ga2O vapor in H2 atmosphere which further reacted with Al2O3 at 730 °C to form Ga2O·11Al2O3 at the interfaces of a porous anodic aluminum oxide (AAO) template. The prepared Ga2O·11Al2O3 nanonet then served as a Ga2O-stablizing reservoir to fabricate single crystal GaN nanowires. The residual Ga2O3 powder at the surface of the produced Ga2O·11Al2O3 nanonet and the metallic Ga or Ga2O from the Ga2O·11Al2O3 decomposition reacted with ammonia to yield GaN nanowires at 780 °C. The reaction mechanisms were investigated.展开更多
基金the National Natural Science Foundation of China(Grant Nos.61974111,11690042,and 61974115)the National Pre-research Foundation of China(Grant No.31512050402)the Fund of Innovation Center of Radiation Application,China(Grant No.KFZC2018040202).
文摘Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the Al2O3 gate insulator each with a thickness of 30 nm are grown by the plasma-enhanced atomic layer deposition(PEALD).The energy band diagrams of two types of dielectric MIS-HEMTs are compared.The breakdown voltage(VBR)of HfO2 dielectric layer and Al2O3 dielectric layer are 9.4 V and 15.9 V,respectively.With the same barrier thickness,the transconductance of MIS-HEMT with HfO2 is larger.The threshold voltage(Vth)of the HfO2 and Al2O3 MIS-HEMT are 2.0 V and 2.4 V,respectively,when the barrier layer thickness is 0 nm.The C-V characteristics are in good agreement with the Vth's transfer characteristics.As the barrier layer becomes thinner,the drain current density decreases sharply.Due to the dielectric/AlGaN interface is very close to the channel,the scattering of interface states will lead the electron mobility to decrease.The current collapse and the Ron of Al2O3 MIS-HEMT are smaller at the maximum gate voltage.As Al2O3 has excellent thermal stability and chemical stability,the interface state density of Al2O3/AlGaN is less than that of HfO2/AlGaN.
基金supported by National Natural Science Foundation of China (No.11175024)Beijing Natural Science Foundation (No.1112012),2011BAD24B01+1 种基金Scientific Research Common Program of Beijing Municipal Commission of Education(KM201110015008,KM201010015005)Funding Project for Academic Human Resources Development in Institutions of Higher Learning Under theJurisdiction of Beijing Municipality (PHR20110516)
文摘Atomic layer deposition （ALD） technique is used in the preparation of organic/inorganic layers, which requires uniform surfaces with their thickness down to several nanometers. For film with such thickness, the growth mode defined as the arrangement of clusters on the surface during the growth is of significance. In this work, Al2O3 thin film was deposited on various interfacial species of pre-treated polyethylene terephthalate （PET, 12 μm） by plasma assisted atomic layer deposition （PA-ALD）, where trimethyl aluminium was used as the Al precursor and O2 as the oxygen source. The interracial species, -NH3, -OH, and -COOH as well as SiCHO （derived from monomer of HMDSO plasma）, were grafted previously by plasma and chemical treatments. The growth mode of PA-ALD Al2O3 was then investigated in detail by combining results from in-situ diagnosis of spectroscopic ellipsometry （SE） and ex-situ characterization of as-deposited layers from the morphologies scanned by atomic force microscopy （AFM）. In addition, the oxygen transmission rates （OTR） of the original and treated plastic films were measured. The possible reasons for the dependence of the OTR values on the surface species were explored.
文摘SiO2Al2O3 double dielectric stack layer was deposited on the surface of the GaN-based light-emitting diode (LED). The double dielectric stack layer enhances both the electrical characteristics and the optical output power of the LED because the first Al2O3 layer plays a role of effectively passivating the p-GaN surface and the second lower index SiO2 layer increases the critical angle of the light emitted from the LED surface. In addition, the effect of the Fresnel reflection is also responsible for the enhancement in output power of the double dielectric passivated LED. The leakage current of the LED passivated with Al2O3 layer was -3.46 × 10-11 A at -5 V, at least two and three orders lower in magnitude compared to that passivated with SiO2 layer (-7.14 × 10-9 A) and that of non-passivated LED (-1.9 × 10-8 A), respectively, which indicates that the Al2O3 layer is very effective in passivating the exposed GaN surface after dry etch and hence reduces nonradiative recombination as well as reabsorption of the emitted light near the etched surface.
基金Project supported by NSFC (Grant No 60736033)National 973 Basic Research Project (Grant No 51327020301)
文摘This paper studies systematically the drain current collapse in AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors （MOS-HEMTs） by applying pulsed stress to the device. Low-temperature layer of Al2O3 ultrathin film used as both gate dielectric and surface passivation layer was deposited by atomic layer deposition （ALD）. For HEMT, gate turn-on pulses induced large current collapse. However, for MOS-HEMT, no significant current collapse was found in the gate turn-on pulsing mode with different pulse widths, indicating the good passivation effect of ALD Al2O3. A small increase in Id in the drain pulsing mode is due to the relieving of self-heating effect. The comparison of synchronously dynamic pulsed Id - Vds characteristics of HEMT and MOS-HEMT further demonstrated the good passivation effect of ALD Al2O3.
基金Project supported by the National Natural Science Foundation of China(Nos.61474101,61106130)the Natural Science Foundation of Jiangsu Province of China(No.BK20131072)
文摘A high-performance enhancement-mode （E-mode） gallium nitride （GaN）-based metal-insulator- semiconductor high electron mobility transistor （MIS-HEMT） that employs a 5-nm-thick aluminum gallium nitride （Al0.3Ga0.7N） as a barrier layer and relies on silicon nitride （SIN） passivation to control the 2DEG density is presented. Unlike the SiN passivation, aluminum oxide （AL2O3） by atomic layer deposition （ALD） on A1GaN surface would not increase the 2DEG density in the heterointerface. ALD AL2O3 was used as gate insulator after the depletion by etching of the SiN in the gate region. The E-mode MIS-HEMT with gate length （LG） of 1 μm showed a maximum drain current density （IDs） of 657 mA/mm, a maximum extrinsic transconductance （gin） of 187 mS/ram and a threshold voltage （Vth） of 1 V. Comparing with the corresponding E-mode HEMT, the device performances had been greatly improved due to the insertion of AL2O3 gate insulator. This provided an excellent way to realize E-mode A1GaN/GaN MIS-HEMTs with both high Vth and IDS.
基金Supported by the National Natural Science Foundation of China under Grant No 61306113
文摘A1GaN/GaN fin-shaped metal-oxide-semiconductor high-electron-mobility transistors （fin-MOSHEMTs） with dif- ferent fin widths （30Ohm and lOOnm） on sapphire substrates are fabricated and characterized. High-quality self-Migned Al2O3 gate dielectric underneath an 80-nm T-shaped gate is employed by Muminum self-oxidation, which induces 4 orders of magnitude reduction in the gate leakage current. Compared with conventional planar MOSHEMTs, short channel effects of the fabricated fin-MOSHEMTs are significantly suppressed due to the tri- gate structure, and excellent de characteristics are obtained, such as extremely fiat output curves, smaller drain induced barrier lower, smaller subthreshold swing, more positive threshold voltage, higher transconductance and higher breakdown voltage.
文摘研究了 Ga_2O_3/Al_2O_3 膜反应自组装制备 GaN 薄膜。首先利用磁控溅射法在硅衬底上制备 Ga_2O_3/Al2O3膜,再将Ga_2O_3/Al_2O_3 膜在高纯氨气气氛中氨化反应得到了 GaN 薄膜。用 X 射线衍射(XRD),X 光光电子能谱(XPS)、扫描电镜(SEM)、透射电镜(TEM)和 荧光光谱(PL)对样品进行结构、组分、形貌和发光特性的分析。测试结果表明:用此方法得到了六方纤锌矿结构的 GaN 晶体膜。
基金Supported by the National Natural Science Foundation of China (Grant No. 60736033)the National Basic Research Program of China ("973") (Grant No. 51327020301)
文摘We report on a GaN metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) using atomic-layer deposited (ALD) Al2O3 as the gate dielectric. Through further decreasing the thickness of the gate oxide to 3.5 nm and optimizing the device fabrication process,a device with maximum transconductance of 150 mS/mm was produced. The drain current of this 0.8 μm gate-length MOS-HEMT could reach 800 mA/mm at +3.0 V gate bias. Compared to a conventional AlGaN/GaN HEMT of similar design,better interface property,lower leakage current,and smaller capacitance-voltage (C-V) hysteresis were obtained,and the superiority of this MOS-HEMT device structure with ALD Al2O3 gate dielectric was exhibited.
文摘In this paper, Al2O3 ultrathin film used as the surface passivation layer for A1GaN/GaN high electron mobility transistor （HEMT） is deposited by thermal atomic layer deposition （ALD）, thereby avoiding plasma-induced damage and erosion to the surface. A comparison is made between the surface passivation in this paper and the conventional plasma enhanced chemical vapor deposition （PECVD） SiN passivation. A remarkable reduction of the gate leakage current and a significant increase in small signal radio frequency （RF） performance are achieved after applying Al2O3＋BCB passivation. For the Al2O3＋BCB passivated device with a 0.7μm gate, the value of fmax reaches up to 100 GHz, but it decreases to 40 GHz for SiN HEMT. The fmax/ft ratio （〉 4） is also improved after Al2O3＋BCB passivation. The capacitancevoltage （C-V） measurement demonstrates that Al2O3＋BCB HEMT shows quite less density of trap states （on the order of magnitude of 1010 cm-2） than that obtained at commonly studied SiN HEMT.
基金Project supported by National Advanced Research Program (Grant No 51308030102)Xi’an Applied Materials Innovation Fund (Grant No XA-AM-200616)National Natural Science Foundation of China (Grant Nos 60506020 and 60676048)
文摘This paper discusses the effect of N2 plasma treatment before dielectric deposition on the electrical performance of a Al203/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor （MISHEMT）,with Al203 deposited by atomic layer deposition.The results indicated that the gate leakage was decreased two orders of magnitude after the Al203/AlGaN interface was pretreated by N2 plasma.Furthermore,effects of N2 plasma pretreatrnent on the electrical properties of the AlGaN/Al2O3 interface were investigated by x-ray photoelectron spectroscopy measurements and the interface quality between Al203 and AlGaN film was improved.
基金supported by the National Natural Science Foundation of China (Grant Nos. 50821061, 20773001, 20827002)Ministry of Sceince and Technology of China (2006CB806102, 2007CB936202, 2009CB929403)
文摘A Ga2O·11Al2O3 nanonet was synthesized by using Ga2O3 powder as the precursor to generate Ga2O vapor in H2 atmosphere which further reacted with Al2O3 at 730 °C to form Ga2O·11Al2O3 at the interfaces of a porous anodic aluminum oxide (AAO) template. The prepared Ga2O·11Al2O3 nanonet then served as a Ga2O-stablizing reservoir to fabricate single crystal GaN nanowires. The residual Ga2O3 powder at the surface of the produced Ga2O·11Al2O3 nanonet and the metallic Ga or Ga2O from the Ga2O·11Al2O3 decomposition reacted with ammonia to yield GaN nanowires at 780 °C. The reaction mechanisms were investigated.
