Undereooling eoperiments on binary Ni50 Cu50 alloy melts were conducted. The hypercooling limit of this alloy, which is about 310K, was evaluated by mcasuring plateau time needed for the interkendritic liquid solidifi...Undereooling eoperiments on binary Ni50 Cu50 alloy melts were conducted. The hypercooling limit of this alloy, which is about 310K, was evaluated by mcasuring plateau time needed for the interkendritic liquid solidification and extmpolating this function to zero. This limit was exceeded first in the binary alloy undereooled by about 320K.The effect of liquid undercooling on the respective microstructure evolution was studied by optical metallogrnphy. The hypercooled microstructure contains rcsidual fragments within grain boundaries and is quite different from those obtained at undercoolings below 310K. The finding indicated the existence of dendrite break up. The dendrite break up may be induced either by remelting or by stress. By considering hyperrooling conditions and comparing two grain ndnement microstructures observed at small and larpe undereoolings, the forms of dendrite break up and the grain refinement mechanism exceeding the hypereooling limit are further discussed.展开更多
Ni_(25)Ti_(50)Cu_(25) shape memory particle/Al matrix composite was prepared by hot pressing and further extrusion.The Ni_(25)Ti_(50)Cu_(25) particles embeded in Al matrix still keep B19 and B19 structure,and have a g...Ni_(25)Ti_(50)Cu_(25) shape memory particle/Al matrix composite was prepared by hot pressing and further extrusion.The Ni_(25)Ti_(50)Cu_(25) particles embeded in Al matrix still keep B19 and B19 structure,and have a good thermal-elastic martensitic transition with 6K thermal hysteresis,the phase transition temperatures remaining constant during cycling. The scratching force of Ni_(25)Ti_(50)Cu_(25) particle is two times that of Al matrix,When the scratching force is larger than 4.2N, the Ni_(25)Ti_(50)Cu_(25) particle is separated from Al matrix.展开更多
文摘Undereooling eoperiments on binary Ni50 Cu50 alloy melts were conducted. The hypercooling limit of this alloy, which is about 310K, was evaluated by mcasuring plateau time needed for the interkendritic liquid solidification and extmpolating this function to zero. This limit was exceeded first in the binary alloy undereooled by about 320K.The effect of liquid undercooling on the respective microstructure evolution was studied by optical metallogrnphy. The hypercooled microstructure contains rcsidual fragments within grain boundaries and is quite different from those obtained at undercoolings below 310K. The finding indicated the existence of dendrite break up. The dendrite break up may be induced either by remelting or by stress. By considering hyperrooling conditions and comparing two grain ndnement microstructures observed at small and larpe undereoolings, the forms of dendrite break up and the grain refinement mechanism exceeding the hypereooling limit are further discussed.
文摘Ni_(25)Ti_(50)Cu_(25) shape memory particle/Al matrix composite was prepared by hot pressing and further extrusion.The Ni_(25)Ti_(50)Cu_(25) particles embeded in Al matrix still keep B19 and B19 structure,and have a good thermal-elastic martensitic transition with 6K thermal hysteresis,the phase transition temperatures remaining constant during cycling. The scratching force of Ni_(25)Ti_(50)Cu_(25) particle is two times that of Al matrix,When the scratching force is larger than 4.2N, the Ni_(25)Ti_(50)Cu_(25) particle is separated from Al matrix.
