The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon elect...The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation,aerospace,and electronic packaging fields.We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents(5vol%,10vol%,15vol%,and 20vol%).The results showed that as the SiC content increased,the tensile strength of the composite material first increased and then decreased.The tensile strength was the highest when the SiC content was 15%;the sintering temperature significantly affected the composite material’s structural density and mechanical properties.Findings indicated 700℃was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10%and 15%.Besides,the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.展开更多
The rapid development of the electronic information industry brings to the irreplaceable role of electronic components, therefore the search of a more reliable packaging material has become increasingly important. In ...The rapid development of the electronic information industry brings to the irreplaceable role of electronic components, therefore the search of a more reliable packaging material has become increasingly important. In the electronic packaging system, the failure phenomenon caused by residual stress is one of the key factors restricting the development of electronic packaging technology. In order to use the in-situ characterization technology to explore the residual stress inducing mechanism and failure mechanism of epoxy-based advanced packaging materials, this paper gives a review of related previous research, and lays a theoretical foundation for the upcoming research. The classification and generation mechanism of residual stress are clarified in this paper, which provides data support for future related research.展开更多
A hypereutectic Al-50 wt%Si alloy for electronic packaging was prepared by spark plasma sintering(SPS)technology using gas-atomized Al-50 wt%Si powder.The effect of sintering parameters on alloy phase composition,micr...A hypereutectic Al-50 wt%Si alloy for electronic packaging was prepared by spark plasma sintering(SPS)technology using gas-atomized Al-50 wt%Si powder.The effect of sintering parameters on alloy phase composition,microstructure,thermal performance and the tensile strength at different temperatures was investigated.The experimental results show that the alloy can obey the diffraction peaks of silicon and aluminum without other peaks appearing.The primary silicon in the prepared alloy can be evenly distributed in the aluminum matrix.The coefficient of thermal expansion(CTE)and thermal conductivity(TC)of the alloy will improve with the increase of sintering temperature,but they will decrease after sintering for a long time,which is caused by the large difference of coefficient of thermal expansion between silicon and aluminum.The tensile properties of the alloy at room temperature will increase with the increase of sintering temperature,but higher test temperatures will inhibit the tensile properties except the elongation.The morphology and fracture mode of the tensile fracture are also analyzed to determine the good bonding strength of the alloy.展开更多
Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu na...Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu nanoparticles(Cu@Ag NPs)paste can execute bonding with high quality at 250℃,and the achieved supersaturated Ag-Cu nanoalloy joint with ultrahigh shear strength(152 MPa)dramatically exceeds most nano-paste joints.The interstitial solid solutions with atomic-level metallurgical bonds at the interface dominantly promoted the shear strength.Besides,the numerous ultrafine nanograin,high proportion of low angle grain boundaries(7.44%)without deformation,and the Cu nanoprecipitates in the joint would improve subordinately.Furthermore,the high content(16.8%)of∑3 twin boundaries would contribute to the electrical and thermal conductivity.Thus,the multiple strengthening mechanisms with the solid solution,the second precipitated phase,and ultrafine nanograin can dramatically enhance shear strength and electro-thermal conductivity of joints for high-temperature device packaging.展开更多
Silicon/aluminum(Si/Al)composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of ther...Silicon/aluminum(Si/Al)composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of thermal expansion(CTE)and high thermal conductivity were produced by powder metallurgy(PM).The Si/Al composites are fully dense and have fine Si particles uniquely distributed within pure Al matrix.Three 50%Si/Al composites were designed to have strength in the range of 185-290 MPa to meet different demands,while the other properties keep invariable.Fracture toughness of the composites is measured to be 9-10 MPa·m^(1/2).The composites were machined to 50%Si/Al housings and 27%Si/Al lids.Both the hermeticities of housings before and after laser-beam-welding sealing are determined.The measured leak rate of composites and sealed housings is in magnitude order of 1×10^(-10)and 1×10^(-9)Pa·m^(3)·s^(-1),respectively,suggesting high hermeticity.The good hermeticity is attributed to the full dense materials,good weldability,and extremely low weld porosity.The present Si/Al composites are expected to be extensively used in highly hermetic electronic packages.展开更多
In order to evaluate the insulation of two-phase immersion cooling in the HV power electronic package,the insulation degradation of the dielectric interface induced by bubbles is investigated.In this paper,a test stra...In order to evaluate the insulation of two-phase immersion cooling in the HV power electronic package,the insulation degradation of the dielectric interface induced by bubbles is investigated.In this paper,a test strategy with 50 Hz unipolar DC and AC combined voltage for partial discharge(PD)at boiling interface of AlN ceramic is proposed.The insulation threshold of an AlN ceramic surface is acquired in several dielectric environments,such as air,FC-72 liquid(FC-72,a Fluorinert^(TM) from 3^(TM)),FC-72 vapor,and boiling state of FC72.This reveals the deterioration of boiling on the insulation of the surface immersed in the dielectric refrigerant.To investigate the mechanism of the PD feature at the boiling interface,the PD patterns of the unrestricted bubble and the accumulated bubble are acquired and contrastively analyzed.Combined with the feature of the back discharge and the bubble behavior,the charged vapor-ceramic interface is relatively stable due to the accumulated vapor layer.This stability of the charged vaporceramic interface is broken if the bubble is unrestricted.Besides,it is discovered that the vapor-liquid interface inside the bubble may be another charged interface,which can also trigger a back discharge.展开更多
Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious e...Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects.Adding conductive fillers is a traditional method for highly conductive adhesive tapes.However,the content of conductive fillers is needed to reach the percolation threshold,which is usually as high as tens of percent.High-content fillers result in significant loss of adhesive property and high fabrication cost.Herein,we introduce a rational architecture of conductive microsphere monolayer(CMM)in the PSA layer.The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction.Importantly,low contents of conductive microspheres(≤5%(mass fraction,w))can achieve the target of conductivity improvement,but not result in the serious loss of the adhesive property.Therefore,the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes.Finally,we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes,indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.展开更多
Heat transfer using air jet impingement technique is one of the conspicuous tasks in the looming world of electronic packaging system.Here,the material selection of heat sink becomes one of the prior and important ass...Heat transfer using air jet impingement technique is one of the conspicuous tasks in the looming world of electronic packaging system.Here,the material selection of heat sink becomes one of the prior and important assignments to construct a heat sink with desired characteristic cooling rate.In order to study the material effect of heat sink over the cooling characteristic,the present work takes an initiative in plotting the Nusselt magnitude over the radial distance for different material of heat sink.This is done by computing the flow regime and heat transfer characteristic of a 2D axis symmetric geometry in commercial simulating software,ANSYS CFX.The computation of cooling characteristic in form of Nusselt profile is done using SST+Gamma–theta turbulence model.Since the prediction of heat interaction due to the intermediacy and transition in the flow regime is a unique issue of this problem.The results for Nusselt curve signifies a tangible elevation in local Nusselt value(nonuniformity)with decrease in thermal diffusivity of target surface.Also the nonuniformity is observed to vanish above a critical range(66.76mm2/s)of thermal diffusivity.This happens due to presences of abnormal turbulence of heat flow which occurs inside the target surface.Since the variation in thermal diffusivity causes some imbalance competition between the heat storage and dissipation capabilities.Above all the target surface carrying thermal diffusivity less than 66.76mm2/s possesses a dominating heat storage capability,on behalf of which some heat transfer occurring in near jet and far jet regions are being restricted.These are transferred towards stagnation region in radial direction.展开更多
文摘The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation,aerospace,and electronic packaging fields.We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents(5vol%,10vol%,15vol%,and 20vol%).The results showed that as the SiC content increased,the tensile strength of the composite material first increased and then decreased.The tensile strength was the highest when the SiC content was 15%;the sintering temperature significantly affected the composite material’s structural density and mechanical properties.Findings indicated 700℃was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10%and 15%.Besides,the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.
文摘The rapid development of the electronic information industry brings to the irreplaceable role of electronic components, therefore the search of a more reliable packaging material has become increasingly important. In the electronic packaging system, the failure phenomenon caused by residual stress is one of the key factors restricting the development of electronic packaging technology. In order to use the in-situ characterization technology to explore the residual stress inducing mechanism and failure mechanism of epoxy-based advanced packaging materials, this paper gives a review of related previous research, and lays a theoretical foundation for the upcoming research. The classification and generation mechanism of residual stress are clarified in this paper, which provides data support for future related research.
基金the Shanxi Key Laboratory of Nano-materials and Technology,China(Nos.18JS060,17JS075)。
文摘A hypereutectic Al-50 wt%Si alloy for electronic packaging was prepared by spark plasma sintering(SPS)technology using gas-atomized Al-50 wt%Si powder.The effect of sintering parameters on alloy phase composition,microstructure,thermal performance and the tensile strength at different temperatures was investigated.The experimental results show that the alloy can obey the diffraction peaks of silicon and aluminum without other peaks appearing.The primary silicon in the prepared alloy can be evenly distributed in the aluminum matrix.The coefficient of thermal expansion(CTE)and thermal conductivity(TC)of the alloy will improve with the increase of sintering temperature,but they will decrease after sintering for a long time,which is caused by the large difference of coefficient of thermal expansion between silicon and aluminum.The tensile properties of the alloy at room temperature will increase with the increase of sintering temperature,but higher test temperatures will inhibit the tensile properties except the elongation.The morphology and fracture mode of the tensile fracture are also analyzed to determine the good bonding strength of the alloy.
基金This work was financially supported by the National Natu-ral Science Foundation of China(No.NSFC 51775140)A part of the work was also supported by the National Science and Technology Major Project(No.2017-VI-0009-0080)+2 种基金the Guangdong Province key research and development program(No.2019B010935001)the Shenzhen Science and Technology Plan(No.JCYJ20180507183511908)Bureau of Industry and Information Technology of Shenzhen through the Innovation Chain and Industry Chain(No.201806071354163490).
文摘Ag-Cu bimetallic nanoalloy,integrating the advantages of reducing migration and cost of nano-Ag and alleviating oxidation of nano-Cu,is a prospective bonding material for power electronic packaging.The Ag-coated Cu nanoparticles(Cu@Ag NPs)paste can execute bonding with high quality at 250℃,and the achieved supersaturated Ag-Cu nanoalloy joint with ultrahigh shear strength(152 MPa)dramatically exceeds most nano-paste joints.The interstitial solid solutions with atomic-level metallurgical bonds at the interface dominantly promoted the shear strength.Besides,the numerous ultrafine nanograin,high proportion of low angle grain boundaries(7.44%)without deformation,and the Cu nanoprecipitates in the joint would improve subordinately.Furthermore,the high content(16.8%)of∑3 twin boundaries would contribute to the electrical and thermal conductivity.Thus,the multiple strengthening mechanisms with the solid solution,the second precipitated phase,and ultrafine nanograin can dramatically enhance shear strength and electro-thermal conductivity of joints for high-temperature device packaging.
基金the National Basic Research Program of China(No.2012CB619600)。
文摘Silicon/aluminum(Si/Al)composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of thermal expansion(CTE)and high thermal conductivity were produced by powder metallurgy(PM).The Si/Al composites are fully dense and have fine Si particles uniquely distributed within pure Al matrix.Three 50%Si/Al composites were designed to have strength in the range of 185-290 MPa to meet different demands,while the other properties keep invariable.Fracture toughness of the composites is measured to be 9-10 MPa·m^(1/2).The composites were machined to 50%Si/Al housings and 27%Si/Al lids.Both the hermeticities of housings before and after laser-beam-welding sealing are determined.The measured leak rate of composites and sealed housings is in magnitude order of 1×10^(-10)and 1×10^(-9)Pa·m^(3)·s^(-1),respectively,suggesting high hermeticity.The good hermeticity is attributed to the full dense materials,good weldability,and extremely low weld porosity.The present Si/Al composites are expected to be extensively used in highly hermetic electronic packages.
基金supported by the National Natural Science Foundation of China-State Grid Corporation Joint Fund for Smart Grid(No.U1766219)。
文摘In order to evaluate the insulation of two-phase immersion cooling in the HV power electronic package,the insulation degradation of the dielectric interface induced by bubbles is investigated.In this paper,a test strategy with 50 Hz unipolar DC and AC combined voltage for partial discharge(PD)at boiling interface of AlN ceramic is proposed.The insulation threshold of an AlN ceramic surface is acquired in several dielectric environments,such as air,FC-72 liquid(FC-72,a Fluorinert^(TM) from 3^(TM)),FC-72 vapor,and boiling state of FC72.This reveals the deterioration of boiling on the insulation of the surface immersed in the dielectric refrigerant.To investigate the mechanism of the PD feature at the boiling interface,the PD patterns of the unrestricted bubble and the accumulated bubble are acquired and contrastively analyzed.Combined with the feature of the back discharge and the bubble behavior,the charged vapor-ceramic interface is relatively stable due to the accumulated vapor layer.This stability of the charged vaporceramic interface is broken if the bubble is unrestricted.Besides,it is discovered that the vapor-liquid interface inside the bubble may be another charged interface,which can also trigger a back discharge.
基金the financial support from the National Natural Science Foundation of China(Grant No.62074154)Shenzhen Science and Technology Program(Grant Nos.JSGG20210802153000002,JCYJ20210324102208023).
文摘Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects.Adding conductive fillers is a traditional method for highly conductive adhesive tapes.However,the content of conductive fillers is needed to reach the percolation threshold,which is usually as high as tens of percent.High-content fillers result in significant loss of adhesive property and high fabrication cost.Herein,we introduce a rational architecture of conductive microsphere monolayer(CMM)in the PSA layer.The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction.Importantly,low contents of conductive microspheres(≤5%(mass fraction,w))can achieve the target of conductivity improvement,but not result in the serious loss of the adhesive property.Therefore,the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes.Finally,we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes,indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.
文摘Heat transfer using air jet impingement technique is one of the conspicuous tasks in the looming world of electronic packaging system.Here,the material selection of heat sink becomes one of the prior and important assignments to construct a heat sink with desired characteristic cooling rate.In order to study the material effect of heat sink over the cooling characteristic,the present work takes an initiative in plotting the Nusselt magnitude over the radial distance for different material of heat sink.This is done by computing the flow regime and heat transfer characteristic of a 2D axis symmetric geometry in commercial simulating software,ANSYS CFX.The computation of cooling characteristic in form of Nusselt profile is done using SST+Gamma–theta turbulence model.Since the prediction of heat interaction due to the intermediacy and transition in the flow regime is a unique issue of this problem.The results for Nusselt curve signifies a tangible elevation in local Nusselt value(nonuniformity)with decrease in thermal diffusivity of target surface.Also the nonuniformity is observed to vanish above a critical range(66.76mm2/s)of thermal diffusivity.This happens due to presences of abnormal turbulence of heat flow which occurs inside the target surface.Since the variation in thermal diffusivity causes some imbalance competition between the heat storage and dissipation capabilities.Above all the target surface carrying thermal diffusivity less than 66.76mm2/s possesses a dominating heat storage capability,on behalf of which some heat transfer occurring in near jet and far jet regions are being restricted.These are transferred towards stagnation region in radial direction.
