针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根...针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根据模型中的边界条件和初始条件设计COB-LED常温点亮实验,并基于ANSYS有限元分析软件进行仿真分析。通过比较求解结果、仿真结果和实验结果验证该数学模型的合理性。结果表明,求解结果与实验结果中最高温度相对误差约23.57%,且两者的温度变化趋势一致。求解结果与仿真结果中最高温度相对误差约34.84%,且温度分布较为接近,证明了该数学模型的合理性与正确性。展开更多
Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using ...Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.展开更多
This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion a...This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly(PCEA) process, which was developed by both finite element(FE) analysis and experiments. Heat transfer performance and optical performance of the LED modules were experimentally investigated and discussed. Compared to the LED module with a traditionally assembled heat pipe heat sink, the LED module employing the PCEA process exhibits about 20% decrease in the thermal resistance from the MCPCB to the heat pipe. The junction temperature is 4% lower and the luminous flux is 2% higher. The improvement in the thermal and optical performance is important to the high power LED applications.展开更多
【目的】解决大功率LED灯具高效散热问题。【方法】以干冰为冷却介质,设计出干冰喷射散热器,通过COMSOL软件研究干冰喷射对功率为300 W LED灯的散热特性。【结果】仿真试验结果表明,增大干冰流量能明显改善传热效果,流量由7.85 mL/s增至...【目的】解决大功率LED灯具高效散热问题。【方法】以干冰为冷却介质,设计出干冰喷射散热器,通过COMSOL软件研究干冰喷射对功率为300 W LED灯的散热特性。【结果】仿真试验结果表明,增大干冰流量能明显改善传热效果,流量由7.85 mL/s增至23.55 mL/s,散热器相同位置处干冰固相分数由0.04增至0.34。增大干冰流速可显著降低基板表面温度,流速由0.1 m/s增至0.3 m/s,温度约降低26.4%,且随着流速增大,降温效果逐渐减弱。【结论】与自然对流和水微喷射阵列冷却方式相比,以干冰为冷却介质的基板表面温度分别降低44.71%和23.44%;与单相射流方式相比,温度降低24.1%。干冰喷射冷却效果明显提升,温度更加均匀。展开更多
基于冷喷涂技术,提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯,其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上,借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场,获得了具有最低芯片结温的LED球...基于冷喷涂技术,提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯,其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上,借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场,获得了具有最低芯片结温的LED球泡灯。研究结果表明,铜基板厚度一定时,芯片结温随覆铜层厚度的增加而降低。选择纯铝质散热器和增加覆铜层厚度可使LED球泡灯的结温降低为71.25℃,低于芯片安全温度85℃,满足散热和照明习惯要求。展开更多
文摘针对COB-LED(Chip on Board-Light Emitting Diode)散热问题,文中基于二维热传导方程建立了一个可快速计算COB-LED散热器表面热分布的数学模型。为了便于模型求解,采用有限差分法求解该数学模型并选择交替方向隐格式作为其差分格式。根据模型中的边界条件和初始条件设计COB-LED常温点亮实验,并基于ANSYS有限元分析软件进行仿真分析。通过比较求解结果、仿真结果和实验结果验证该数学模型的合理性。结果表明,求解结果与实验结果中最高温度相对误差约23.57%,且两者的温度变化趋势一致。求解结果与仿真结果中最高温度相对误差约34.84%,且温度分布较为接近,证明了该数学模型的合理性与正确性。
文摘Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.
基金Projects(51375177,U1401249,51405161)supported by the National Natural Science Foundation of ChinaProject(2014M560659)supported by the Postdoctoral Science Foundation of ChinaProject(2014B090901065)supported by the Science and Technology Planning Project for Industry-University-Research Cooperation in Guangdong Province,China
文摘This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly(PCEA) process, which was developed by both finite element(FE) analysis and experiments. Heat transfer performance and optical performance of the LED modules were experimentally investigated and discussed. Compared to the LED module with a traditionally assembled heat pipe heat sink, the LED module employing the PCEA process exhibits about 20% decrease in the thermal resistance from the MCPCB to the heat pipe. The junction temperature is 4% lower and the luminous flux is 2% higher. The improvement in the thermal and optical performance is important to the high power LED applications.
文摘基于冷喷涂技术,提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯,其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上,借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场,获得了具有最低芯片结温的LED球泡灯。研究结果表明,铜基板厚度一定时,芯片结温随覆铜层厚度的增加而降低。选择纯铝质散热器和增加覆铜层厚度可使LED球泡灯的结温降低为71.25℃,低于芯片安全温度85℃,满足散热和照明习惯要求。
