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Development Trend and Prediction of Stem Cell Technology in China from the Perspective of Patent
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作者 Liu Baijun Fang Tingxiu +1 位作者 Liu Yue Yuan Hongmei 《Asian Journal of Social Pharmacy》 2024年第3期251-262,共12页
Objective To provide new ideas for the effective treatment of many serious diseases and to solve many major medical problems faced by mankind.Methods In this paper,the invention patents in the field of stem cells in C... Objective To provide new ideas for the effective treatment of many serious diseases and to solve many major medical problems faced by mankind.Methods In this paper,the invention patents in the field of stem cells in China from 2010 to 2020 were taken as the research object,and the technology status quo in the field of stem cells was analyzed to predict the future development direction through quantitative analysis method.Results and Conclusion The development of stem cell technology in China is in a period of growth with great potential.Therefore,it is necessary to strengthen the ability of Chinese universities to combine production,education and research.Nowadays,the hotspots in stem cell technology are using culture medium to improve cell proliferation ability,production efficiency,and to induce differentiated cells.Meanwhile,the production efficiency of embryonic stem cells should be improved,and the immunomodulatory effect of embryonic stem cells can be exerted to screen drugs.Besides,the function of hematopoietic stem cells should be enhanced and apply mesenchymal cells in therapy.Since the potential technological gaps are the improvement of therapy,induced differentiation and efficiency of pluripotent stem cells,the improvement of progenitor cell proliferation and the control of cost,we should strengthen R&D investment in culture medium,embryonic stem cells and other technical fields,and achieve the purpose of reducing R&D costs and improving R&D efficiency. 展开更多
关键词 stem cell industry technology efficiency matrix patent metrological analysis industry situation
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Statistical key variable analysis and model-based control for improvement performance in a deep reactive ion etching process
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作者 陈山 潘天红 +1 位作者 李正明 郑西显 《Journal of Semiconductors》 EI CAS CSCD 2012年第6期118-124,共7页
This paper proposes to develop a data-driven via's depth estimator of the deep reactive ion etching process based on statistical identification of key variables.Several feature extraction algorithms are presented to ... This paper proposes to develop a data-driven via's depth estimator of the deep reactive ion etching process based on statistical identification of key variables.Several feature extraction algorithms are presented to reduce the high-dimensional data and effectively undertake the subsequent virtual metrology(VM) model building process.With the available on-line VM model,the model-based controller is hence readily applicable to improve the quality of a via's depth.Real operational data taken from a industrial manufacturing process are used to verify the effectiveness of the proposed method.The results demonstrate that the proposed method can decrease the MSE from 2.2×10^(-2) to 9×10^(-4) and has great potential in improving the existing DRIE process. 展开更多
关键词 deep reactive-ion etching virtual metrology through silicon via key variable analysis model-based control
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