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Integrated power electronics module based on chip scale packaged power devices 被引量:2
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作者 王建冈 阮新波 《Journal of Southeast University(English Edition)》 EI CAS 2009年第3期367-371,共5页
High performance can be obtained for the integrated power electronics module(IPEM) by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM (HB-... High performance can be obtained for the integrated power electronics module(IPEM) by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM (HB-IPEM), consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management. 展开更多
关键词 integrated power electronics module chip scale package RELIABILITY parasitic parameter thermal management
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STUDY ON THE SURFACE OF TITANIUM CARBIDE PARTICLE PACKAGED NICKEL
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作者 余家国 袁润章 唐桂林 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 1992年第4期34-44,共11页
Two kinds of packaged processes by nickel on the surface of titanium carbide particle are studied in this work. One is the chemical nickel-plating, the other is the organometallic compound decomposition. The compositi... Two kinds of packaged processes by nickel on the surface of titanium carbide particle are studied in this work. One is the chemical nickel-plating, the other is the organometallic compound decomposition. The composition, structure and morphology of the packaged powder were analyzed with XRD, DAT/TGA, SEM, EPMA etc. It has been shown that nickel was even dispersed on the surface of titanium carbide particle by the. two kinds of processes, deposited nickel exists as spherical particles of about 0.1 μm in diameter. The merits and demerits of the two kinds of processes have been compared, the organometallic copmound decomposition among them is a kind of hopeful method, which is not used by other researchers. 展开更多
关键词 packaged powders titanium carbide NICKEL organometallic compound decomposition chemical nickel-plating
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Real-Time Anomaly Detection in Packaged Food X-Ray Images Using Supervised Learning
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作者 Kangjik Kim Hyunbin Kim +3 位作者 Junchul Chun Mingoo Kang Min Hong Byungseok Min 《Computers, Materials & Continua》 SCIE EI 2021年第5期2547-2568,共22页
Physical contamination of food occurs when it comes into contact with foreign objects.Foreign objects can be introduced to food at any time during food delivery and packaging and can cause serious concerns such as bro... Physical contamination of food occurs when it comes into contact with foreign objects.Foreign objects can be introduced to food at any time during food delivery and packaging and can cause serious concerns such as broken teeth or choking.Therefore,a preventive method that can detect and remove foreign objects in advance is required.Several studies have attempted to detect defective products using deep learning networks.Because it is difficult to obtain foreign object-containing food data from industry,most studies on industrial anomaly detection have used unsupervised learning methods.This paper proposes a new method for real-time anomaly detection in packaged food products using a supervised learning network.In this study,a realistic X-ray image training dataset was constructed by augmenting foreign objects with normal product images in a cut-paste manner.Based on the augmented training dataset,we trained YOLOv4,a real-time object detection network,and detected foreign objects in the test data.We evaluated this method on images of pasta,snacks,pistachios,and red beans under the same conditions.The results show that the normal and defective products were classified with an accuracy of at least 94%for all packaged foods.For detecting foreign objects that are typically difficult to detect using the unsupervised learning and traditional methods,the proposed method achieved high-performance realtime anomaly detection.In addition,to eliminate the loss in high-resolution X-ray images,the false positive rate and accuracy could be lowered to 5%with patch-based training and a new post-processing algorithm. 展开更多
关键词 Deep-learning anomaly detection packaged food X-ray detection foreign substances detection abnormal data augmentation
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Hazard Identification and Risk Assessment-Based Water Safety Plan for Packaged Water Production Companies in Abeokuta, South West Nigeria
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作者 Boluwatife Olusegun Osikanmi Mohammed Mustapha +1 位作者 Mynepalli Kameswara Chandra Sridhar Akinwale Oladotun Coker 《Journal of Environmental Protection》 2020年第1期48-63,共16页
Provision of quality drinking water is paramount for sustaining good public health in urban residents. Packaged water produced and consumed across cities in Nigeria lacks integrity in protecting Health. Water safety p... Provision of quality drinking water is paramount for sustaining good public health in urban residents. Packaged water produced and consumed across cities in Nigeria lacks integrity in protecting Health. Water safety plan based on hazard identification and risk assessment in each component of the water production system is essential in providing quality water by packaged water producing companies in Nigeria. This study aims at developing water safety plan for selected packaged water manufacturing companies in Abeokuta, Ogun State, Nigeria. Hazard identification and risk assessment were carried out based on site inspection studies, key informant interview, questionnaire survey and water sample analysis, and risk analysis using semi-quantitative risk matrix approach. The results revealed a total of 26 possible hazardous events which may compromise water quality such as on-site septic tanks and effluents discharged at source water and improper maintenance and hygiene practices within the system. Based on these, appropriate mitigation and monitoring plans were drawn for action. The research found that water safety plan is feasible for the packaged water systems, and therefore calls on the relevant stakeholders for urgent implementation towards ensuring clean drinking water and protecting public health as more and more people are opting for packaged waters due to uncertain public water safety. 展开更多
关键词 Risk Management WATER Safety PLAN packaged WATER Abeokuta
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Meta to the Rescue—Augmented Metamodels for Better Deployment of Pre-Packaged Applications
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作者 Joseph Gil Elad Fein Natalia Razinkov 《Journal of Software Engineering and Applications》 2012年第8期583-594,共12页
Recent estimates indicate that more than half the software market belongs to enterprise applications. One of the greatest challenges in these is in conducting the complex process of adaptation of pre-packaged applicat... Recent estimates indicate that more than half the software market belongs to enterprise applications. One of the greatest challenges in these is in conducting the complex process of adaptation of pre-packaged applications, such as Oracle or SAP, to the organization needs. Although very detailed, structured and well documented methods govern this process, the consulting team implementing the method must spend much manual effort in making sure that the guidelines of the method are followed as intended by the method author. The problem is exacerbated by the diversity of skills and roles of team members, and the many sorts of communications of collaboration that methods prescribe. By enhancing the metamodel in which the methods are defined, we automatically produce a CASE tool (so to speak) for the applications of these methods. Our results are successfully employed in a number of large, ongoing projects with demonstrable, non-meager saving. 展开更多
关键词 Model-Driven Software Development Information REUSE packaged APPLICATIONS Method AUTHORING
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The Design Secret of the Cosmetics Packaged Marketing
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作者 Sun Mou 《China Detergent & Cosmetics》 2019年第3期12-14,共3页
The cosmetics industry has entered the era of professional marketing, advanced promotion, refined service, and scientific design of customer order marketing. The previous era of one lipstick or one mascara marketing, ... The cosmetics industry has entered the era of professional marketing, advanced promotion, refined service, and scientific design of customer order marketing. The previous era of one lipstick or one mascara marketing, or one BB cream to be performed as the terminal strategy has gone. Consumers have been through ignorant to rational and to today’s professional consumption era. As brand owners and agents, as well as store operators, it is a must to possess industry knowledge and professionalism to better serve customers. Sometimes customers are more professional than the sellers, under this situation, there will be no way out for the old service style. 展开更多
关键词 COSMETICS packaged MARKETING
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Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes 被引量:4
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作者 Hao Lin Deyao Li +4 位作者 Liqun Zhang Pengyan Wen Shuming Zhang Jianping Liu Hui Yang 《Journal of Semiconductors》 EI CAS CSCD 2020年第10期29-32,共4页
Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructur... Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase. 展开更多
关键词 Au80Sn20 laser diodes package thermal resistance
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Aged Vacuum Packaged Lamb Cuts Are Less Brown than Fresh Muscle Cuts under Simulated Retail Display
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作者 Eric N. Ponnampalam Kym L. Butler +3 位作者 Viv F. Burnett Matthew B. McDonagh Joe L. Jacobs David L. Hopkins 《Food and Nutrition Sciences》 2013年第8期147-153,共7页
Fifty four, seven month old lambs, that had grazed perennial or annual pasture, were slaughtered and at 24 h post mortem m. longissimus lumborum samples were collected. Half of the fresh muscle section was sliced into... Fifty four, seven month old lambs, that had grazed perennial or annual pasture, were slaughtered and at 24 h post mortem m. longissimus lumborum samples were collected. Half of the fresh muscle section was sliced into three pieces and overwrapped with 15 micron polyvinyl chloride film and displayed under light (Lux = 1500) at 3℃ - 4℃. The remainder of the muscle section was vacuum packaged and aged for 4 weeks at 3℃, before slicing and display. Surface brownness and redness were measured over 3 days of simulated retail display. Aging in vacuum packs led to substantially less brownness and greater redness compared with fresh meat, over the entire three days of display. It was concluded that aging in vacuum packs could be a useful strategy for improving consumer acceptability of retail lamb in local markets, even where there is no logistical or transport need to extend the life of the meat. 展开更多
关键词 MEAT Colour VACUUM Packaging Brownness Formation Redness Retention SHELF Life Antioxidant Status LAMB
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Co‑packaged optics(CPO):status,challenges,and solutions 被引量:6
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作者 Min Tan Jiang Xu +30 位作者 Siyang Liu Junbo Feng Hua Zhang Chaonan Yao Shixi Chen Hangyu Guo Gengshi Han Zhanhao Wen Bao Chen Yu He Xuqiang Zheng Da Ming Yaowen Tu Qiang Fu Nan Qi Dan Li Li Geng Song Wen Fenghe Yang Huimin He Fengman Liu Haiyun Xue Yuhang Wang Ciyuan Qiu Guangcan Mi Yanbo Li Tianhai Chang Mingche Lai Luo Zhang Qinfen Hao Mengyuan Qin 《Frontiers of Optoelectronics》 EI CSCD 2023年第1期1-40,共40页
Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides withi... Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology. 展开更多
关键词 Co-packaged optics Silicon photonics High-performance computing Advanced packaging External laser Optical power delivery CO-SIMULATION STANDARDIZATION Transmitter Receiver
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A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module 被引量:1
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作者 Xiaoshuang Hui Puqi Ning +4 位作者 Tao Fan Yuhui Kang Kai Wang Yunhui Mei Guangyin Lei 《CES Transactions on Electrical Machines and Systems》 EI CSCD 2024年第1期72-79,共8页
Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple stake... Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint. 展开更多
关键词 Silicon carbide Electric vehicle Power modules PACKAGE
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Product family modeling technology for customized cosmetic packaging design based on basic-element theory 被引量:1
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作者 Tao Chen Ding-Bang Luh Jinguang Wang 《Journal of Dermatologic Science and Cosmetic Technology》 2024年第1期2-12,共11页
Background:As the market demands change,SMEs(small and medium-sized enterprises)have long faced many design issues,including high costs,lengthy cycles,and insufficient innovation.These issues are especially noticeable... Background:As the market demands change,SMEs(small and medium-sized enterprises)have long faced many design issues,including high costs,lengthy cycles,and insufficient innovation.These issues are especially noticeable in the domain of cosmetic packaging design.Objective:To explore innovative product family modeling methods and configuration design processes to improve the efficiency of enterprise cosmetic packaging design and develop the design for mass customization.Methods:To accomplish this objective,the basic-element theory has been introduced and applied to the design and development system of the product family.Results:By examining the mapping relationships between the demand domain,functional domain,technology domain,and structure domain,four interrelated models have been developed,including the demand model,functional model,technology model,and structure model.Together,these models form the mechanism and methodology of product family modeling,specifically for cosmetic packaging design.Through an analysis of a case study on men’s cosmetic packaging design,the feasibility of the proposed product family modeling technology has been demonstrated in terms of customized cosmetic packaging design,and the design efficiency has been enhanced.Conclusion:The product family modeling technology employs a formalized element as a module configuration design language,permeating throughout the entire development cycle of cosmetic packaging design,thus facilitating a structured and modularized configuration design process for the product family system.The application of the basic-element principle in product family modeling technology contributes to the enrichment of the research field surrounding cosmetic packaging product family configuration design,while also providing valuable methods and references for enterprises aiming to elevate the efficiency of cosmetic packaging design for the mass customization product model. 展开更多
关键词 Packaging design Cosmetic packaging Product family modeling technology Basic-element theory Design for mass customization
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Sustainable, thermoplastic and hydrophobic coating from natural cellulose and cinnamon to fabricate eco-friendly catering packaging
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作者 Rumeng Xu Chunchun Yin +4 位作者 Jingxuan You Jinming Zhang Qinyong Mi Jin Wu Jun Zhang 《Green Energy & Environment》 SCIE EI CAS CSCD 2024年第5期927-936,共10页
Non-degradable polymers cause serious environmental pollution problem,such as the widely-used while unrecyclable coatings which significantly affect the overall degradation performance of products.It is imperative and ... Non-degradable polymers cause serious environmental pollution problem,such as the widely-used while unrecyclable coatings which significantly affect the overall degradation performance of products.It is imperative and attractive to develop biodegradable functional coatings.Herein,we proposed a novel strategy to successfully prepare biodegradable,thermoplastic and hydrophobic coatings with high transparence and biosafety by weakening the interchain interactions between cellulose chain.The natural cellulose and cinnamic acid were as raw materials.Via reducing the degree of polymerization(DP)of cellulose and regulating the degree of substitution(DS)of cinnamate moiety,the obtained cellulose cinnamate(CC)exhibited not only the thermalflow behavior but also good biodegradability,which solves the conflict between the thermoplasticity and biodegradability in cellulose-based materials.The glass transition temperature(T_(g))and thermalflow temperature(T_(f))of the CC could be adjusted in a range of 150–200℃ and 180–210℃,respectively.The CC with DS<1.2 and DP≤100 degraded more than 60%after an enzyme treatment for 7 days,and degraded more than 80%after a composting treatment for 42 days.Furthermore,CC had no toxicity to human epidermal cells even at a high concentration(0.5 mg mL^(-1)).In addition,CC could be easily fabricated into multifunctional coating with high hydrophobicity,thermal adhesion and high transparence.Therefore,after combining with cellophane and paperboard,CC coating with low DP and DS could be used to prepare fully-biodegradable heat-sealing packaging,art paper,paper cups,paper straws and food packaging boxes. 展开更多
关键词 Thermoplastic coating Bio-degradable adhesive Natural products Cellulose Eco-friendly packaging
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Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment
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作者 Yongliang Zhang Lu Zhan Zhenming Xu 《Engineering》 SCIE EI CAS CSCD 2024年第8期253-261,共9页
Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious an... Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits. 展开更多
关键词 Waste LED Hydrothermal treatment RECYCLING Plastic PPA degradation Packaging materials
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Silicon-based optoelectronic heterogeneous integration for optical interconnection
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作者 李乐良 李贵柯 +5 位作者 张钊 刘剑 吴南健 王开友 祁楠 刘力源 《Chinese Physics B》 SCIE EI CAS CSCD 2024年第2期1-9,共9页
The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which ... The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which not only provides the optical gain which is absent from native Si substrates and enables complete photonic functionalities on chip,but also improves the system performance through advanced heterogeneous integrated packaging.This paper reviews recent progress of silicon-based optoelectronic heterogeneous integration in high performance optical interconnection.The research status,development trend and application of ultra-low loss optical waveguides,high-speed detectors,high-speed modulators,lasers and 2D,2.5D,3D and monolithic integration are focused on. 展开更多
关键词 silicon-based heterogeneous integration heterogeneous integrated materials heterogeneous integrated packaging optical interconnection
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DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages
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作者 Mingzhou Liu Yu Gong +2 位作者 Xiaoqiao Wang Conghu Liu Jing Hu 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2024年第4期194-214,共21页
Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line d... Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects. 展开更多
关键词 Surface defect detection system Deep learning Semantic segmentation Aluminum-plastic blister packages identification
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Vehicle-oriented ridesharing package delivery in blockchain system
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作者 Xuefei Zhang Junjie Liu +4 位作者 Yijing Li Qimei Cui Xiaofeng Tao Ren Ping Liu Wenzheng Li 《Digital Communications and Networks》 SCIE CSCD 2024年第4期1014-1023,共10页
Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may r... Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may result in the single point of failure once the controller breaks down or is under attack.To tackle such problems,our goal in this paper is to develop a blockchain-based package delivery ridesharing system,where decentralization is adopted to remove intermediaries and direct transactions between the providers and the requestors are allowed.To complete the matching process under decentralized structure,an Event-Triggered Distributed Deep Reinforcement Learning(ETDDRL)algorithm is proposed to generate/update the real-time ridesharing orders for the new coming ridesharing requests from a local view.Simulation results reveal the vast potential of the ETDDRL matching algorithm under the blockchain framework for the promotion of the ridesharing profits.Finally,we develop an application for Android-based terminals to verify the ETDDRL matching algorithm. 展开更多
关键词 Blockchain Dynamic matching Ridesharing package delivery
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Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration
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作者 Jia-ping Fu Can-xu Zhou +1 位作者 Guo-fa Mi Yuan Liu 《China Foundry》 SCIE EI CAS CSCD 2024年第4期360-368,共9页
Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a... Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size. 展开更多
关键词 diamond/aluminum composites thermal conductivity electronic packaging vacuum-assisted pressure infiltration
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Analysis of quality-related proteins in golden pompano(Trachinotus ovatus)fillets with modified atmosphere packaging under superchilling storage
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作者 Chuang Pan Xiaofan Zhang +4 位作者 Shengjun Chen Yong Xue Yanyan Wu Yueqi Wang Di Wang 《Food Science and Human Wellness》 SCIE CAS CSCD 2024年第4期2253-2265,共13页
Here,we aimed to study the changes in proteome of golden pompano fillets during post-mortem storage.Tandem mass tags(TMT)-labeled quantitative proteomic strategy was applied to investigate the relationships between pr... Here,we aimed to study the changes in proteome of golden pompano fillets during post-mortem storage.Tandem mass tags(TMT)-labeled quantitative proteomic strategy was applied to investigate the relationships between protein changes and quality characteristics of modified atmosphere packaging(MAP)fillets during superchilling(-3°C)storage.Scanning electron microscopy was used to show that the muscle histology microstructure of fillets was damaged to varying degrees,and low-field nuclear magnetic resonance was used to find that the immobilized water and free water in the muscle of fillets changed significantly.Total sulfhydryl content,TCA-soluble peptides and Ca2+-ATPase activity also showed that the fillet protein had a deterioration by oxidation and denaturation.The Fresh(FS),MAP,and air packaging(AP)groups were set.Total of 150 proteins were identified as differential abundant proteins(DAPs)in MAP/FS,while 209 DAPs were in AP/FS group.The KEGG pathway analysis indicated that most DAPs were involved in binding proteins and protein turnover.Correlation analysis found that 52 DAPs were correlated with quality traits.Among them,8 highly correlated DAPs are expected to be used as potential quality markers for protein oxidation and water-holding capacity.These results provide a further understanding of the muscle deterioration mechanism of packaging golden pompano fillets during superchilling. 展开更多
关键词 Tandem mass tags(TMT)proteomics Trachinotus ovatus Modified atmosphere packaging Superchilling storage Low-field nuclear magnetic resonance Protein deterioration
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Ex⁃situ Measurement of Internal Deformation in Ball Grid Array Package with Digital Volume Correlation
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作者 WANG Long GAO Zizhan +3 位作者 ZHANG Xuanhao LIU Qiaoyu HOU Chuantao XING Ruisi 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2024年第5期609-620,共12页
In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is... In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions. 展开更多
关键词 ball grid array(BGA)packages digital volume correlation ex-situ rigid body displacement thermal cycling test
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Synergism of Zinc Oxide/Organoclay-Loaded Poly(lactic acid) Hybrid Nanocomposite Plasticized by Triacetin for Sustainable Active Food Packaging
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作者 Ponusa Songtipya Thummanoon Prodpran +1 位作者 Ladawan Songtipya Theerarat Sengsuk 《Journal of Renewable Materials》 EI CAS 2024年第5期951-967,共17页
The synergistic effect of organoclay(OC)and zinc oxide(ZnO)nanoparticles on the crucial properties of poly(lactic acid)(PLA)nanocompositefilms was systematically investigated herein.After their incorporation into PLA v... The synergistic effect of organoclay(OC)and zinc oxide(ZnO)nanoparticles on the crucial properties of poly(lactic acid)(PLA)nanocompositefilms was systematically investigated herein.After their incorporation into PLA via the solvent casting technique,the water vapor barrier property of the PLA/OC/ZnOfilm improved by a maximum of 86%compared to the neat PLAfilm without the deterioration of Young’s modulus or the tensile strength.Moreover,thefilm’s self-antibacterial activity against foodborne pathogens,including gram-negative(Escherichia coli,E.coli)and gram-positive(Staphylococcus aureus,S.aureus)bacteria,was enhanced by a max-imum of approximately 98–99%compared to the neat PLAfilm.Furthermore,SEM images revealed the homo-geneous dispersion of both nano-fillers in the PLA matrix.However,the thermal stability of thefilm decreased slightly after the addition of the OC and ZnO.Thefilm exhibited notable light barrier properties in the UV-Vis range.Moreover,the incorporation of a suitable biodegradable plasticizer significantly decreased the Tg and notably enhanced theflexibility of the nanocompositefilm by increasing the elongation at break approxi-mately 1.5-fold compared to that of the neat PLAfilm.This contributes to its feasibility as an active food packa-ging material. 展开更多
关键词 Poly(lactic acid)nanocomposite ORGANOCLAY zinc oxide barrier property antibacterial activity active food packaging
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