Sub-6 GHz multi-standard wireless communication and millimeter-wave(mm-wave)wireless transmission provide users with multi-functionality and unprecedented wireless connectivity.With CMOS process scaling down,system-on...Sub-6 GHz multi-standard wireless communication and millimeter-wave(mm-wave)wireless transmission provide users with multi-functionality and unprecedented wireless connectivity.With CMOS process scaling down,system-on-chip(SoC)implementation of wireless systems along with RFIC functionality is highly desirable for low cost and small form-factor.The digital transceiver architecture aligns with Moore’s law to provide compact die area,better interface to digital backend and higher efficiency due to the faster switching nature of core devices[1−28].展开更多
基于RF集成电路硅衬底螺旋电感(SIOS)的典型物理模型,用HFSS(High Frequency Structure Simulator)对中空平面四边形、八边形和圆形螺旋电感的电性能进行了模拟计算,结果与理论分析吻合.在内半径相同的情况下,圆形螺旋电感最大品质因数...基于RF集成电路硅衬底螺旋电感(SIOS)的典型物理模型,用HFSS(High Frequency Structure Simulator)对中空平面四边形、八边形和圆形螺旋电感的电性能进行了模拟计算,结果与理论分析吻合.在内半径相同的情况下,圆形螺旋电感最大品质因数Q分别比四边形和八边形增加约0.90和0.80倍;在最大品质因数频率点,圆形螺旋电感端口反射系数分别比四边形和八边形减小约32.5%和26.6%,金属材料用量分别比四边形和八边形减少约30%和20%;当Q>5时,圆形螺旋电感的工作带宽分别比四边形和八边形增大约60%和30%.展开更多
The trend in the radio frequency IC toward further miniaturization and improved performance drives ongoing technology innovation of new substrate and packaging technologies.In this paper,Hardware technology of RF syst...The trend in the radio frequency IC toward further miniaturization and improved performance drives ongoing technology innovation of new substrate and packaging technologies.In this paper,Hardware technology of RF system was reviewed,and the low temperature cofired ceramics(LTCC) technology was stated to be the best choice.Material development and measurement of Dielectric properties of LTCC technology are introduced.The application of passive embedded component was stated for RFIC design.Design of LTCC library will be the next step for RF system design and simulation.展开更多
分步集成是从大学一年级就学习过的一个概念,现在RF IC厂商正在将这一传统方法应用于射频无线电路的集成。无线IC领域的先锋企业不断设计生产新的构建模块(IC),然后针对特定的客户或应用创建定制版本。随后,这些专用器件被列入标准产品...分步集成是从大学一年级就学习过的一个概念,现在RF IC厂商正在将这一传统方法应用于射频无线电路的集成。无线IC领域的先锋企业不断设计生产新的构建模块(IC),然后针对特定的客户或应用创建定制版本。随后,这些专用器件被列入标准产品目录。这些目录中的产品本身又成为集成度更高的复杂产品的构建模块。分步集成实际上意味着设计周期只需要从已有的构建模块开始、创建不同的版本,然后再将这些构建模块结合到集成程度更高的电路中去。RF IC 厂商的第一波成功验证了这一业务模式。展开更多
文摘Sub-6 GHz multi-standard wireless communication and millimeter-wave(mm-wave)wireless transmission provide users with multi-functionality and unprecedented wireless connectivity.With CMOS process scaling down,system-on-chip(SoC)implementation of wireless systems along with RFIC functionality is highly desirable for low cost and small form-factor.The digital transceiver architecture aligns with Moore’s law to provide compact die area,better interface to digital backend and higher efficiency due to the faster switching nature of core devices[1−28].
文摘基于RF集成电路硅衬底螺旋电感(SIOS)的典型物理模型,用HFSS(High Frequency Structure Simulator)对中空平面四边形、八边形和圆形螺旋电感的电性能进行了模拟计算,结果与理论分析吻合.在内半径相同的情况下,圆形螺旋电感最大品质因数Q分别比四边形和八边形增加约0.90和0.80倍;在最大品质因数频率点,圆形螺旋电感端口反射系数分别比四边形和八边形减小约32.5%和26.6%,金属材料用量分别比四边形和八边形减少约30%和20%;当Q>5时,圆形螺旋电感的工作带宽分别比四边形和八边形增大约60%和30%.
文摘The trend in the radio frequency IC toward further miniaturization and improved performance drives ongoing technology innovation of new substrate and packaging technologies.In this paper,Hardware technology of RF system was reviewed,and the low temperature cofired ceramics(LTCC) technology was stated to be the best choice.Material development and measurement of Dielectric properties of LTCC technology are introduced.The application of passive embedded component was stated for RFIC design.Design of LTCC library will be the next step for RF system design and simulation.
文摘分步集成是从大学一年级就学习过的一个概念,现在RF IC厂商正在将这一传统方法应用于射频无线电路的集成。无线IC领域的先锋企业不断设计生产新的构建模块(IC),然后针对特定的客户或应用创建定制版本。随后,这些专用器件被列入标准产品目录。这些目录中的产品本身又成为集成度更高的复杂产品的构建模块。分步集成实际上意味着设计周期只需要从已有的构建模块开始、创建不同的版本,然后再将这些构建模块结合到集成程度更高的电路中去。RF IC 厂商的第一波成功验证了这一业务模式。
