The electronic structure and optical properties of bilayer germanene under different warpages are studied by the first-principles method of density functional theory.The effects of warpages on the electronic structure...The electronic structure and optical properties of bilayer germanene under different warpages are studied by the first-principles method of density functional theory.The effects of warpages on the electronic structure and optical properties of bilayer germanene are analyzed.The results of the electronic structure study show that the bottom of the conduction band of bilayer germanene moves to the lower energy direction with the increase of warpages at the K point,and the top of the valence band stays constant at the K point,and so the band gap decreases with the increase of warpage.When the warpage is 0.075 nm,the top of the valence band of bilayer germanene changes from K point to G point,and the bilayer germanene be-comes an indirect band gap semiconductor.This is an effective means to modulate the conversion of bilayer germanene between direct band gap semiconductor and indirect band gap semiconductor by adjusting the band structure of bilayer ger-manene effectively.The study of optical properties shows that the effect of warpage on the optical properties of bilayer ger-manene is mainly distributed in the ultraviolet and visible regions,and the warpage can effectively regulate the electronic struc-ture and optical properties of bilayer germanene.When the warpage is 0.069 nm,the first peak of dielectric function and extinc-tion coefficient is the largest,and the energy corresponding to the absorption band edge is the smallest.Therefore,the elec-tron utilization rate is the best when the warpage is 0.069 nm.展开更多
Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires...Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires advanced packages to meet demands for performance,size,and high-speed transmission.To respond to these demands,integration approaches such as 3D IC chip stacking,package on package(PoP),2.5D interposer integration,system-in-package(SiP),and fan-out packaging technologies have emerged[6,8,11,12].Therefore,the package substrate for high-performance device will require low transmission loss and the small package warpage.Low loss materials have limitation of seed layer formation with electroless Cu plating.Also,heat treatment has major impact on substrate warpage in order for growth of plated Cu metal and curing for epoxy mold compound(EMC)process.In this paper,we believe it is possible to create a seed layer on the low-loss material by combining electroless Cu plating and flash lamp annealing(FLA)method instead of sputtering process.In terms of warpage control and metal growth,the flash lamp treatment,not the conventional convection or hot plate type heat treatment,could improve electro-migration between metal line and line through improving large number of(111)slip directions.In addition,flash lamp not only provides alternative to conventional heat treatment process but also significantly reduces substrate warpage.Through result of this study,by using FLA method for advanced package,it is possible to provide solutions in improving adhesion strength between dielectric materials and deposited metal film,and to reduce the warpage of the substrate.展开更多
Longitude profiled cladded sheet is obtained by rolling bimetal cladded sheet with variable gauge rolling technology.The longitude profiled rolling process of Cu/Al cladded sheets was studied by finite element method ...Longitude profiled cladded sheet is obtained by rolling bimetal cladded sheet with variable gauge rolling technology.The longitude profiled rolling process of Cu/Al cladded sheets was studied by finite element method and experiments.The rolling force rises with the increase in reduction,and a sudden change appears at the end of the thickness variation zone.The thickness ratio of copper layer is enlarged after rolling owing to its relatively large deformation resistance and continues to rise with the increase in reduction rate.Lower elongation of copper side leads to the warpage of exit metal to copper side,which further hinders the deformation of copper.The influence of asymmetric rolling parameters indicates that increasing the work roll diameter ratio,speed radio,and friction coefficient on Al side can reduce the warpage when the reduction rate is below a certain value depending on the thickness ratio and other rolling parameters.Comparison of experiments and simulation results showed good agreement and verified the finite element model.展开更多
The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technolog...The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.展开更多
The quality of injection plastic molded parts relates to precise geometry,smooth surface,strength,durability,and other indicators that are associated with the mold,materials,injection process,and service environment.T...The quality of injection plastic molded parts relates to precise geometry,smooth surface,strength,durability,and other indicators that are associated with the mold,materials,injection process,and service environment.The warpage is one of main defects of injection products,which cost much time and materials.In order to minimize warpage to ensure the precise shape of molded parts,it needs to combine design,service conditions,process parameters,material properties,and other factors in the design and manufacturing.Finite element tools and material database are used to analyze the occurrence of warpage,and analysis results contribute to the improvement and optimization of injection molding process of typical parts.To find the optimal process parameters in the solution space,experimental data are used to establish backpropagation(BP)network for predicting warpage of a bearing stand based on analysis with Moldflow.With a proper transfer function and the BP network architecture,results from the BP network method satisfiy the criteria of accuracy.The optimal solutions are searched in the BP network by the genetic algorithm with the finding that the optimization method based on the BP network is efficient.展开更多
Deposition patterns can significantly affect residual stress distribution in additive manufacturing processes.In this paper,a novel pattern,the S-pattern,is proposed for the metal additive manufacturing process.The fi...Deposition patterns can significantly affect residual stress distribution in additive manufacturing processes.In this paper,a novel pattern,the S-pattern,is proposed for the metal additive manufacturing process.The finite element method is used to study the temperature field and the stress field of a cuboid structure under the S-pattern and five other representative patterns:zig-zag,raster,alternate-line,in-out spiral,and out-in spiral.The results show that the S-pattern achieves the lowest values of both equivalent residual stress and maximum principal residual stress,and the warpage of the S-pattern is close to that of counterparts.By analyzing the temperature and stress fields under all patterns,it is found that the residual stress distribution is determined by the uniformity of temperature distribution which is correlated with the peak temperatures of corners.The equivalent residual stress and the maximum principal residual stress are inversely correlated with the average peak temperature and the minimum peak temperature of corners,respectively.These correlations between temperature and residual stress provide an effective approach to evaluate the residual stress of different patterns and guide the deposition process in practice.展开更多
基金supported by the Science and Technology Foundation of Guizhou Province,China(Nos.1Y[2020]200,1Y[2020]205)the Youth Science and Technology Talents Growth Fund Program of the Ministry of Education Province,China(Nos.KY[2021]105,KY[2021]103).
文摘The electronic structure and optical properties of bilayer germanene under different warpages are studied by the first-principles method of density functional theory.The effects of warpages on the electronic structure and optical properties of bilayer germanene are analyzed.The results of the electronic structure study show that the bottom of the conduction band of bilayer germanene moves to the lower energy direction with the increase of warpages at the K point,and the top of the valence band stays constant at the K point,and so the band gap decreases with the increase of warpage.When the warpage is 0.075 nm,the top of the valence band of bilayer germanene changes from K point to G point,and the bilayer germanene be-comes an indirect band gap semiconductor.This is an effective means to modulate the conversion of bilayer germanene between direct band gap semiconductor and indirect band gap semiconductor by adjusting the band structure of bilayer ger-manene effectively.The study of optical properties shows that the effect of warpage on the optical properties of bilayer ger-manene is mainly distributed in the ultraviolet and visible regions,and the warpage can effectively regulate the electronic struc-ture and optical properties of bilayer germanene.When the warpage is 0.069 nm,the first peak of dielectric function and extinc-tion coefficient is the largest,and the energy corresponding to the absorption band edge is the smallest.Therefore,the elec-tron utilization rate is the best when the warpage is 0.069 nm.
文摘Today’s electronic devices have required higher performance properties for 5G and artificial intelligence(AI).High-performance system on chip(SOC),graphic processing unit(GPU),and central processing unit(CPU)requires advanced packages to meet demands for performance,size,and high-speed transmission.To respond to these demands,integration approaches such as 3D IC chip stacking,package on package(PoP),2.5D interposer integration,system-in-package(SiP),and fan-out packaging technologies have emerged[6,8,11,12].Therefore,the package substrate for high-performance device will require low transmission loss and the small package warpage.Low loss materials have limitation of seed layer formation with electroless Cu plating.Also,heat treatment has major impact on substrate warpage in order for growth of plated Cu metal and curing for epoxy mold compound(EMC)process.In this paper,we believe it is possible to create a seed layer on the low-loss material by combining electroless Cu plating and flash lamp annealing(FLA)method instead of sputtering process.In terms of warpage control and metal growth,the flash lamp treatment,not the conventional convection or hot plate type heat treatment,could improve electro-migration between metal line and line through improving large number of(111)slip directions.In addition,flash lamp not only provides alternative to conventional heat treatment process but also significantly reduces substrate warpage.Through result of this study,by using FLA method for advanced package,it is possible to provide solutions in improving adhesion strength between dielectric materials and deposited metal film,and to reduce the warpage of the substrate.
基金The research was financially supported by the National Natural Science Foundation of China(Grant Nos.51674222 and 51974278)Yanshan University(15LGAOO3).
文摘Longitude profiled cladded sheet is obtained by rolling bimetal cladded sheet with variable gauge rolling technology.The longitude profiled rolling process of Cu/Al cladded sheets was studied by finite element method and experiments.The rolling force rises with the increase in reduction,and a sudden change appears at the end of the thickness variation zone.The thickness ratio of copper layer is enlarged after rolling owing to its relatively large deformation resistance and continues to rise with the increase in reduction rate.Lower elongation of copper side leads to the warpage of exit metal to copper side,which further hinders the deformation of copper.The influence of asymmetric rolling parameters indicates that increasing the work roll diameter ratio,speed radio,and friction coefficient on Al side can reduce the warpage when the reduction rate is below a certain value depending on the thickness ratio and other rolling parameters.Comparison of experiments and simulation results showed good agreement and verified the finite element model.
基金supported by the National Natural Science Foundation of China (Grant Nos. 51475195, 51322507 & 91323303)National Science and Technology Support Program (Gant No. 2015BAF11B02)
文摘The serious warpage issues of ultrathin chip-on-flex(UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.
基金supported by a grant from the Ningbo Furja Industrial Corporation Limited
文摘The quality of injection plastic molded parts relates to precise geometry,smooth surface,strength,durability,and other indicators that are associated with the mold,materials,injection process,and service environment.The warpage is one of main defects of injection products,which cost much time and materials.In order to minimize warpage to ensure the precise shape of molded parts,it needs to combine design,service conditions,process parameters,material properties,and other factors in the design and manufacturing.Finite element tools and material database are used to analyze the occurrence of warpage,and analysis results contribute to the improvement and optimization of injection molding process of typical parts.To find the optimal process parameters in the solution space,experimental data are used to establish backpropagation(BP)network for predicting warpage of a bearing stand based on analysis with Moldflow.With a proper transfer function and the BP network architecture,results from the BP network method satisfiy the criteria of accuracy.The optimal solutions are searched in the BP network by the genetic algorithm with the finding that the optimization method based on the BP network is efficient.
基金funded by the Chinese Scholarship Council and the Research Council of Norway through the Petromaks2 program(Project No.281927)the BIA Program(Project No.269558)。
文摘Deposition patterns can significantly affect residual stress distribution in additive manufacturing processes.In this paper,a novel pattern,the S-pattern,is proposed for the metal additive manufacturing process.The finite element method is used to study the temperature field and the stress field of a cuboid structure under the S-pattern and five other representative patterns:zig-zag,raster,alternate-line,in-out spiral,and out-in spiral.The results show that the S-pattern achieves the lowest values of both equivalent residual stress and maximum principal residual stress,and the warpage of the S-pattern is close to that of counterparts.By analyzing the temperature and stress fields under all patterns,it is found that the residual stress distribution is determined by the uniformity of temperature distribution which is correlated with the peak temperatures of corners.The equivalent residual stress and the maximum principal residual stress are inversely correlated with the average peak temperature and the minimum peak temperature of corners,respectively.These correlations between temperature and residual stress provide an effective approach to evaluate the residual stress of different patterns and guide the deposition process in practice.
