By using a complex function method in this paper, the complex form of J-integral of mixed mode crack tip for unidirectional plate of linear-elastic orthotropic composites is obtained first by substituting crack tip st...By using a complex function method in this paper, the complex form of J-integral of mixed mode crack tip for unidirectional plate of linear-elastic orthotropic composites is obtained first by substituting crack tip stresses and displacements into general formula of J-integral. And then, the path-independence of this J-integral is proved. Finally, the computing formula of this J-integral is derived. As special examples, the complex forms, path-independence and computing formulae of J-integrals of mode I and mode II crack tips for unidirectional plate of linear-elastic orthotropic composites are given.展开更多
Stress intensity factors for a three dimensional rectangular interfacial crack were considered using the body force method. In the numerical calculations, unknown body force densities were approximated by the products...Stress intensity factors for a three dimensional rectangular interfacial crack were considered using the body force method. In the numerical calculations, unknown body force densities were approximated by the products of the fundamental densities and power series; here the fundamental densities are chosen to express singular stress fields due to an interface crack exactly. The calculation shows that the numerical results are satisfied. The stress intensity factors for a rectangular interface crack were indicated accurately with the varying aspect ratio, and bimaterial parameter.展开更多
The problem considered here is the response of a non-homogeneouscomposite material containing some cracks subjected to dynamicloading. It is assumed that the composite material is or- thotropicand all material propert...The problem considered here is the response of a non-homogeneouscomposite material containing some cracks subjected to dynamicloading. It is assumed that the composite material is or- thotropicand all material properties depend only on the coordinate y (alongthe thickness direcion). In the analysis, the elastic region isdivided into a number of plies of infinite length. The materialproperties are taken to be constants for each ply. By utilizing theLaplace transform and Fourier transform technique, the generalsolutions for plies are derived.展开更多
The problem of a periodic array of parallel cracks in a homogeneous piezoelectric strip bonded to a functionally graded piezoelectric material is investigated for inhomogeneous continuum. It is assumed that the materi...The problem of a periodic array of parallel cracks in a homogeneous piezoelectric strip bonded to a functionally graded piezoelectric material is investigated for inhomogeneous continuum. It is assumed that the material inhomogeneity is represented as the spatial variation of the shear modulus in the form of an exponential function along the direction of cracks. The mixed boundary value problem is reduced to a singular integral equation by applying the Fourier transform, and the singular integral equation is solved numerically by using the Gauss-Chebyshev integration technique. Numerical results are obtained to illustrate the variations of the stress intensity factors as a function of the crack periodicity for different values of the material inhomogeneity.展开更多
The problem considered is a mode Ⅲ crack lying parallel to the interface of an exponential-type functional graded material （FGM） strip bonded to a linear-type FGM substrate with infinite thickness. By applying the ...The problem considered is a mode Ⅲ crack lying parallel to the interface of an exponential-type functional graded material （FGM） strip bonded to a linear-type FGM substrate with infinite thickness. By applying the Fourier integral transform, the problem was reduced as a Cauchy singular integral equation with an unknown dislocation density function. The collocation method based on Chebyshev polynomials proposed by Erdogan and Gupta was used to solve the singular integral equation numerically. With the numerical solution, the effects of the geometrical and physical parameters on the stress intensity factor （SIF） were analyzed and the following conclusions were drawn： （a） The region affected by the interface or free surface varies with the material rigidity, and higher material rigidity will lead to bigger affected region. （b） The SIF of the crack in the affected region and parallel to the micro-discontinuous interface is lower than those of the weak discontinuous cases. Reducing the weak-discontinuity of the interface will be beneficial to decrease the SIF of the interface-parallel crack in the region affected by the interface. （c） The effect of the free surface on SIF is more remarkable than that of the interface, and the latter is still more notable than that of the material rigidity. When the effects of the interface and free surface are fixed, increase of the material rigidity will enhance the value of SIF.展开更多
This paper studies the dynamic stress intensity factor （DSIF） at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the i...This paper studies the dynamic stress intensity factor （DSIF） at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.展开更多
The present work is concerned with the problem of mode Ⅲ crack perpendicular to the interface of a bi-strip composite. One of these strips is made of a functionally graded material and the other of an isotropic mater...The present work is concerned with the problem of mode Ⅲ crack perpendicular to the interface of a bi-strip composite. One of these strips is made of a functionally graded material and the other of an isotropic material, which contains an edge crack perpendicular to and terminating at the interface. Fourier transforms and asymptotic analysis are employed to reduce the problem to a singular integral equation which is numerically solved using Gauss-Chebyshev quadrature formulae. Furthermore, a parametric study is carried out to investigate the effects of elastic and geometric characteristics of the composite on the values of stress intensity factor.展开更多
Multilayer thin-film thermoelectric materials are of technological importance. This paper describes a method to analyze the heat conduction in a multilayered thermoelectric plate containing some non-collinear cracks. ...Multilayer thin-film thermoelectric materials are of technological importance. This paper describes a method to analyze the heat conduction in a multilayered thermoelectric plate containing some non-collinear cracks. The material properties in one layer may be different from those in another even though each layer may still be homogeneous. Using the Fourier integral transforms, the boundary value problem is reduced to a system of general singular integral equations. The model is sufficiently general to account for any number of layers and any number of cracks. As a numerical illustration, the electric flux intensity factor, energy flux intensity factor and thermal flux intensity factor for a three-layer plate specimen with two cracks are presented. The effects of strip width on the electric flux intensity factor and thermal flux intensity factor are studied.展开更多
A multi-layered model for heat conduction analysis of a thermoelectric material strip(TEMs)with a Griffith crack under the electric flux and energy flux load has been developed.The materials parameters of the TEMs var...A multi-layered model for heat conduction analysis of a thermoelectric material strip(TEMs)with a Griffith crack under the electric flux and energy flux load has been developed.The materials parameters of the TEMs vary continuously in an arbitrary manner.To derive the solution,the TEMs is divided into several sub-layers with different material properties.The mixed boundary problem is reduced to a system of singular integral equations,which are solved numerically.The effect of strip width on the electric flux intensity factor and thermal flux intensity factor are studied.展开更多
The scattering of SH wave by a cylindrical piezoelectric inclusion partially debonded from its surrounding piezoelectric material is investigated using the wave function expansion method and singular integral ...The scattering of SH wave by a cylindrical piezoelectric inclusion partially debonded from its surrounding piezoelectric material is investigated using the wave function expansion method and singular integral equation technique. The debonding regions are modeled as mul- tiple arc-shaped interface cracks with non-contacting faces. By expressing the scattered ?elds as wave function expansions with unknown coe?cients, the mixed boundary value problem is ?rstly reduced to a set of simultaneous dual series equations. Then dislocation density functions are introduced as unknowns to transform these dual series equations into Cauchy singular integral equations of the ?rst type, which can be numerically solved easily. The solution is valid for arbi- trary number and size of the debonds. Finally, numerical results of the dynamic stress intensity factors are presented for the cases of one debond and two debonds. The e?ects of incidence direc- tion, crack con?guration and various material parameters on the dynamic stress intensity factors are respectively discussed. The solution of this problem is expected to ?nd applications in the investigation of dynamic fracture properties of piezoelectric materials with cracks.展开更多
文摘By using a complex function method in this paper, the complex form of J-integral of mixed mode crack tip for unidirectional plate of linear-elastic orthotropic composites is obtained first by substituting crack tip stresses and displacements into general formula of J-integral. And then, the path-independence of this J-integral is proved. Finally, the computing formula of this J-integral is derived. As special examples, the complex forms, path-independence and computing formulae of J-integrals of mode I and mode II crack tips for unidirectional plate of linear-elastic orthotropic composites are given.
文摘Stress intensity factors for a three dimensional rectangular interfacial crack were considered using the body force method. In the numerical calculations, unknown body force densities were approximated by the products of the fundamental densities and power series; here the fundamental densities are chosen to express singular stress fields due to an interface crack exactly. The calculation shows that the numerical results are satisfied. The stress intensity factors for a rectangular interface crack were indicated accurately with the varying aspect ratio, and bimaterial parameter.
文摘The problem considered here is the response of a non-homogeneouscomposite material containing some cracks subjected to dynamicloading. It is assumed that the composite material is or- thotropicand all material properties depend only on the coordinate y (alongthe thickness direcion). In the analysis, the elastic region isdivided into a number of plies of infinite length. The materialproperties are taken to be constants for each ply. By utilizing theLaplace transform and Fourier transform technique, the generalsolutions for plies are derived.
基金Project supported by the National Natural Science Foundation of China(No.10661009)the Ningxia Natural Science Foundation(No.NZ0604).
文摘The problem of a periodic array of parallel cracks in a homogeneous piezoelectric strip bonded to a functionally graded piezoelectric material is investigated for inhomogeneous continuum. It is assumed that the material inhomogeneity is represented as the spatial variation of the shear modulus in the form of an exponential function along the direction of cracks. The mixed boundary value problem is reduced to a singular integral equation by applying the Fourier transform, and the singular integral equation is solved numerically by using the Gauss-Chebyshev integration technique. Numerical results are obtained to illustrate the variations of the stress intensity factors as a function of the crack periodicity for different values of the material inhomogeneity.
基金the BK 21 Program of South Korea and the National Natural Science Foundation of China(No.50574097).
文摘The problem considered is a mode Ⅲ crack lying parallel to the interface of an exponential-type functional graded material （FGM） strip bonded to a linear-type FGM substrate with infinite thickness. By applying the Fourier integral transform, the problem was reduced as a Cauchy singular integral equation with an unknown dislocation density function. The collocation method based on Chebyshev polynomials proposed by Erdogan and Gupta was used to solve the singular integral equation numerically. With the numerical solution, the effects of the geometrical and physical parameters on the stress intensity factor （SIF） were analyzed and the following conclusions were drawn： （a） The region affected by the interface or free surface varies with the material rigidity, and higher material rigidity will lead to bigger affected region. （b） The SIF of the crack in the affected region and parallel to the micro-discontinuous interface is lower than those of the weak discontinuous cases. Reducing the weak-discontinuity of the interface will be beneficial to decrease the SIF of the interface-parallel crack in the region affected by the interface. （c） The effect of the free surface on SIF is more remarkable than that of the interface, and the latter is still more notable than that of the material rigidity. When the effects of the interface and free surface are fixed, increase of the material rigidity will enhance the value of SIF.
基金the National Natural Science Foundation of China(No.10672027)the National Basic Research Program of China(No.2006CB601205)the National Science Fund for Distin-guished Young Scholars of China(No.50625414)
文摘This paper studies the dynamic stress intensity factor （DSIF） at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.
文摘The present work is concerned with the problem of mode Ⅲ crack perpendicular to the interface of a bi-strip composite. One of these strips is made of a functionally graded material and the other of an isotropic material, which contains an edge crack perpendicular to and terminating at the interface. Fourier transforms and asymptotic analysis are employed to reduce the problem to a singular integral equation which is numerically solved using Gauss-Chebyshev quadrature formulae. Furthermore, a parametric study is carried out to investigate the effects of elastic and geometric characteristics of the composite on the values of stress intensity factor.
基金Financial supports from the Outstanding Youth Cultivation Project of Ningxia Higher Education （NGY2017002）, the National Natural Science Foundation of China （11762016, 11762017）, the Natural Science Foundation of Ningxia （NZ17009） and Ningxia overseas study project are gratefully acknowledged.
文摘Multilayer thin-film thermoelectric materials are of technological importance. This paper describes a method to analyze the heat conduction in a multilayered thermoelectric plate containing some non-collinear cracks. The material properties in one layer may be different from those in another even though each layer may still be homogeneous. Using the Fourier integral transforms, the boundary value problem is reduced to a system of general singular integral equations. The model is sufficiently general to account for any number of layers and any number of cracks. As a numerical illustration, the electric flux intensity factor, energy flux intensity factor and thermal flux intensity factor for a three-layer plate specimen with two cracks are presented. The effects of strip width on the electric flux intensity factor and thermal flux intensity factor are studied.
文摘A multi-layered model for heat conduction analysis of a thermoelectric material strip(TEMs)with a Griffith crack under the electric flux and energy flux load has been developed.The materials parameters of the TEMs vary continuously in an arbitrary manner.To derive the solution,the TEMs is divided into several sub-layers with different material properties.The mixed boundary problem is reduced to a system of singular integral equations,which are solved numerically.The effect of strip width on the electric flux intensity factor and thermal flux intensity factor are studied.
基金Project supported by the Research Fund for Doctors of Hebei Province China (No. B2001213).
文摘The scattering of SH wave by a cylindrical piezoelectric inclusion partially debonded from its surrounding piezoelectric material is investigated using the wave function expansion method and singular integral equation technique. The debonding regions are modeled as mul- tiple arc-shaped interface cracks with non-contacting faces. By expressing the scattered ?elds as wave function expansions with unknown coe?cients, the mixed boundary value problem is ?rstly reduced to a set of simultaneous dual series equations. Then dislocation density functions are introduced as unknowns to transform these dual series equations into Cauchy singular integral equations of the ?rst type, which can be numerically solved easily. The solution is valid for arbi- trary number and size of the debonds. Finally, numerical results of the dynamic stress intensity factors are presented for the cases of one debond and two debonds. The e?ects of incidence direc- tion, crack con?guration and various material parameters on the dynamic stress intensity factors are respectively discussed. The solution of this problem is expected to ?nd applications in the investigation of dynamic fracture properties of piezoelectric materials with cracks.
