The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were ...The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.展开更多
Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different s...Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).展开更多
Copper/liquid microcapsule composite coatings with polyvinyl alcohol （PVA）, gelatin or methyl cellulose （MC） as shell materials were prepared by electrodeposition. The influence of shell materials on the corrosion...Copper/liquid microcapsule composite coatings with polyvinyl alcohol （PVA）, gelatin or methyl cellulose （MC） as shell materials were prepared by electrodeposition. The influence of shell materials on the corrosion resistance of the composite coatings in 0.1 M H2SO4 was investigated by means of electrochemical techniques, scanning electron microscopy （SEM）, and energy dispersion spectrometry （EDS）. The results show that the participation of microcapsules can enhance the corrosion resistance of the composite coatings compared with the traditional copper layer. Based on the analysis of electrochemical test results, the release ways of microcapsules were deduced. Gelatin and MC as the shell materials of microcapsules are easy to release quickly in the composite coating. On the contrary, the releasing speed of PVA microcapsules is relatively slow due to their characteristics.展开更多
The coating of Ni W P was deposited as base layer, and then the composite coating of Ni Ti(particles) Re(rare earth) was deposited subsequently on the surface of diamond using electroless plating by adding 2...The coating of Ni W P was deposited as base layer, and then the composite coating of Ni Ti(particles) Re(rare earth) was deposited subsequently on the surface of diamond using electroless plating by adding 2～3 μm Ti particles and trace rare earth salt to bath solution. Ti particles deposited on the surface of diamond were found by SEM and formation of TiC was verified by X ray diffraction analysis after heat treatment of the coatings in vacuum at 900 ℃. The binding strength between the coated diamond and the metal matrix was improved effectively in the diamond composite based on metal cement.展开更多
The wear behaviour of composite coatings is related to the nature of embedded particles.The effects of particle size on the wear behaviour of composite coatings are analyzed.Electroless nickel composite coatings conta...The wear behaviour of composite coatings is related to the nature of embedded particles.The effects of particle size on the wear behaviour of composite coatings are analyzed.Electroless nickel composite coatings containing diamond particles with the sizes in the range of 0—0.5,0.5—1,1—2μm are prepared.The surface morphology of diamond particles and composite coatings are observed by scanning electron microscopy(SEM).The wear tests of composite coatings are comparatively evaluated by sliding against a cemented tungsten carbide ball.The 3D morphology of worn scar is evaluated by using a 3Dprofiler.The results show that the hardness and wear resistance of composite coatings can increase with the increase of particle sizes.The mixture mechanism of adhesive wear and abrasive wear turn into single abrasive wear with the increase of particle sizes as well.The transformation of wear behaviour is mainly attributed to particle roles during wear process.展开更多
A specific revised HFCVD apparatus and a novel process combining HFCVD and polishing technique were presented to deposit the micro-and nano-crystalline multilayered ultra-smooth diamond（USCD） film on the interior-ho...A specific revised HFCVD apparatus and a novel process combining HFCVD and polishing technique were presented to deposit the micro-and nano-crystalline multilayered ultra-smooth diamond（USCD） film on the interior-hole surface of WC-Co drawing dies with aperture ranging from d1.0 mm to 60 mm.Characterization results indicate that the surface roughness values（Ra） in the entry zone,drawing zone and bearing zone of as-fabricated USCD coated drawing die were measured as low as 25.7,23.3 and 25.5 nm,respectively.Furthermore,the friction properties of USCD films were examined in both dry sliding and water-lubricating conditions,and the results show that the USCD film presents much superior friction properties.Its friction coefficients against ball-bearing steel,copper and silicon nitride balls（d4 mm）,is always lower than that of microcrystalline diamond（MCD） or WC-Co sample,regardless of the lubricating condition.Meanwhile,it still presents competitive wear resistance with the MCD films.Finally,the working lifetime and performance of as-fabricated USCD coated drawing dies were examined under producing low-carbon steel pipes in dry-sliding and water-lubricating conditions.Under the water-lubricating drawing condition,its production significantly increases by about 20 times compared with the conventional WC-Co drawing dies.展开更多
The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and...The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.展开更多
Copper coating was deposited on the surface of aluminum borate whisker by an electroless plating method.This method was used to modify the interfacial property of squeeze-casting aluminum borate whisker reinforced 606...Copper coating was deposited on the surface of aluminum borate whisker by an electroless plating method.This method was used to modify the interfacial property of squeeze-casting aluminum borate whisker reinforced 6061Al matrix composite.Interface observation indicates that the spinel reaction(MgAl2O4) is hindered by the copper coating,and the difference in interfacial reaction degree affects the tensile property and aging behavior of the composite.For the composite with less spinel reaction(MgAl2O4),its peak-aging process are postponed due to less depletion of magnesium.On the fracture surface of copper-coated composite dimples and fractures of whiskers are more,but on the fracture surface of uncoated composite pull-out of whiskers are more than that on the coated one.In uncoated composite the fracture generally originates from the near-interface-region.展开更多
A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix,and the Ti coated diamond particles rein...A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix,and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging.The surface structure of the Ti coated diamond particles was investigated by XRD and SEM.The interfacial characteristics and fracture surfaces were observed by SEM and EDS.The coefficient of thermal expansion(CTE)of 50%(volume fraction)Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO2 layer,and the inner TiC layer is very stable and cannot be removed during infiltration process.Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism,and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix.The measured low CTEs(5.07×10-6-9.27×10 -6K -1)of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.展开更多
Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal co...Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.展开更多
The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were ...The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were fabricated with melting aluminum at 700℃. The effect of the copper layer on the microstructure in the system was discussed. The results show that the copper layer has fully reacted with aluminum matrix, and the intermetallic compound CuAl2 forms through SEM observation and XRD, EDX analysis. The results of tensile tests indicate that composites fabricated using carbon fibers with 0.7-1.1μm copper coating perform best and the composites turn to more brittle as the thickness of copper coating increases. The fracture surface observation exhibits good interface bonding and ductility of the matrix alloy when the thickness of copper coating is about 0.7-1.1μm.展开更多
Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding ...Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.展开更多
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as ...Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.展开更多
Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient...Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.展开更多
Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper ...Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.展开更多
Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K f...Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.展开更多
Diamond has poor interface tolerance with Al.To enhance interface bonding,in this study,tungsten carbide(WC)nanocoatings on the surface of diamond particles were prepared using sol–gel and in-situ reaction methods.WO...Diamond has poor interface tolerance with Al.To enhance interface bonding,in this study,tungsten carbide(WC)nanocoatings on the surface of diamond particles were prepared using sol–gel and in-situ reaction methods.WO_(3) sol–gel with two concentrations,0.2 mol/L,and 0.5 mol/L,was,respectively,coated on diamond particles,then sintered at 1250℃for 2 h to produce WC nanocoatings.The concentration of 0.2 mol/L WO_(3) sol–gel was not enough to cover the surface of the diamond completely,while 0.5 mol/L WO_(3) sol–gel could fully cover it.Moreover,WO_(3) was preferentially deposited on{100}planes of the diamond.WO_(3) converted to WC in-situ nanocoatings after sintering due to the in-situ reaction of WO_(3) and diamond.The diamond-reinforced Al composites with and without WC coating were fabricated by powder metallurgy.The diamond/Al composite without coating has a thermal conductivity of 584.7 W/mK,while the composite with a coating formed by 0.2 mol/L and 0.5 mol/L WO_(3) sol–gel showed thermal conductivities of 626.1 W/mK and 584.2 W/mK,respectively.The moderate thickness of nanocoatings formed by 0.2 mol/L WO_(3) sol–gel could enhance interface bonding,therefore improving thermal conductivity.The nanocoating produced by 0.5 mol/L WO_(3) sol–gel cracked during the fabrication of the composite,leading to Al12W formation and a decrease in thermal conductivity.展开更多
Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electro- lyte-suspension co-deposition. After submicron diamonds were added to the electrolyte, the s...Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electro- lyte-suspension co-deposition. After submicron diamonds were added to the electrolyte, the shape of copper grains transformed from oval or round to polyhedron, the growth mode of copper grains transformed from columnar growth to gradual change in size, and the preferred ori- entation of copper grains transformed from （220） to （200）. Analyzing the variation of cathodic overpotential, it was found that the cathodic overpotential tended to remain tmchanged when copper plane （220） grew in the process of electrodepositing pure copper, while it tended to decrease with time when copper plane （200） grew in the process of co-deposition. It was inferred that copper plane （200） was propitious to the deposition of submicron diamonds.展开更多
Copper-coated aluminum wires exhibit good electrical conductivity, high thermal conductivity, low contact resistance of copper and low density, and provide economic advantages over aluminum. However, there are some pr...Copper-coated aluminum wires exhibit good electrical conductivity, high thermal conductivity, low contact resistance of copper and low density, and provide economic advantages over aluminum. However, there are some problems in the manufacring processes of hot-dip copper-coated aluminum wires, such as the difficulties in controlling coating process. In this work, the hot-dip copper-coating method of aluminum wires was investigated for producing copper-coated aluminum wire composites. The interface microstructure between the aluminum wire and the copper coating layer was analyzed by scanning electron microscopy （SEM） and energy-dispersive X-ray spec- trometry （EDS）. Five different fluxing agents were tested. Experimental results show that appropriate conditions for the hot-dip process are determined as the liquid copper temperature of 1085℃ and the treatment time less than 1 s. A success in hot-dip copper-coated aluminum wires is achieved by hot-dipping a low-melting-point metal into a high-melting-point metal liquid, which is significant for the further devel- opment and application of copper-coated aluminum wire composites.展开更多
The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism ...The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, and X-ray photoelectron spectra （XPS）. The particle coating thickness was measured using optical micro- graphs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of dia- mond surface metallization.展开更多
文摘The interfacial thermal conductance （ITC） and thermal conductivity （TC） of diamond/Al composites with various coatings were theoretically studied and discussed. A series of predictions and numerical analyses were performed to investigate the effect of thickness, sound velocity, and other parameters of coating layers on the ITC and TC. It is found that both the ITC and TC decline with increasing coating thickness, especially for the coatings with relatively low thermal conductivity. Nevertheless, if the coating thickness is close to zero, or quite a small value, the ITC and TC are mainly determined by the constants of the coating material. Under this condition, coatings such as Ni, TiC, Mo 2 C, SiC, and Si can significantly improve the ITC and TC of diamond/Al composites. By contrast, coatings like Ag will exert the negative effect. Taking the optimization of interfacial bonding into account, conductive carbides such as TiC or Mo 2 C with low thickness can be the most suitable coatings for diamond/Al composites.
基金supported by the National Natural Science Foundation of China(No.11802125)。
文摘Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).
基金supported by the National Natural Science Foundation of China (No. 50771010)
文摘Copper/liquid microcapsule composite coatings with polyvinyl alcohol （PVA）, gelatin or methyl cellulose （MC） as shell materials were prepared by electrodeposition. The influence of shell materials on the corrosion resistance of the composite coatings in 0.1 M H2SO4 was investigated by means of electrochemical techniques, scanning electron microscopy （SEM）, and energy dispersion spectrometry （EDS）. The results show that the participation of microcapsules can enhance the corrosion resistance of the composite coatings compared with the traditional copper layer. Based on the analysis of electrochemical test results, the release ways of microcapsules were deduced. Gelatin and MC as the shell materials of microcapsules are easy to release quickly in the composite coating. On the contrary, the releasing speed of PVA microcapsules is relatively slow due to their characteristics.
文摘The coating of Ni W P was deposited as base layer, and then the composite coating of Ni Ti(particles) Re(rare earth) was deposited subsequently on the surface of diamond using electroless plating by adding 2～3 μm Ti particles and trace rare earth salt to bath solution. Ti particles deposited on the surface of diamond were found by SEM and formation of TiC was verified by X ray diffraction analysis after heat treatment of the coatings in vacuum at 900 ℃. The binding strength between the coated diamond and the metal matrix was improved effectively in the diamond composite based on metal cement.
基金Supported by the National Natural Science Foundation of China(51175260)the Fundamental Research Funds for the Central Universities(NP2012506)the Open Fund of Jiangsu Province Key Laboratory for Materials Tribology(kjsmcx0901)
文摘The wear behaviour of composite coatings is related to the nature of embedded particles.The effects of particle size on the wear behaviour of composite coatings are analyzed.Electroless nickel composite coatings containing diamond particles with the sizes in the range of 0—0.5,0.5—1,1—2μm are prepared.The surface morphology of diamond particles and composite coatings are observed by scanning electron microscopy(SEM).The wear tests of composite coatings are comparatively evaluated by sliding against a cemented tungsten carbide ball.The 3D morphology of worn scar is evaluated by using a 3Dprofiler.The results show that the hardness and wear resistance of composite coatings can increase with the increase of particle sizes.The mixture mechanism of adhesive wear and abrasive wear turn into single abrasive wear with the increase of particle sizes as well.The transformation of wear behaviour is mainly attributed to particle roles during wear process.
基金Project(51005154) supported by the National Natural Science Foundation of ChinaProject(12CG11) supported by the Chenguang Program of Shanghai Municipal Education Commission,ChinaProject(201104271) supported by the China Postdoctoral Science Foundation Special Funded Project
文摘A specific revised HFCVD apparatus and a novel process combining HFCVD and polishing technique were presented to deposit the micro-and nano-crystalline multilayered ultra-smooth diamond（USCD） film on the interior-hole surface of WC-Co drawing dies with aperture ranging from d1.0 mm to 60 mm.Characterization results indicate that the surface roughness values（Ra） in the entry zone,drawing zone and bearing zone of as-fabricated USCD coated drawing die were measured as low as 25.7,23.3 and 25.5 nm,respectively.Furthermore,the friction properties of USCD films were examined in both dry sliding and water-lubricating conditions,and the results show that the USCD film presents much superior friction properties.Its friction coefficients against ball-bearing steel,copper and silicon nitride balls（d4 mm）,is always lower than that of microcrystalline diamond（MCD） or WC-Co sample,regardless of the lubricating condition.Meanwhile,it still presents competitive wear resistance with the MCD films.Finally,the working lifetime and performance of as-fabricated USCD coated drawing dies were examined under producing low-carbon steel pipes in dry-sliding and water-lubricating conditions.Under the water-lubricating drawing condition,its production significantly increases by about 20 times compared with the conventional WC-Co drawing dies.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.
文摘Copper coating was deposited on the surface of aluminum borate whisker by an electroless plating method.This method was used to modify the interfacial property of squeeze-casting aluminum borate whisker reinforced 6061Al matrix composite.Interface observation indicates that the spinel reaction(MgAl2O4) is hindered by the copper coating,and the difference in interfacial reaction degree affects the tensile property and aging behavior of the composite.For the composite with less spinel reaction(MgAl2O4),its peak-aging process are postponed due to less depletion of magnesium.On the fracture surface of copper-coated composite dimples and fractures of whiskers are more,but on the fracture surface of uncoated composite pull-out of whiskers are more than that on the coated one.In uncoated composite the fracture generally originates from the near-interface-region.
基金Project(60776019)supported by the National Natural Science Foundation of China
文摘A titanium coating fabricated via vacuum vapor deposition for diamond/Al composites was used to improve the interfacial bonding strength between diamond particles and Al matrix,and the Ti coated diamond particles reinforced Al matrix composites were prepared by gas pressure infiltration for electronic packaging.The surface structure of the Ti coated diamond particles was investigated by XRD and SEM.The interfacial characteristics and fracture surfaces were observed by SEM and EDS.The coefficient of thermal expansion(CTE)of 50%(volume fraction)Ti coated diamond particles reinforced Al matrix composites was measured. The Ti coating on diamond before infiltration consists of inner TiC layer and outer TiO2 layer,and the inner TiC layer is very stable and cannot be removed during infiltration process.Fractographs of the composites illustrate that aluminum matrix fracture is the dominant fracture mechanism,and the stepped breakage of a diamond particle indicates strong interfacial bonding between the Ti coated diamond particles and the Al matrix.The measured low CTEs(5.07×10-6-9.27×10 -6K -1)of the composites also show the strong interfacial bonding between the Ti coated diamond particles and the Al matrix.
基金financially supported by the National Natural Science Foundation of China (No. 51374028)
文摘Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.
基金Project(204AA335010) supported by the National High-Tech Research and Development Program of China
文摘The different copper coatings with thickness varying from 0.3μm to 1.5μm were deposited on carbon fibers using either electroless plating or electroplating method. The coated fibers were chopped and composites were fabricated with melting aluminum at 700℃. The effect of the copper layer on the microstructure in the system was discussed. The results show that the copper layer has fully reacted with aluminum matrix, and the intermetallic compound CuAl2 forms through SEM observation and XRD, EDX analysis. The results of tensile tests indicate that composites fabricated using carbon fibers with 0.7-1.1μm copper coating perform best and the composites turn to more brittle as the thickness of copper coating increases. The fracture surface observation exhibits good interface bonding and ductility of the matrix alloy when the thickness of copper coating is about 0.7-1.1μm.
基金supported by the National Natural Science Foundation of China (No.50971020) National High-Tech Research and Development Program of China (No.2008AA03Z505)
文摘Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature （HPHT） infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters （temperature, pressure, and time）. The improvement in interfacial bonding strength and the maximum thermM conductivity of 750 W/（m.K） were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.
基金supported by the National Natural Science Foundation of China (No. 50971020)the National High-Tech Research and Development Program of China (No. 2008AA03Z505)
文摘Diamond reinforced copper （Cu/diamond） composites were prepared by a pressure infilla＇ation technique. The composites show a super high conductivity of 713 W.m-1.K-1 in combination with an extremely low coefficient of thermal expansion （CTE） of 7.72 × 10-6 K-1 （25-100℃）, which are achieved by modifying the copper matrix with adding 0.3 wt.% of boron to get a good thermal contact between the matrix and the diamond particles. By adopting a series of postmachining techniques the composites were made into near-net-shape parts, and an electroless silver coating was also successfully plated on the composites. Finally, their potential applications in the thermal management of fight emitting diodes （LED） were illustrated via prototype examples.
文摘Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.
文摘Diamond particle dispersed copper (Cu) matrix composites were fabricated from the powder mixture composed of diamond, pure-Cu and boron (B) by spark plasma sintering (SPS). The composites were consolidated at 1173 K for 600 s by SPS. The reaction between the diamond particle and the Cu matrix in the composite was not confirmed by SEM observation and X-ray diffraction (XRD) analysis. The relative packing density of the Cu/diamond composites increased with B addition and attained 93.2% - 95.8% at the B content range between 1.8 vol.% and 13.8 vol.%. The thermal conductivity of the diamond-dispersed Cu composite drastically increased with B addition and reached the maximum value of 689 W/mK at 7.2 vol% B. Numerous transgranular fractures of diamond particles were observed on bending fracture surfaces of Cu-B/diamond composites. This indicates strong bonding between the diamond particle and the Cu matrix in the composite. The coefficient of thermal expansion of the composite falls in the upper line of Kerner’s model.
基金supported by the National Natural Science Foundation of China(No.51931009)the Liaoning Revitalization Talents Program(No.XLYC2007009).
文摘Diamond has poor interface tolerance with Al.To enhance interface bonding,in this study,tungsten carbide(WC)nanocoatings on the surface of diamond particles were prepared using sol–gel and in-situ reaction methods.WO_(3) sol–gel with two concentrations,0.2 mol/L,and 0.5 mol/L,was,respectively,coated on diamond particles,then sintered at 1250℃for 2 h to produce WC nanocoatings.The concentration of 0.2 mol/L WO_(3) sol–gel was not enough to cover the surface of the diamond completely,while 0.5 mol/L WO_(3) sol–gel could fully cover it.Moreover,WO_(3) was preferentially deposited on{100}planes of the diamond.WO_(3) converted to WC in-situ nanocoatings after sintering due to the in-situ reaction of WO_(3) and diamond.The diamond-reinforced Al composites with and without WC coating were fabricated by powder metallurgy.The diamond/Al composite without coating has a thermal conductivity of 584.7 W/mK,while the composite with a coating formed by 0.2 mol/L and 0.5 mol/L WO_(3) sol–gel showed thermal conductivities of 626.1 W/mK and 584.2 W/mK,respectively.The moderate thickness of nanocoatings formed by 0.2 mol/L WO_(3) sol–gel could enhance interface bonding,therefore improving thermal conductivity.The nanocoating produced by 0.5 mol/L WO_(3) sol–gel cracked during the fabrication of the composite,leading to Al12W formation and a decrease in thermal conductivity.
文摘Submicron diamonds were co-deposited on aluminum substrates with copper from the acid copper sulfate electrolyte by electro- lyte-suspension co-deposition. After submicron diamonds were added to the electrolyte, the shape of copper grains transformed from oval or round to polyhedron, the growth mode of copper grains transformed from columnar growth to gradual change in size, and the preferred ori- entation of copper grains transformed from （220） to （200）. Analyzing the variation of cathodic overpotential, it was found that the cathodic overpotential tended to remain tmchanged when copper plane （220） grew in the process of electrodepositing pure copper, while it tended to decrease with time when copper plane （200） grew in the process of co-deposition. It was inferred that copper plane （200） was propitious to the deposition of submicron diamonds.
基金financially supported by the Research Fund for the Doctoral Program of Higher Education of China(No.20100006120020)
文摘Copper-coated aluminum wires exhibit good electrical conductivity, high thermal conductivity, low contact resistance of copper and low density, and provide economic advantages over aluminum. However, there are some problems in the manufacring processes of hot-dip copper-coated aluminum wires, such as the difficulties in controlling coating process. In this work, the hot-dip copper-coating method of aluminum wires was investigated for producing copper-coated aluminum wire composites. The interface microstructure between the aluminum wire and the copper coating layer was analyzed by scanning electron microscopy （SEM） and energy-dispersive X-ray spec- trometry （EDS）. Five different fluxing agents were tested. Experimental results show that appropriate conditions for the hot-dip process are determined as the liquid copper temperature of 1085℃ and the treatment time less than 1 s. A success in hot-dip copper-coated aluminum wires is achieved by hot-dipping a low-melting-point metal into a high-melting-point metal liquid, which is significant for the further devel- opment and application of copper-coated aluminum wire composites.
文摘The electroless copper deposition on both pure and Cr-coated diamond particles was stud- ied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy （SEM）, energy dispersive spectroscopy （EDS）, X-ray diffraction （XRD）, and X-ray photoelectron spectra （XPS）. The particle coating thickness was measured using optical micro- graphs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of dia- mond surface metallization.
