We mainly consider a class of two dimensional normal type singular integral equations, the solutions as well as the conditions of solvability of which are obtained .The methods used consist of transferring them to sev...We mainly consider a class of two dimensional normal type singular integral equations, the solutions as well as the conditions of solvability of which are obtained .The methods used consist of transferring them to several one dimensional Riemann boundary value problems, and then solving the latter.展开更多
Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, fo...Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.展开更多
By using a reconstruction procedure of conservation laws of different models,the deformation algorithm proposed by Lou,Hao and Jia has been used to a new application such that a decoupled system becomes a coupled one....By using a reconstruction procedure of conservation laws of different models,the deformation algorithm proposed by Lou,Hao and Jia has been used to a new application such that a decoupled system becomes a coupled one.Using the new application to some decoupled systems such as the decoupled dispersionless Korteweg–de Vries(Kd V)systems related to dispersionless waves,the decoupled KdV systems related to dispersion waves,the decoupled KdV and Burgers systems related to the linear dispersion and diffusion effects,and the decoupled KdV and Harry–Dym(HD)systems related to the linear and nonlinear dispersion effects,we have obtained various new types of higher dimensional integrable coupled systems.The new models can be used to describe the interactions among different nonlinear waves and/or different effects including the dispersionless waves(dispersionless KdV waves),the linear dispersion waves(KdV waves),the nonlinear dispersion waves(HD waves)and the diffusion effect.The method can be applied to couple all different separated integrable models.展开更多
An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits（IC） in this paper.The method utilizes amplitude-only near-...An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits（IC） in this paper.The method utilizes amplitude-only near-field scanning data to reconstruct an equivalent magnetic dipole array,and the differential evolution optimization algorithm is proposed to extract the locations,orientation and moments of those dipoles.By importing the equivalent dipoles model into a 3D full-wave simulator together with the victim circuit model,the electromagnetic interference issues in mixed RF/digital systems can be well predicted.A commercial IC is used to validate the accuracy and efficiency of this proposed method.The coupled power at the victim antenna port calculated by the equivalent radiation source is compared with the measured data.Good consistency is obtained which confirms the validity and efficiency of the method.展开更多
文摘We mainly consider a class of two dimensional normal type singular integral equations, the solutions as well as the conditions of solvability of which are obtained .The methods used consist of transferring them to several one dimensional Riemann boundary value problems, and then solving the latter.
基金Sponsored by the National Natural Science Foundation of China(No.61271149)
文摘Many 3D IC applications such as MEMS and RF systems require Through-Silicon Via （TSV） with operations for high-speed vertical communication. In this paper, we introduce a novel air-gap coaxial TSV that is suiTab, for such RF applications. Firstly, the detailed fabrication process is described to explain how to acquire such a structure. Then, an Resistor Inductance Conductance Capacitance （RLGC） model is developed to profile the transverse electromagnetic field effect of the proposed air-gap TSV. The model is further verified by a 3D field solver program through the S-parameter comparison. With reference to the numerically simulated results, this analytical model delivers a maximum deviation of less than 6%0, on the conditions of varying diameters, outer to inner radius ratios, and SU-8 central angles, etc. Taking advantages of scalability of the model, a number of air-gap-based TSV designs are simulated, providing 1.6-4.0 times higher bandwidth than the con- ventional coaxial TSVs and leading to an efficient high frequency vertical RF interconnection solution for 3D ICs.
基金The National Natural Science Foundation(Nos.12235007,12090020,11975131,12090025)。
文摘By using a reconstruction procedure of conservation laws of different models,the deformation algorithm proposed by Lou,Hao and Jia has been used to a new application such that a decoupled system becomes a coupled one.Using the new application to some decoupled systems such as the decoupled dispersionless Korteweg–de Vries(Kd V)systems related to dispersionless waves,the decoupled KdV systems related to dispersion waves,the decoupled KdV and Burgers systems related to the linear dispersion and diffusion effects,and the decoupled KdV and Harry–Dym(HD)systems related to the linear and nonlinear dispersion effects,we have obtained various new types of higher dimensional integrable coupled systems.The new models can be used to describe the interactions among different nonlinear waves and/or different effects including the dispersionless waves(dispersionless KdV waves),the linear dispersion waves(KdV waves),the nonlinear dispersion waves(HD waves)and the diffusion effect.The method can be applied to couple all different separated integrable models.
基金supported by the National Nature Science Foundation of China(No.61274110)
文摘An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits（IC） in this paper.The method utilizes amplitude-only near-field scanning data to reconstruct an equivalent magnetic dipole array,and the differential evolution optimization algorithm is proposed to extract the locations,orientation and moments of those dipoles.By importing the equivalent dipoles model into a 3D full-wave simulator together with the victim circuit model,the electromagnetic interference issues in mixed RF/digital systems can be well predicted.A commercial IC is used to validate the accuracy and efficiency of this proposed method.The coupled power at the victim antenna port calculated by the equivalent radiation source is compared with the measured data.Good consistency is obtained which confirms the validity and efficiency of the method.
