The composition of magnesium alloys is greatly associated with initial deposition behavior of electroless Ni-P coatings.Thus,the initial deposition behavior of electroless Ni–P coatings on ZK60 and ME20 alloys was in...The composition of magnesium alloys is greatly associated with initial deposition behavior of electroless Ni-P coatings.Thus,the initial deposition behavior of electroless Ni–P coatings on ZK60 and ME20 alloys was investigated.The results indicated that differences in the alloy compositions significantly influenced the initial deposition process and the adhesive strength,corrosion resistance,and crystal structure.The initial deposition of coatings on ZK60 and ME20 alloys preferentially occurred on the precipitates.The precipitates in ZK60 alloy had higher chemical activity after HF activation and controlled the initial deposition rate of the coating.The initial deposition rate of the coating on ME20 alloy mainly depended on the density of the Mg F2 film formed by HF activation rather than on the precipitates.Owing to differences in the initial deposition process,the coating on ZK60 alloy had higher adhesive strength and better corrosion resistance than that on ME20 alloy.The coatings on ZK60 and ME20 alloys mainly had crystalline structures,and the coating on ME20 alloy had also a slight microcrystalline structure.展开更多
A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu ...A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters （bonding temperature and preheating time） were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni？P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.展开更多
文摘The composition of magnesium alloys is greatly associated with initial deposition behavior of electroless Ni-P coatings.Thus,the initial deposition behavior of electroless Ni–P coatings on ZK60 and ME20 alloys was investigated.The results indicated that differences in the alloy compositions significantly influenced the initial deposition process and the adhesive strength,corrosion resistance,and crystal structure.The initial deposition of coatings on ZK60 and ME20 alloys preferentially occurred on the precipitates.The precipitates in ZK60 alloy had higher chemical activity after HF activation and controlled the initial deposition rate of the coating.The initial deposition rate of the coating on ME20 alloy mainly depended on the density of the Mg F2 film formed by HF activation rather than on the precipitates.Owing to differences in the initial deposition process,the coating on ZK60 alloy had higher adhesive strength and better corrosion resistance than that on ME20 alloy.The coatings on ZK60 and ME20 alloys mainly had crystalline structures,and the coating on ME20 alloy had also a slight microcrystalline structure.
基金Project(51571080)supported by the National Natural Science Foundation of China
文摘A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid？liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters （bonding temperature and preheating time） were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni？P interlayer functioned as a diffusion barrier and protective film which effectively reduced the formation of intermetallics. The shear strength and conductivity of Al/Cu bimetal were reduced by increasing the thickness of intermetallics. In particular, the detrimental effect of Al2Cu phase was more obvious compared with the others. The sample preheated at 780 ℃ for 150 s exhibited the maximum shear strength and conductivity of 49.8 MPa and 5.29×10^5 S/cm, respectively.
