In this paper, we explore the electrical characteristics of high-electron-mobility transistors(HEMTs) using a TaN/AlGaN/GaN metal insulating semiconductor(MIS) structure. The high-resistance tantalum nitride(TaN) film...In this paper, we explore the electrical characteristics of high-electron-mobility transistors(HEMTs) using a TaN/AlGaN/GaN metal insulating semiconductor(MIS) structure. The high-resistance tantalum nitride(TaN) film prepared by magnetron sputtering as the gate dielectric layer of the device achieved an effective reduction of electronic states at the TaN/AlGaN interface, and reducing the gate leakage current of the MIS HEMT, its performance was enhanced. The HEMT exhibited a low gate leakage current of 2.15 × 10^(-7) mA/mm and a breakdown voltage of 1180 V. Furthermore, the MIS HEMT displayed exceptional operational stability during dynamic tests, with dynamic resistance remaining only 1.39 times even under 400 V stress.展开更多
In this letter,high power density AlGaN/GaN high electron-mobility transistors(HEMTs)on a freestanding GaN substrate are reported.An asymmetricΓ-shaped 500-nm gate with a field plate of 650 nm is introduced to improv...In this letter,high power density AlGaN/GaN high electron-mobility transistors(HEMTs)on a freestanding GaN substrate are reported.An asymmetricΓ-shaped 500-nm gate with a field plate of 650 nm is introduced to improve microwave power performance.The breakdown voltage(BV)is increased to more than 200 V for the fabricated device with gate-to-source and gate-to-drain distances of 1.08 and 2.92μm.A record continuous-wave power density of 11.2 W/mm@10 GHz is realized with a drain bias of 70 V.The maximum oscillation frequency(f_(max))and unity current gain cut-off frequency(f_(t))of the AlGaN/GaN HEMTs exceed 30 and 20 GHz,respectively.The results demonstrate the potential of AlGaN/GaN HEMTs on freestanding GaN substrates for microwave power applications.展开更多
In this study, the effects of 1 MeV electron radiation on the D-mode GaN-based high electron mobility transistors(HEMTs) were investigated after different radiation doses. The changes in electrical properties of the d...In this study, the effects of 1 MeV electron radiation on the D-mode GaN-based high electron mobility transistors(HEMTs) were investigated after different radiation doses. The changes in electrical properties of the device were obtained, and the related physical mechanisms were analyzed. It indicated that under the radiation dose of 5 × 10^(14) cm^(-2), the channel current cannot be completely pinched off even if the negative gate voltage was lower than the threshold voltage, and the gate leakage current increased significantly. The emission microscopy and scanning electron microscopy were used to determine the damage location. Besides, the radiation dose was adjusted ranging from 5 × 10^(12) to 1 × 10^(14) cm^(-2), and we noticed that the drain-source current increased and the threshold voltage presented slightly negative shift. By calculations, it suggested that the carrier density and electron mobility gradually increased. It provided a reference for the development of device radiation reinforcement technology.展开更多
氮化镓功率器件凭借优异性能被抗辐照应用领域重点关注,为探究氮化镓功率器件抗γ射线辐照损伤能力,明确其辐射效应退化机制,针对增强型AlGaN/GaN高电子迁移率晶体管(High Electron Mobility Transistor,HEMT)器件开展不同偏置(开态、...氮化镓功率器件凭借优异性能被抗辐照应用领域重点关注,为探究氮化镓功率器件抗γ射线辐照损伤能力,明确其辐射效应退化机制,针对增强型AlGaN/GaN高电子迁移率晶体管(High Electron Mobility Transistor,HEMT)器件开展不同偏置(开态、关态和零偏置)条件下的γ射线辐照与不同温度的退火试验,分析器件电学性能同偏置条件和退火环境之间的响应规律。结果表明:随着γ射线辐照剂量的增加,器件阈值电压负漂,跨导峰值、饱和漏电流和反向栅泄漏电流逐渐增加,且在开态偏置条件下器件的电学特性退化更加严重;此外,高温环境下退火会导致器件的电学性能恢复更加明显。分析认为γ射线辐照剂量越高,产生的辐照缺陷越多,同时栅极偏压会降低辐照引发的电子-空穴对的初始复合率,逃脱初始复合的空穴数量增多,进一步增加了缺陷电荷的浓度;而高温环境会导致器件发生隧穿退火或热激发退火,有助于器件性能恢复。氮化镓功率器件的辐照损伤过程及机理研究,为其空间环境应用的评估验证提供了数据支撑。展开更多
A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN channel high-electron-mobility-transistors(HEMTs).For GaN channel HEMTs with gate-drain spacing LGD=2.5μm,the brea...A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN channel high-electron-mobility-transistors(HEMTs).For GaN channel HEMTs with gate-drain spacing LGD=2.5μm,the breakdown voltage VBR increases from 518 V to 582 V by increasing gate metal height h from 0.2μm to 0.4μm.For GaN channel HEMTs with LGD=7μm,VBR increases from 953 V to 1310 V by increasing h from 0.8μm to 1.6μm.The breakdown voltage enhancement results from the increase of the gate sidewall capacitance and depletion region extension.For Al0.4Ga0.6N channel HEMT with LGD=7μm,VBR increases from 1535 V to 1763 V by increasing h from 0.8μm to 1.6μm,resulting in a high average breakdown electric field of 2.51 MV/cm.Simulation and analysis indicate that the high gate metal height is an effective method to enhance breakdown voltage in GaN-based HEMTs,and this method can be utilized in all the lateral semiconductor devices.展开更多
A novel groove-type channel enhancement-mode AlGaN/GaN MIS high electron mobility transistor（GTCE-HEMT）with a combined polar and nonpolar AlGaN/GaN heterostucture is presented. The device simulation shows a threshol...A novel groove-type channel enhancement-mode AlGaN/GaN MIS high electron mobility transistor（GTCE-HEMT）with a combined polar and nonpolar AlGaN/GaN heterostucture is presented. The device simulation shows a threshold voltage of 1.24 V, peak transconductance of 182 m S/mm, and subthreshold slope of 85 m V/dec, which are obtained by adjusting the device parameters. Interestingly, it is possible to control the threshold voltage accurately without precisely controlling the etching depth in fabrication by adopting this structure. Besides, the breakdown voltage（VB） is significantly increased by 78% in comparison with the value of the conventional MIS-HEMT. Moreover, the fabrication process of the novel device is entirely compatible with that of the conventional depletion-mode（D-mode） polar AlGaN/GaN HEMT. It presents a promising way to realize the switch application and the E/D-mode logic circuits.展开更多
增强型氮化镓(GaN)基高电子迁移率晶体管(high electron mobility transistor,HEMT)是高频高功率器件与开关器件领域的研究热点,P-GaN栅技术因具备制备工艺简单、可控且工艺重复性好等优势而成为目前最常用且唯一实现商用的GaN基增强型...增强型氮化镓(GaN)基高电子迁移率晶体管(high electron mobility transistor,HEMT)是高频高功率器件与开关器件领域的研究热点,P-GaN栅技术因具备制备工艺简单、可控且工艺重复性好等优势而成为目前最常用且唯一实现商用的GaN基增强型器件制备方法。首先,概述了当前制约P-GaN栅结构GaN基HEMT器件发展的首要问题,从器件结构与器件制备工艺这2个角度,综述了其性能优化举措方面的最新研究进展。然后,通过对研究进展的分析,总结了当前研究工作面临的挑战以及解决方法。最后,对未来的发展前景、发展方向进行了展望。展开更多
基金supported by the National Natural Science Foundation of China(Grant No.1237310)The Youth Innovation Promotion Association of the Chinese Academy of Sciences(Grant No.2020321)+1 种基金the National Natural Science Foundation of China(Grant No.92163204)The Key Research and Development Program of Jiangsu Province(Grant No.BE2022057-1)。
文摘In this paper, we explore the electrical characteristics of high-electron-mobility transistors(HEMTs) using a TaN/AlGaN/GaN metal insulating semiconductor(MIS) structure. The high-resistance tantalum nitride(TaN) film prepared by magnetron sputtering as the gate dielectric layer of the device achieved an effective reduction of electronic states at the TaN/AlGaN interface, and reducing the gate leakage current of the MIS HEMT, its performance was enhanced. The HEMT exhibited a low gate leakage current of 2.15 × 10^(-7) mA/mm and a breakdown voltage of 1180 V. Furthermore, the MIS HEMT displayed exceptional operational stability during dynamic tests, with dynamic resistance remaining only 1.39 times even under 400 V stress.
文摘In this letter,high power density AlGaN/GaN high electron-mobility transistors(HEMTs)on a freestanding GaN substrate are reported.An asymmetricΓ-shaped 500-nm gate with a field plate of 650 nm is introduced to improve microwave power performance.The breakdown voltage(BV)is increased to more than 200 V for the fabricated device with gate-to-source and gate-to-drain distances of 1.08 and 2.92μm.A record continuous-wave power density of 11.2 W/mm@10 GHz is realized with a drain bias of 70 V.The maximum oscillation frequency(f_(max))and unity current gain cut-off frequency(f_(t))of the AlGaN/GaN HEMTs exceed 30 and 20 GHz,respectively.The results demonstrate the potential of AlGaN/GaN HEMTs on freestanding GaN substrates for microwave power applications.
基金supported by the Key Program of the National Natural Science Foundation of China (Grant No. 62334002)the National Natural Science Foundation of China (Grant No. 62174008)。
文摘In this study, the effects of 1 MeV electron radiation on the D-mode GaN-based high electron mobility transistors(HEMTs) were investigated after different radiation doses. The changes in electrical properties of the device were obtained, and the related physical mechanisms were analyzed. It indicated that under the radiation dose of 5 × 10^(14) cm^(-2), the channel current cannot be completely pinched off even if the negative gate voltage was lower than the threshold voltage, and the gate leakage current increased significantly. The emission microscopy and scanning electron microscopy were used to determine the damage location. Besides, the radiation dose was adjusted ranging from 5 × 10^(12) to 1 × 10^(14) cm^(-2), and we noticed that the drain-source current increased and the threshold voltage presented slightly negative shift. By calculations, it suggested that the carrier density and electron mobility gradually increased. It provided a reference for the development of device radiation reinforcement technology.
文摘氮化镓功率器件凭借优异性能被抗辐照应用领域重点关注,为探究氮化镓功率器件抗γ射线辐照损伤能力,明确其辐射效应退化机制,针对增强型AlGaN/GaN高电子迁移率晶体管(High Electron Mobility Transistor,HEMT)器件开展不同偏置(开态、关态和零偏置)条件下的γ射线辐照与不同温度的退火试验,分析器件电学性能同偏置条件和退火环境之间的响应规律。结果表明:随着γ射线辐照剂量的增加,器件阈值电压负漂,跨导峰值、饱和漏电流和反向栅泄漏电流逐渐增加,且在开态偏置条件下器件的电学特性退化更加严重;此外,高温环境下退火会导致器件的电学性能恢复更加明显。分析认为γ射线辐照剂量越高,产生的辐照缺陷越多,同时栅极偏压会降低辐照引发的电子-空穴对的初始复合率,逃脱初始复合的空穴数量增多,进一步增加了缺陷电荷的浓度;而高温环境会导致器件发生隧穿退火或热激发退火,有助于器件性能恢复。氮化镓功率器件的辐照损伤过程及机理研究,为其空间环境应用的评估验证提供了数据支撑。
文摘本文对金属有机物化学气相淀积法在4英寸GaN衬底上生长出的高质量AlGaN/GaN HEMT外延材料进行了研究分析。生长过程采用NH_(3)/H_(2)混合气体及H_(2)交替通入的方法对衬底表面进行了预处理,阻隔了界面杂质的扩散。得益于衬底与外延的高度晶格匹配,GaN材料的螺位错密度降低到1.4×10^(7)cm^(-2),刃位错密度降低到3.0×10^(6)cm^(-2);非接触霍尔测试仪结果显示二维电子气迁移率为2159 cm^(2)/V·s,说明制备的材料晶体质量高且电学性能优异。此外,由于衬底与外延之间不存在热失配,使用拉曼光谱仪发现同质外延的Ga N E2(TO)峰位与衬底的E2(TO)峰位完全重合,表明同质外延过程中无应力应变产生。
基金Project supported by the National Key Science&Technology Special Project of China(Grant No.2017ZX01001301)the National Key Research and Development Program of China(Grant No.2016YFB0400100)the National Natural Science Foundation of China(Grant Nos.51777168 and 61801374).
文摘A large gate metal height technique is proposed to enhance breakdown voltage in GaN channel and AlGaN channel high-electron-mobility-transistors(HEMTs).For GaN channel HEMTs with gate-drain spacing LGD=2.5μm,the breakdown voltage VBR increases from 518 V to 582 V by increasing gate metal height h from 0.2μm to 0.4μm.For GaN channel HEMTs with LGD=7μm,VBR increases from 953 V to 1310 V by increasing h from 0.8μm to 1.6μm.The breakdown voltage enhancement results from the increase of the gate sidewall capacitance and depletion region extension.For Al0.4Ga0.6N channel HEMT with LGD=7μm,VBR increases from 1535 V to 1763 V by increasing h from 0.8μm to 1.6μm,resulting in a high average breakdown electric field of 2.51 MV/cm.Simulation and analysis indicate that the high gate metal height is an effective method to enhance breakdown voltage in GaN-based HEMTs,and this method can be utilized in all the lateral semiconductor devices.
基金supported by the National Science and Technology Major Project,China(Grant No.2013ZX02308-002)the National Natural Science Foundation of China(Grant Nos.11435010,61474086,and 61404099)
文摘A novel groove-type channel enhancement-mode AlGaN/GaN MIS high electron mobility transistor（GTCE-HEMT）with a combined polar and nonpolar AlGaN/GaN heterostucture is presented. The device simulation shows a threshold voltage of 1.24 V, peak transconductance of 182 m S/mm, and subthreshold slope of 85 m V/dec, which are obtained by adjusting the device parameters. Interestingly, it is possible to control the threshold voltage accurately without precisely controlling the etching depth in fabrication by adopting this structure. Besides, the breakdown voltage（VB） is significantly increased by 78% in comparison with the value of the conventional MIS-HEMT. Moreover, the fabrication process of the novel device is entirely compatible with that of the conventional depletion-mode（D-mode） polar AlGaN/GaN HEMT. It presents a promising way to realize the switch application and the E/D-mode logic circuits.
文摘增强型氮化镓(GaN)基高电子迁移率晶体管(high electron mobility transistor,HEMT)是高频高功率器件与开关器件领域的研究热点,P-GaN栅技术因具备制备工艺简单、可控且工艺重复性好等优势而成为目前最常用且唯一实现商用的GaN基增强型器件制备方法。首先,概述了当前制约P-GaN栅结构GaN基HEMT器件发展的首要问题,从器件结构与器件制备工艺这2个角度,综述了其性能优化举措方面的最新研究进展。然后,通过对研究进展的分析,总结了当前研究工作面临的挑战以及解决方法。最后,对未来的发展前景、发展方向进行了展望。
