The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The t...The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The thermal vias are regarded as a promising method to improve the temperature performance of VLSI circuits. In this paper, the extra thermal vias were used to decrease the delay and power dissipation of interconnect wires of VLSI circuits. Two analytical models were presented for interconnect temperature, delay and power dissipation with adding extra dummy thermal vias. The influence of the number of thermal vias on the delay and power dissipation of interconnect wires was analyzed and the optimal via separation distance was investigated. The experimental results show that the adding extra dummy thermal vias can reduce the interconnect average temperature, maximum temperature, delay and power dissipation. Moreover, this method is also suitable for clock signal wires with a large root mean square current.展开更多
The state-of-the-art multi-core computer systems are based on Very Large Scale three Dimensional (3D) Integrated circuits (VLSI). In order to provide high-speed vertical data transmission in such 3D systems, efficient...The state-of-the-art multi-core computer systems are based on Very Large Scale three Dimensional (3D) Integrated circuits (VLSI). In order to provide high-speed vertical data transmission in such 3D systems, efficient Through-Silicon Via (TSV) technology is critically important. In this paper, various Radio Frequency (RF) TSV designs and models are proposed. Specifically, the Cu-plug TSV with surrounding ground TSVs is used as the baseline structure. For further improvement, the dielectric coaxial and novel air-gap coaxial TSVs are introduced. Using the empirical parameters of these coaxial TSVs, the simulation results are obtained demonstrating that these coaxial RF-TSVs can provide two-order higher of cut-off frequencies than the Cu-plug TSVs. Based on these new RF-TSV technologies, we propose a novel 3D multi-core computer system as well as new architectures for manipulating the interfaces between RF and baseband circuit. Taking into consideration the scaling down of IC manufacture technologies, predictions for the performance of future generations of circuits are made. With simulation results indicating energy per bit and area per bit being reduced by 7% and 11% respectively, we can conclude that the proposed method is a worthwhile guideline for the design of future multi-core computer ICs.展开更多
The design of space-efficient support hardware for built-in self-testing is of great significance in very large scale integration circuits and systems, particularly in view of the paradigm shift in recent times from s...The design of space-efficient support hardware for built-in self-testing is of great significance in very large scale integration circuits and systems, particularly in view of the paradigm shift in recent times from system-on-board to system-on-chip technology. The subject paper proposes a new approach to designing aliasing-free or zero-aliasing space compaction hardware targeting specifically embedded cores-based system-on-chips for single stuck-line faults extending well-known concept from conventional switching theory, viz. that of compatibility relation as used in the minimization of incomplete sequential machines. For a pair of response outputs of the circuit under test, the method introduces the notion of fault detection compatibility and conditional fault detection compatibility （conditional upon some other response output pair being simultaneously fault detection compatible） with respect to two-input XOR/XNOR logic. The process is illustrated with design details of space compressors for the International Symposium on Circuits and Systems or ISCAS 85 combinational and ISCAS 89 full-scan sequential benchmark circuits using simulation programs ATALANTA and FSIM, attesting to the usefulness of the technique for its relative simplicity, resultant low area overhead and full fault coverage for single stuck-line faults, thus making it suitable in commercial design environments.展开更多
This paper proposes a low-power MOS current mode logic （MCML） circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to high-threshold voltage transistor to minimize the leakage cu...This paper proposes a low-power MOS current mode logic （MCML） circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to high-threshold voltage transistor to minimize the leakage current. The 16× 16 bit parallel multiplier is designed with the proposed technology. Comparing with the previous MCML circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/258. This circuit is designed with Samsung 0.35 um complementary metal oxide semiconductor （CMOS） process. The validity and effectiveness are verified through the HSPICE simulation.展开更多
Triple-threshold CMOS technique provides the transistors that have low-, normal-, and high-threshold voltage. This paper describes a low-power carry look-ahead adder with triple-threshold CMOS technique. While the low...Triple-threshold CMOS technique provides the transistors that have low-, normal-, and high-threshold voltage. This paper describes a low-power carry look-ahead adder with triple-threshold CMOS technique. While the low-threshold voltage transistors are used to reduce the propagation delay time in the critical path, the high-threshold voltage transistors are used to reduce the power consumption in the shortest path. Comparing with the conventional CMOS circuit, the circuit is achieved to reduce the power consumption by 14.71% and the power-delay-product by 16.11%. This circuit is designed with Samsung 0.35 um CMOS process. The validity and effectiveness are verified through the HSPICE simulation.展开更多
基金Supported by the Guangdong Provincial Natural Science Foundation of China(2014A030313441)the Guangzhou Science and Technology Project(201510010169)+1 种基金the Guangdong Province Science and Technology Project(2016B090918071,2014A040401076)the National Natural Science Foundation of China(61072028)
文摘The interconnect temperature of very large scale integration（VLSI） circuits keeps rising due to self-heating and substrate temperature, which can increase the delay and power dissipation of interconnect wires. The thermal vias are regarded as a promising method to improve the temperature performance of VLSI circuits. In this paper, the extra thermal vias were used to decrease the delay and power dissipation of interconnect wires of VLSI circuits. Two analytical models were presented for interconnect temperature, delay and power dissipation with adding extra dummy thermal vias. The influence of the number of thermal vias on the delay and power dissipation of interconnect wires was analyzed and the optimal via separation distance was investigated. The experimental results show that the adding extra dummy thermal vias can reduce the interconnect average temperature, maximum temperature, delay and power dissipation. Moreover, this method is also suitable for clock signal wires with a large root mean square current.
文摘The state-of-the-art multi-core computer systems are based on Very Large Scale three Dimensional (3D) Integrated circuits (VLSI). In order to provide high-speed vertical data transmission in such 3D systems, efficient Through-Silicon Via (TSV) technology is critically important. In this paper, various Radio Frequency (RF) TSV designs and models are proposed. Specifically, the Cu-plug TSV with surrounding ground TSVs is used as the baseline structure. For further improvement, the dielectric coaxial and novel air-gap coaxial TSVs are introduced. Using the empirical parameters of these coaxial TSVs, the simulation results are obtained demonstrating that these coaxial RF-TSVs can provide two-order higher of cut-off frequencies than the Cu-plug TSVs. Based on these new RF-TSV technologies, we propose a novel 3D multi-core computer system as well as new architectures for manipulating the interfaces between RF and baseband circuit. Taking into consideration the scaling down of IC manufacture technologies, predictions for the performance of future generations of circuits are made. With simulation results indicating energy per bit and area per bit being reduced by 7% and 11% respectively, we can conclude that the proposed method is a worthwhile guideline for the design of future multi-core computer ICs.
文摘The design of space-efficient support hardware for built-in self-testing is of great significance in very large scale integration circuits and systems, particularly in view of the paradigm shift in recent times from system-on-board to system-on-chip technology. The subject paper proposes a new approach to designing aliasing-free or zero-aliasing space compaction hardware targeting specifically embedded cores-based system-on-chips for single stuck-line faults extending well-known concept from conventional switching theory, viz. that of compatibility relation as used in the minimization of incomplete sequential machines. For a pair of response outputs of the circuit under test, the method introduces the notion of fault detection compatibility and conditional fault detection compatibility （conditional upon some other response output pair being simultaneously fault detection compatible） with respect to two-input XOR/XNOR logic. The process is illustrated with design details of space compressors for the International Symposium on Circuits and Systems or ISCAS 85 combinational and ISCAS 89 full-scan sequential benchmark circuits using simulation programs ATALANTA and FSIM, attesting to the usefulness of the technique for its relative simplicity, resultant low area overhead and full fault coverage for single stuck-line faults, thus making it suitable in commercial design environments.
文摘This paper proposes a low-power MOS current mode logic （MCML） circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to high-threshold voltage transistor to minimize the leakage current. The 16× 16 bit parallel multiplier is designed with the proposed technology. Comparing with the previous MCML circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/258. This circuit is designed with Samsung 0.35 um complementary metal oxide semiconductor （CMOS） process. The validity and effectiveness are verified through the HSPICE simulation.
文摘Triple-threshold CMOS technique provides the transistors that have low-, normal-, and high-threshold voltage. This paper describes a low-power carry look-ahead adder with triple-threshold CMOS technique. While the low-threshold voltage transistors are used to reduce the propagation delay time in the critical path, the high-threshold voltage transistors are used to reduce the power consumption in the shortest path. Comparing with the conventional CMOS circuit, the circuit is achieved to reduce the power consumption by 14.71% and the power-delay-product by 16.11%. This circuit is designed with Samsung 0.35 um CMOS process. The validity and effectiveness are verified through the HSPICE simulation.
