The emerging technique of carbonization of polyimide(PI)by direct laser writing receives great attention for its flexibility,versatility,and ease-of-patterning capability in creating a variety of functional laser-indu...The emerging technique of carbonization of polyimide(PI)by direct laser writing receives great attention for its flexibility,versatility,and ease-of-patterning capability in creating a variety of functional laser-induced graphene(LIG)sensors and devices.LIG prepared by CO_(2) laser irradiating of the PI film is characterized by scanning electron microscopy(SEM),X-ray diffraction(XRD),transmission electron microscope(TEM),specific surface area analyzer,synchronous thermal analysis,and Raman spectroscopy with the focus on investigating the effects of laser parameters(e.g.,power,scanning speed)on the microstructure,thickness,and sheet resistance of LIG.Both TEM and XRD indicate that LIG is composed of many graphene layers with a layer spacing of 0.34 nm.The specific surface area of LIG decreases with the increase of laser power.The ratio of the thickness of LIG over the depth of the carbonized PI film as the expansion ratio characterizes the expansibility of LIG.The influence of image resolution and off-focus value on the sheet resistance of LIG is explained by the superposition mechanism of laser scanning spots.展开更多
A data-driven approach combining together the experimental laser soldering,finite element analysis and machine learning,has been utilized to predict the morphology of interracial intermetallic compound(IMC) in Sn-xAg-...A data-driven approach combining together the experimental laser soldering,finite element analysis and machine learning,has been utilized to predict the morphology of interracial intermetallic compound(IMC) in Sn-xAg-yCu/Cu(SAC/Cu) system.Six types of SAC solders with varying weight proportion of Ag and Cu,have been processed with fiber laser at different magnitudes of power(30-50 W) and scan speed(10-240 mm/min),and the resultant IMC morphologies characterized through scanning electron microscope are categorized as prismatic and scalloped ones.For the different alloy composition and laser parameters,finite element method(FEM) is employed to compute the transient distribution of temperature at the interface of solder and substrates.The FEM-generated datasets are supplied to a neural network that predicts the IMC morphology through the quantified values of temperature dependent Jackson parameter(αJ).The numerical value of αJ predicted from neural network is validated with experimental IMC morphologies.The critical scan speed for the morphology transition between prismatic and scalloped IMC is estimated for each solder composition at a given power.Sn-0.7 Cu having the largest critical scan speed at 30 W and Sn-3.5 Ag alloy having the largest critical scan speed at input power values of 40 W and 50 W,thus possessing the greatest likelihood of forming prismatic interfacial IMC during laser soldering,can be inferred as most suitable SAC solders in applications exposed to shear loads.展开更多
基金supported by the National Natural Science Foundation of China(Grant No.51705082)the State Key Laboratory of Digital Manufacturing Equipment and Technology+4 种基金Huazhong University of Science and Technology(Grant No.DMETKF2021013)the supports provided by the National Science Foundation(NSF)(Grant No.ECCS-1993072)the American Chemical Society Petroleum Research Fund(59021-DNI7)the National Heart,Lung,and Blood Institute of the National Institutes of Health(Grant No.R61HL154215)Penn State University。
文摘The emerging technique of carbonization of polyimide(PI)by direct laser writing receives great attention for its flexibility,versatility,and ease-of-patterning capability in creating a variety of functional laser-induced graphene(LIG)sensors and devices.LIG prepared by CO_(2) laser irradiating of the PI film is characterized by scanning electron microscopy(SEM),X-ray diffraction(XRD),transmission electron microscope(TEM),specific surface area analyzer,synchronous thermal analysis,and Raman spectroscopy with the focus on investigating the effects of laser parameters(e.g.,power,scanning speed)on the microstructure,thickness,and sheet resistance of LIG.Both TEM and XRD indicate that LIG is composed of many graphene layers with a layer spacing of 0.34 nm.The specific surface area of LIG decreases with the increase of laser power.The ratio of the thickness of LIG over the depth of the carbonized PI film as the expansion ratio characterizes the expansibility of LIG.The influence of image resolution and off-focus value on the sheet resistance of LIG is explained by the superposition mechanism of laser scanning spots.
基金supported financially by the China Postdoctoral Science Foundation (No. 2017M611215)Research Fund for International Young Scientistsfif the National Natural Science Foundation of China (No. 51750110504)National Natural Science Foundation of China (No. 51871040)。
文摘A data-driven approach combining together the experimental laser soldering,finite element analysis and machine learning,has been utilized to predict the morphology of interracial intermetallic compound(IMC) in Sn-xAg-yCu/Cu(SAC/Cu) system.Six types of SAC solders with varying weight proportion of Ag and Cu,have been processed with fiber laser at different magnitudes of power(30-50 W) and scan speed(10-240 mm/min),and the resultant IMC morphologies characterized through scanning electron microscope are categorized as prismatic and scalloped ones.For the different alloy composition and laser parameters,finite element method(FEM) is employed to compute the transient distribution of temperature at the interface of solder and substrates.The FEM-generated datasets are supplied to a neural network that predicts the IMC morphology through the quantified values of temperature dependent Jackson parameter(αJ).The numerical value of αJ predicted from neural network is validated with experimental IMC morphologies.The critical scan speed for the morphology transition between prismatic and scalloped IMC is estimated for each solder composition at a given power.Sn-0.7 Cu having the largest critical scan speed at 30 W and Sn-3.5 Ag alloy having the largest critical scan speed at input power values of 40 W and 50 W,thus possessing the greatest likelihood of forming prismatic interfacial IMC during laser soldering,can be inferred as most suitable SAC solders in applications exposed to shear loads.
